Screen Holdings Co., Ltd.

Kenji Amahisa

Manabu Okutani

Takeshi Yoshida

Hitoshi Nakai

Naohiko Yoshihara

Masayuki Hayashi

Yasunori Kanematsu

Toshimitsu Namba

Tsutomu Osuka

A substrate processing method includes an intermediate processing step of processing the pattern forming surface by the intermediate processing liquid after a chemical liquid processing step, a filler discharging step of discharging a filler after the intermediate processing step, a filler spreading step of spreading the filler, a solidified film forming step of solidifying the filler, a lower position disposing step of making a blocking member be disposed at a lower position prior to start of the chemical liquid processing step, and a blocking member elevating step of starting elevation of the blocking member toward an upper position in a state where the pattern forming surface is covered with the intermediate processing liquid. The chemical liquid is discharged from a central nozzle. Spreading of the filler is started in a state where the blocking member is positioned at the upper position.

Substrate processing method and substrate processing apparatus

The substrate processing apparatus includes a substrate holding unit that holds a substrate horizontally, a substrate rotating unit that rotates the substrate held by the substrate holding unit around a prescribed rotational axis extending along a vertical direction, a processing liquid supply nozzle that moves in a horizontal direction and supplies a processing liquid onto an upper surface of the substrate held by the substrate holding unit, a shielding member that shields an atmosphere between the shielding member and the upper surface of the substrate held by the substrate holding unit from an ambient atmosphere, an inert gas supply unit that supplies an inert gas between the upper surface of the substrate held by the substrate holding unit and the shielding member, and a shielding member rotating unit that rotates the shielding member around the rotational axis. The shielding member includes an annular portion that surrounds the substrate held by the substrate holding unit, and a passage-allowing portion that is provided in the annular portion and allows the processing liquid supply nozzle to pass through the annular portion. The substrate processing apparatus includes a controller that is programmed so as to control the shielding member rotating unit to adjust a position of the passage-allowing portion in the rotational direction such that the processing liquid supply nozzle is to be passed through the annular portion.

Substrate processing apparatus and substrate processing method

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Kyoto, Japan

Kenji Amahisa