Ibiden Company Limited

Kenji Chihara

Kiyotaka Tsukada

Mitsuhiro Kondo

Masaru Takada

Hiroyuki Kobayashi

Hisashi Minoura

Naoto Ishida

Atsushi Shouda

Yoshihiro Kodera

Yoshikazu Ukai

Yoshihide Tohyama

Yasuyoshi Okuda

A solder resist comprising a thermosetting resin is printed on a surface of an insulating board () having a conductor circuit (). The solder resist is then heat-cured to form an insulating film () having a low thermal expansion coefficient. A laser beam () is then applied to the portion of the insulating film in which an opening is to be formed, to burn off the same portion for forming an opening (), whereby the conductor circuit () is exposed. This opening may be formed as a hole for conduction by forming a metal plating film on an inner surface thereof. It is preferable that an external connecting pad be formed so as to cover the opening. The film of coating of a metal is formed by using an electric plating lead, which is preferably cut off by a laser beam after the electric plating has finished.

Method of manufacturing printed wiring board

Printed wiring board and method of manufacturing the same

A printed circuit board providing superior adhesion between a substrate and a conductor pattern and preventing damage of the substrate . The width c of the bottom surface of the conductor pattern is greater than the width d of the top surface . Accordingly, the conductor pattern has a trapezoidal cross-section. The two side surfaces of a lower portion of the conductor pattern are coated by a solder resist. The two side surfaces at the upper portion of the conductor pattern are exposed from the solder resist . A solder ball engages the two side surfaces

Printed-circuit board and method of manufacture thereof

A printed circuit board and a method for manufacturing the same that facilitates the formation of an upper surface pattern and prevents a lower surface metal foil from being damaged when forming a blind via hole with a laser. A lower surface and an upper surface of an insulative substrate ( ) are respectively coated with a lower surface metal foil ( ) and an upper surface metal foil ( ), the thickness of which is less than that of the lower surface metal foil ( ). Next, an opening ( ) is formed in the upper surface metal foil at a location corresponding to a blind via hole formation portion ( ) of the insulative substrate. A blind via hole ( ), the bottom of which is the lower surface metal foil, is formed by emitting a laser ( ) against the blind via hole formation portion ( ) through the opening ( ). Then, a metal plating film ( ) is applied to the wall of the blind via hole ( ), and an upper surface pattern ( ) and a lower surface pattern ( ) are formed through etching.

Printed wiring board and method for producing the same

A solder resist comprising a thermosetting resin is printed on a surface of an insulating board ( ) having a conductor circuit ( ). The solder resist is then heat-cured to form an insulating film ( ) having a low thermal expansion coefficient. A laser beam ( ) is then applied to the portion of the insulating film in which an opening is to be formed, to burn off the same portion for forming an opening ( ), whereby the conductor circuit ( ) is exposed. This opening may be formed as a hole for conduction by forming a metal plating film on an inner surface thereof. It is preferable that an external connecting pad be formed so as to cover the opening. The film of coating of a metal is formed by using an electric plating lead, which is preferably cut off by a laser beam after the electric plating has finished.

This invention relates to a solder member for external connection joined to a connection terminal formed on a surface of a printed wiring board corresponding to a conductor pattern and having an electroless Ni/Au plated layer, wherein the solder member is a ball-shaped solder containing finely powdered copper and has an excellent joint strength to the connection terminal.

Soldering member for printed wiring boards

A solder resist comprising a thermosetting resin is printed on a surface of an insulating board (,) having a conductor circuit (,). The solder resist is then heat-cured to form an insulating film (,) having a low thermal expansion coefficient. A laser beam (,) is then applied to the portion of the insulating film in which an opening is to be formed, to burn off the same portion for forming an opening (,), whereby the conductor circuit (,) is exposed. This opening may be formed as a hole for conduction by forming a metal plating film on an inner surface thereof. It is preferable that an external connecting pad be formed so as to cover the opening. The film of coating of a metal is formed by using an electric plating lead, which is preferably cut off by a laser beam after the electric plating has finished.

Growing community of inventors

Ogaki, Japan

Kenji Chihara