Tokyo Electron Limited

Kenji Homma

Takeshi Sakuma

Daisuke Toriya

Takahiro Horiguchi

Kouji Shimomura

Akihiko Tsukada

A film processing device using vaporized liquid source capable of confirming the flow control accuracy of flow control equipment such as a mass flow controller () controlling the flow of the liquid source without separating the flow control equipment from piping and disassembling the piping, comprising a bypass passage () for bypassing a part of a washing fluid feed passage () for feeding washing fluid to a liquid source feed passage () and a flowmeter such as an MFM (), wherein the washing fluid is allowed to flow to the mass flow controller () through the MFM (), and the flow of the washing fluid detected by the MFM () is compared with a target flow set in the mass flow controller () to check whether the mass flow controller () operates normally or not.

Processing device and method of maintaining the device

A higher-temperature heating zone and lower-temperature heating zone are set in a process chamber for a single-substrate-heat-processing apparatus in order to subject a wafer to two processes with different process temperatures. In the higher-temperature heating zone, the wafer is heated as it is placed on a worktable. In the lower-temperature heating zone, the wafer is heated with a smaller heat quantity as it floats above the worktable. In the lower-temperature heating zone, a heat ray reflector for compensating for heat dissipated from the peripheral portion of the wafer is disposed to surround the wafer.

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Nirasaki, Japan

Kenji Homma