Yamaichi Electronics Co., Ltd.

Kenji Ichihara

Yuji Nakamura

Katsumi Suzuki

Ryo Ujike

Kazunori Nakano

Azusa Shiratori

A female side connector for high current includes at least one contact unit including a contact, a contact support section, and a connection terminal: and a connector housing for placing the contact support section. The contact is provided by superposing a plurality of L-shaped and thin plate-like contact elements in the plate thickness direction, the contact element has a rectangular base end and a pair of elastically deformable arms that extend from the upper part of the rectangular base end and that respectively have opposing contact points at the neighborhood of the tip end. The contact support section supports the contact. The connection terminal is integrated with the contact support section and electrically contacts with outside. The contact is provided such that at least two or more contact elements having respectively different distances from the arm tip end to the contact point are superposed in the plate thickness direction.

Female side connector for high current

A tip end of a stationary terminal section of a contact pin is inserted via a hole of a contact pin supporting plate into a common gap formed by holes, and held there the holes of the first position-restricting plate and the holes of the second position-restricting plate may be slid away from each other in a common plane to grip the end of the stationary terminal section of the contact terminal by the peripheral edges of the holes; the stationary terminal section of the contact terminal may have an engaging portion to be engageable with an open end peripheral edge of the hole in the first position-restricting plate.

Method for assembling semiconductor device socket

A plurality of contact terminals include movable contact portions disposed slantingly oppositely to each other, and the movable contact portion of the contact terminal is disposed movably up to the neighborhood of a position adjacent to the movable contact portion of the adjacent contact terminal. In this situation, when the electrode of the semiconductor device is released from the contact terminal, the electrode is pressed by the back of the movable contact portion in the direction where the electrode is separated from the movable contact portion.

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Kawasaki, Japan

Kenji Ichihara