Nkk Corporation

Nec Corporation

Nippon Kokan Kabushiki Kaisha

Nec Tokin Corporation

Nec Tokin Toyama, Ltd.

Tokin Corporation

Nippon Mining Co., Ltd.

Other

Kemet Electronics Corporation

Toshiba Ceramics Co., Ltd.

Taisei Kako Co., Ltd.

Kenji Araki

Takashi Fukaumi

Yoshinobu Shima

Hiroshi Kamio

Kenichi Takahashi

Makoto Suzuki

Akihiro Kawai

Shinji Arai

Yuji Aoki

Satoshi Arai

Kazuhide Nakaoka

Minoru Suzuki

Akira Kazama

Toshihisa Nagasawa

Masanori Ohmura

Yuuji Aoki

Shigetake Horie

Yasumitsu Nakahama

Naotake Yoshihara

Katsumi Ikusawa

Yoshio Murayama

Atsushi Kobayashi

Toshio Ishii

Akio Fujibayashi

Kazuo Kunioka

Munehiro Ishioka

Yoichi Miyakawa

Tadamasa Asami

Seishi Hatakeyama

Nobuyuki Ishida

Kentaro Akashi

Daisuke Takada

Teruhisa Kuwana

Motoi Uesugi

Hitoshi Takata

Shinobu Osaka

Syu-ji Nomura

Yasunori Ohsaki

Kozo Hadada

Hideo Yamana

Ryuji Nagayama

Toyoharu Suda

Keishi Yamashita

Hiroshi Sakama

Takeshi Kaneto

Takashi Kono

Takeshi Suzuki

Toshihiko Nishiyama

Koji Sakata

Katsuhiro Yoshida

Hiroshi Kuroda

Yoshihiko Saiki

Yasuhisa Sugawara

Shiro Fukunaka

Yuji Yoshida

Masami Ishijima

Yoshikazu Takada

Takayoshi Shimomura

Takao Kurihara

Yuichi Maruko

Kazuaki Saito

Haruo Kubotera

Masahiko Tanaka

Nobuo Tanaka

Koji Iwase

Takeshi Saitou

Hideo Miura

Katsuhiko Hirogami

Yasuo Koike

Katsuhiko Tayama

Masayuki Kurata

Masashi Kurata

Katuhiko Tayama

Masaji Watanabe

Ayao Yokoyama

Osamu Funaya

Akira Ohtani

Takashi Mihara

Sadamu Toida

Yasumitsu Nakaham

Yuuichi Maruko

Ikuo Araki

A solid electrolytic capacitor capable of improving manufacturing yield is provided. A solid electrolytic capacitor according to one aspect of the present disclosure includes an anode lead-out wire and a capacitor element in which the anode lead-out wire is embedded. The cross section of at least a part of the anode lead-out wire in a direction in which the anode lead-out wire is extended has a flat shape, and a recess provided in a central part, a first linear part that is extended outward from one side of the recess, and a second linear part that is extended outward from another side of the recess are formed in at least one of an upper surface and a lower surface of the anode lead-out wire having the flat shape.

Solid electrolytic capacitor and method for manufacturing solid electrolytic capacitor with improved anode lead-out wire

An electrolytic capacitor according to an aspect of the present disclosure includes a valve metal, a dielectric oxide film layer formed on a surface of the valve metal, a surface treatment agent layer formed on the dielectric oxide film layer, and an electrolyte layer formed on the surface treatment agent layer. The electrolyte layer includes a conductive polymer layer and an ionic liquid. For example, the conductive polymer layer is formed so that the conductive polymer layer is in contact with the surface treatment agent layer, and at least some of voids present in an interface between the conductive polymer layer and the surface treatment agent layer are filled with the ionic liquid.

Electrolytic capacitor and method for manufacturing electrolytic capacitor

In a capacitor element of a solid electrolytic capacitor, a solid electrolytic layer has an edge portion near a root of a lead-out portion. An anode terminal is connected to the lead out portion at a position away from the root of the lead out portion. An ion trapping member includes a first resin and an ion trapping agent dispersed in the first resin. The ion trapping member covers the whole periphery of at least a part of the lead out portion directly or via the dielectric layer between the edge portion of the solid electrolytic layer and the anode terminal. An external insulation member includes a second resin having a high affinity for the first resin. The external insulation member envelops the capacitor element and covers at least a part of the ion trapping member, a part of the anode terminal and a part of a cathode terminal.

Solid electrolytic capacitor

A solid electrolytic capacitor includes a capacitor element and a plated layer. The capacitor element has a predetermined surface and outer peripheral surface other than the predetermined surface. The capacitor element includes an anode body, an anode lead wire and a cathode layer. The predetermined surface is perpendicular to a predetermined direction. The anode lead wire extends from the anode body along the predetermined direction through the predetermined surface. The cathode layer includes a solid electrolyte layer and forms the outer peripheral surface and a part of the predetermined surface. The plated layer completely covers the outer peripheral surface and the part of the predetermined surface.

Provided is a solid electrolytic capacitor that is excellent in productivity, has improved volumetric efficiency aiming for capacity increase, a stable fillet shape when mounted, and has excellent ESL characteristics. Included is a capacitor stack element composed of a stack of capacitor elements. The capacitor element includes one anode part of an anode body made of linear, foil-like, or plate-like valve metal and a cathode part composed of dielectric, solid electrolyte, graphite, and silver paste layers, which are sequentially formed to another surface of the anode body separated by insulating resin. A fillet formation part with a recessed part is provided to an end surface of anode and cathode terminals of a mounting electrode side of a first direction end surface of the electrode substrate to which the capacitor stack element is mounted. Further, the anode and cathode terminals for element connection reach the end surface of the first direction.

In a lower-face electrode type solid electrolytic multilayer capacitor and a mounting member having the same according to the present invention, fillet forming portions are formed by forming an electrode substrate cutting portion at a predetermined portion of an edge face in longer direction or in shorter direction of an electrode substrate, and a covering resin cutting portion on an edge face of a covering resin in a staircase pattern so that the electrode substrate cutting portion is surrounded by the covering resin cutting portion. According to the present invention, it is possible to provide the lower-face electrode type solid electrolytic multilayer capacitor and the mounting member having the same, in which the productivity is excellent, the volume efficiency can be improved to achieve the high capacitance, and the stable fillet can be formed on mounting.

Lower-face electrode type solid electrolytic multilayer capacitor and mounting member having the same

A surface-mounting thin type capacitor includes a capacitor element having a shape ofand two end portions which form a side surface of the capacitor element. Two anode terminals are disposed on lower surfaces of the end portions along the side surface to form a mounting surface substantially perpendicular to the side surface. A cathode terminal is disposed at a middle part of the capacitor element to form the mounting surface together with the anode terminals. The cathode terminal is not between the anode terminals spatially and thereby manufacturing process of the capacitor is simplified and it is easy to change the intended use of the capacitor.

Surface-mounting capacitor

An electrically conductive polymer composition contains an electrically conductive polymer obtained by using a polymer in the form of cations composed of repeating structural units of 3,4-ethylene dioxythiophene and polystyrene sulfonic acid as anions and further contains naphthalene sulfonic acid as an additive. A solid electrolytic capacitoror a surface-mount transmission line elementhas a polypyrrole conductive polymer layeras a first solid electrolyte and a poly(3,4-ethylene dioxythiophene) conductive polymer layeras a second solid electrolyte.

Electrically conductive polymer composition and solid electrolytic capacitor using the same

A surface-mount capacitor includes a multilayer capacitor structure formed by laminating plate-like capacitor elements each having anode lead portions at opposite ends thereof and a cathode portion at the center, an anode terminal connected to each anode lead portion via a strip-like plate, and a cathode terminal connected to the cathode portion. The anode and the cathode terminals and have a flat shape and are formed on a common plane as a substrate-mounted surface. A mold resin case has a bottom portion filling a gap between the anode and the cathode terminals and mechanically connecting the anode and the cathode terminals and sidewalls substantially perpendicular to the substrate-mounted surface. The anode and the cathode terminals have upper surfaces exposed on an inner bottom surface of the mold resin case to be connected to the anode lead portions and the cathode portion.

Surface-mount capacitor and method of producing the same

A surface-mount capacitor includes a multilayer capacitor structure formed by laminating plate-like capacitor elements each having anode lead portionsat opposite ends thereof and a cathode portionat the center, an anode terminalconnected to each anode lead portionvia a strip-like plate, and a cathode terminalconnected to the cathode portion. The anode and the cathode terminalsandhave a flat shape and are formed on a common plane as a substrate-mounted surface. A mold resin casehas a bottom portion filling a gap between the anode and the cathode terminalsandand mechanically connecting the anode and the cathode terminalsand, and side walls substantially perpendicular to the substrate-mounted surface. The anode and the cathode terminalsandhave upper surfaces exposed on an inner bottom surface of the mold resin caseto be connected to the anode lead portionsand the cathode portion

A solid electrolytic capacitor is provided in which non-conductive particles are made to be present between a dielectric layer and an electrolyte layer. A second electrolyte layer is formed of a conductive polymer including graphite particles and non-conductive particles.

Solid electrolytic capacitor and method of producing the same

An apparatus for galvanizing which comprises a plating tank, a dross removing tank, a means to transfer the molten metal bath from the plating tank to the dross removing tank, and an opening located on the plating tank to recycle the molten metal bath from the dross removing tank to the plating tank.

Apparatus for hot dip galvanizing

A check system for a wiring structure of a printed circuit board for easily calculating an electric energy of a high-speed signal wiring on the printed circuit board and warning when the energy owned by the signal wiring is larger than a designated threshold value. The electric energy radiated from the high-speed signal wiring intended for checking is calculated by using a simple mathematical expression, and a display to identify the signal wiring is outputted when the electric energy owned by the signal wiring is larger than a certain designated threshold value, and also an instructing message to relocate in an internal layer of the circuit board is outputted against the signal wiring.

Check system for wiring structure of printed circuit board

A solid electrolytic capacitor is disclosed which combines low LC with Low ESR and which has good characteristics even in a high frequency range, and a method for preparing the same is also disclosed. In the solid electrolytic capacitor whose electrolytic layer contains electrically conductive particles, non-conductive particles are present in at least a part of an interface between a dielectric layer and the electrolyte layer. By employing the structure, local intensifications of field strength in the dielectric layer are prevented to enable a problem of increase in LC to be overcome while keeping ESR low. By the method which comprised a step of applying a colloidal dispersion containing the non-conductive particles in the form of colloidal particles to the post-electrolytic layer formation step product, the solid electrolytic capacitor having the above-mentioned structure can be prepared efficiently.

Solid electrolytic capacitor, and method for preparing the same

The method for hot dip galvanizing comprises the steps of: dividing a plating vessel holding a molten metal into a plating tank and a dross removing tank; conducting hot dip galvanizing to a steel strip by immersing thereof in the molten metal bath; then transferring the molten metal bath from the plating tank to the dross removing tank; removing a dross from the molten metal bath in the dross removing tank; and recycling the molten metal bath from the dross removing tank to the plating tank through an opening located on the plating tank. The apparatus for galvanizing comprises a plating tank, a dross removing tank, a means to transfer the molten metal bath from the plating tank to the dross removing tank, and an opening located on the plating tank to recycle the molten metal bath from the dross removing tank to the plating tank.

Method for hot-dip galvanizing

Growing community of inventors

Toyama, Japan

Kenji Araki