Rohm Co., Ltd.

Kenji Hama

Hideo Hara

Yuji Ishimatsu

Motohiro Ando

Takahiro Kotani

A semiconductor device includes a substrate, a conductive portion, a sealing resin, a plurality of semiconductor chips, and a plurality of temperature detection elements. The substrate has a substrate obverse surface and a substrate reverse surface that face opposite sides in a thickness direction. The conductive portion is formed on the substrate obverse surface. The sealing resin covers at least a part of the substrate. The sealing resin also covers the entire conductive portion. The plurality of semiconductor chips are disposed on the substrate obverse surface. The plurality of temperature detection elements are disposed on the substrate obverse surface. The number of temperature detection elements is equal to or greater than the number of semiconductor chips.

Semiconductor device

A semiconductor device includes a substrate, a conductive section, a sealing resin, and a conductive section wire. The substrate includes a substrate obverse face and a substrate reverse face oriented in opposite directions to each other in a thickness direction. The conductive section is formed of a conductive material and located on the substrate obverse face. The conductive section includes a first section and a second section spaced apart from each other. The sealing resin covers at least a part of the substrate and an entirety of the conductive section. The conductive section wire is conductively bonded to the first section and the second section of the conductive section.

An electronic device includes a first electronic component including a first main body, a second electronic component including a second main body, a mounting substrate having a mounting surface, and a heat dissipator having an attaching surface. The mounting surface and the attaching surface face each other in the z direction. The first main body and the second main body are disposed between the mounting substrate and the heat dissipator in the z direction and arranged side by side in the x direction. The first main body has a first front surface facing the attaching surface and a first back surface facing the mounting surface. The second main body has a second front surface facing the attaching surface and a second back surface facing the mounting surface. The dimension of the second main body in the z direction is smaller than the dimension of the first main body in the z direction. The first front surface and the second front surface overlap with each other as viewed in the x direction. A gap is provided between the second back surface and the mounting surface.

Electronic device

For example, the switching drive deviceincludes a driverconfigured to drive an N-type semiconductor switch element, a current limiterconfigured to limit a current fed to a boot capacitor BCincluded in a bootstrap circuit BTC, and a current controllerconfigured to control the operation of the current limiterThe current controlleris configured to drive the current limiterto limit the current fed to the boot capacitor BCwhen the charge voltage across the boot capacitor BCis higher than a threshold value.

Switch driving device

A switch driving device includes a gate driver, a bootstrap circuit, a current limiting portion, and a current control portion. The gate driver drives an N-type semiconductor switch element. The bootstrap circuit includes a boot capacitor and a boot diode and applies a voltage to the gate driver. The current limiting portion limits a current to be supplied to the boot capacitor. The current control portion controls operations of the current limiting portion. The current limiting portion is provided on a path that electrically connects the boot capacitor and the boot diode to each other.

A motor drive device in which the torque vector of the motor is controlled so that the correlation between the number of pulses of a clock signal and the phase of the torque vector of the motor is held in common for multiple excitation methods. The excitation method having the greatest number of steps is used as a reference, and the torque vector of the motor is maintained in the same phase as before switching when the excitation method is switched. The torque vector is in the closest phase in the rotation direction of the motor when there is no phase that is the same as the phase prior to switching.

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Kyoto, Japan

Kenji Hama