Canon Finetech Inc.

Ushio Denki Kabushiki Kaisha

Kenji Hatakeyama

Hiroyuki Ishinaga

Yuichi Takahashi

Kazuo Haida

Yoichi Sonobe

Chiharu Yumoto

Shinji Suzuki

Kenichi Hirose

Makoto Yamanaka

Yoichi c/o Canon Finetech Inc Sonobe

Provided is a microchip that can achieve a favorable bonding state in the bonding portion between first and second substrates even if the microchip is large in size. A microchip includes a first substrate made of a resin and a second substrate made of a resin, the first substrate and the second substrates being bonded to each other, and a channel surrounded by a bonding portion between the first substrate and the second substrate is formed by a channel forming step formed at least in the first substrate. Further, a noncontact portion is formed to surround the bonding portion, and an angle &#x3b8;formed between a side wall surface of the channel forming step and a bonding surface continuous therewith satisfies &#x3b8;&#x3e;90&#xb0;.

Microchip

The present invention provides a print module, an information processing device, a print system, a print unit, an ink supply unit, a print method and program, all capable of quickly and easily meeting demands for a print medium size change, particularly to increased sizes, while at the same time coping with demands for faster printing speed. To this end, this invention constructs the print heads () in the form of print modules (M) so that their ink systems and signal systems are independent among the print modules. Each print module is set with identity information for its identification.

Print module, information processing device, print system, print unit, ink supply unit, print method, and program

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Tokyo, Japan

Kenji Hatakeyama