Fuji Photo Film Company, Limited

Fujifilm Corporation

Sony Corporation

Fufifilm Corporation

Kenichiro Sato

Toshiaki Aoai

Kunihiko Kodama

Yasumasa Kawabe

Shinji Sakaguchi

Tsukasa Yamanaka

Kazuya Uenishi

Shoichiro Yasunami

Makoto Momota

Kazuyoshi Mizutani

Toru Fujimori

Shiro Tan

Koji Shirakawa

Naoya Sugimoto

Morio Yagihara

Koichi Kawamura

Kazuto Kunita

Akinori Shibuya

Kenji Wada

Shuhei Yamaguchi

Tsuguo Yamaoka

Koji Fujita

Hiroshi Inada

Yutaka Adegawa

Yasufumi Ooishi

Fumiyuki Nishiyama

Tomoaki Takemura

Shunichi Kondo

Kenichi Ikenaga

Hajime Nakao

Yukihiro Isono

Masanori Hikita

Hidekazu Ohashi

Provided is a control apparatus including a control unit configured to control, based on a content list as a list of content items to be provided by providing apparatuses that are connected to a network and capable of providing the content items and on connection relationship information indicating connection relationships between the providing apparatuses and input terminals of output apparatuses that are connected to the network and capable of outputting the content items, a providing apparatus to provide a selected content item that is selected from among the content items in the content list and an output apparatus including an input terminal to which the providing apparatus is connected, as control targets via the network.

Controlling a user terminal to provide content items selected by a user

A polybenzoxazole precursor is represented by the following formula (1): wherein Ra to Ra, Rb to Rb, X, Yand m are defined in the specification.

Polybenzoxazole precursor, photosensitive resin composition using the same, and manufacturing method of semiconductor device

An actinic ray-sensitive or radiation-sensitive resin composition includes (A) a resin having at least two of repeating units represented by general formula (1) below and exhibiting increased solubility in an alkali developer when acted on by an acid, and (B) a compound that generates an acid when exposed to actinic rays or radiation. In the formula, each of R, A, R, Z, L and n represents the same as defined in the claims and in the specification.

Actinic ray-sensitive or radiation-sensitive resin composition and pattern forming method using same

A positive resist composition comprises (A) a compound capable of generating sulfonic acid, bis(alkylsulfonyl)amide, or tris(alkylsulfonyl)methine upon irradiation with actinic ray or radiation, and (B) a resin capable of increasing the solubility in an alkali developer by action of an acid having specific repeating units, and a pattern forming method using the same.

Positive resist composition and a pattern forming method using the same

A polymer compound is provided which is excellent in heat resistance and insulating property, and a photosensitive resin composition is provided which includes the polymer compound, and may form a cured pattern or a cured film excellent in pattern forming property, resolution, heat resistance and insulating property. Also, a method for forming a cured pattern excellent in pattern forming property, resolution, heat resistance and insulating property using the photosensitive resin composition, and an electronic device having high reliance for a semiconductor device or for a display device are provided. The photosensitive resin composition includes a polymer compound obtained by reacting a monomer represented by Formula (1) and a monomer represented by Formula (2), and a photosensitizing agent. 

Photosensitive resin composition, polymer compound, method of forming a pattern, and electronic device

A photosensitive resin composition includes (a) a resin comprising a repeating unit represented by a following formula (1); (b) a photosensitive agent; (c) a thermo-acid generator; and (d) a compound having at least one of an alkoxymethyl group and an acyloxymethyl group, wherein Rrepresents a divalent to octavalent organic group containing 2 or more carbon atoms, Rrepresents a divalent to hexavalent organic group containing 2 or more carbon atoms, each of Rand Rindependently represents a hydrogen atom or an organic group containing 1 to 20 carbon atoms, m represents an integer of 0 to 2, and each of p and q represents an integer of 0 to 4, provided that p+q&#x3e;0.

Photosensitive composition, and cured relief pattern production method and semiconductor device using the same

A photosensitive resin composition contains: a polymer represented by the formula (I) as defined herein, in which 0.5 mol % or more of A in the polymer represented by the formula (I) is a protective group; a photosensitizing agent; a compound containing a methacryloyl or acryloyl group within a molecule of the compound; and a solvent.

Photosensitive resin composition, production method of cured relief pattern using the same and semiconductor device

According to the present invention, there is provided: a photosensitive resin composition comprising a polyamide resin having a specific structure, a photosensitive agent, and a compound having at least two sulfonate ester groups; a production method for a cured relief pattern using the photosensitive resin composition; and a semiconductor device containing the cured relief pattern formed according to the production method.

Photosensitive resin composition, production method for cured relief pattern using it, and semiconductor device

A photosensitive resin composition comprises: a polybenzoxazole precursor (A); a naphthoquinone diazide photosensitizer (B); and a specific phenolic hydroxyl group-containing compound (C).

Photosensitive resin composition and method for manufacturing semiconductor apparatus using the same

A positive photosensitive resin composition, which contains a polybenzoxazole precursor, a quinonediazide photosensitizer and a carbonate solvent, and a method of manufacturing a semiconductor device using the composition.

Photosensitive resin composition and manufacturing method of semiconductor device using the same

Positive resist composition and pattern-forming method using the same

A photosensitive resin composition comprising: a quinone diazide sulfonic acid ester of a phenol compound represented by formula (I) as defined in the specification; and a polybenzoxazole precursor, and a method for manufacturing a semiconductor device using the same 

Photosensitive resin composition and method for manufacturing semiconductor device using the same

A positive resist composition comprising: a resin that comprises a repeating unit including a specific norbornane lactone structure and a repeating unit including a specific alicyclic hydrocarbon structure, and that increases a solubility of the resin in an alkaline developer by an action of an acid; and a compound that generates an acid upon treatment with one of an actinic ray and radiation, and a pattern forming method utilizing the same.

Positive resist composition and pattern forming method utilizing the same

A positive resist composition comprising: at least two resins which differ in glass transition temperature by at least 5&#xb0; C.; and a compound which generates an acid upon irradiation with actinic rays or radiation, wherein each of the two resins comprises at least either of a repeating unit derived from an acrylic acid derivative monomer and a repeating unit derived from an methacrylic acid derivative monomer and further comprises an alicyclic structure and at least one group that increases a solubility of the resin in alkaline developer by the action of an acid.

Growing community of inventors

Shizuoka, Japan

Kenichiro Sato