Matsushita Electric Industrial Co., Ltd.

Keniti Matumura

Mamoru Inoue

Kiyoshi Mayahara

An apparatus for grinding spherical surfaces of workpieces includes a grinding section having a grindstone rotating mechanism for rotating around an axis of a shaft thereof with a grindstone held at an end of the shaft, a feeding mechanism for feeding the grindstone rotating mechanism toward the workpiece in a direction along the shaft, and a fixing mechanism for holding the grindstone rotating mechanism and the feeding mechanism and determining an angle 1 inclination of the short of the grindstone rotating mechanism with respect to the workpiece. A plurality of workpiece holding mechanisms are provided for holding the workpieces at ends of shafts thereof, the workpiece held by at least one of the workpiece holding mechanisms being opposed to the grindstone. A workpiece rotating mechanism is provided for rotating the workpiece holding mechanism which holds the workpiece opposed to the grindstone. A workpiece positioning section is provided for holding the workpiece holding mechanisms and being rotated and stopped so that an unground workpiece held by at least one of the workpiece holding mechanisms is placed at a workpiece replacing position when a ground workpiece held by the other of the workpiece holding mechanisms has been placed at a grinding position of the grindstone rotating mechanism.

Apparatus for grinding spherical surface

An apparatus for polishing spherical surfaces of workpieces includes a polishing device rotating on a shaft thereof while holding a polishing tool at an end of the shaft. A pivoting device pivots the polishing device around a polishing position of the tool. A plurality of workpiece holders each hold a workpiece at an end thereof so that one of the workpieces is opposed to the tool. Workpiece holder-holding devices hold the workpiece holders so as to be rotatably and vertically movably. A workpiece holder-pressing device presses at least one of the workpiece holders held by the workpiece holder-holding device against the tool. A rotary table rotates while holding the workpiece holders and the workpiece holder-holding devices, thus placing at least one of the workpiece holders at a workpiece replacing position when the other of the workpiece holders is placed at the polishing position of the polishing device.

Apparatus for polishing a spherical surface

A fluid circuit for a work handling apparatus having a suction holder adapted to be selectively communicated with a vacuum source and a compressed air source, an having a first electromagnetic valve having first, second and third ports which are fluid-connected with the vacuum source, the compressed air source and the suction holder, respectively. The first electromagnetic valve is operable, when in a suction position, to communicate the first and third ports with each other and, when in a release position, to communicate said second and third ports with each other. The fluid circuit also has a first passage communicating the suction holder and the third port of the first electromagnetic valve with each other, a pressure sensor, a second electromagnetic valve operable to selectively establish and open a fluid circuit between the pressure sensor and the first passage. The fluid circuit is provided with a gas-liquid separating element disposed in the first passage for separating a liquid component, sucked into the suction holder and then into the first passage, from air. A parallel fluid circuit extends between the compressed air source and the second port of the first electromagnetic valve and including first and second flow regulators, and a switching valve is provided in the parallel fluid circuit for selectively connecting one or both of the first and second flow regulators into the parallel fluid circuit.

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Neyagawa, Japan

Keniti Matumura