Ebara Corporation

Olympus Corporation

Sony Corporation

Aoki Corporation

Olympus Medical Systems Corporation

Kansas State University Research Foundation

Kenichiro Saito

Tetsuji Togawa

Takahiro Kishi

Osamu Nabeya

Kunihiko Sakurai

Masahiko Sekimoto

Nobuyuki Takada

Satoshi Wakabayashi

Takuji Hayama

Daisuke Koga

Makoto Fukushima

Hozumi Yasuda

Tomoshi Inoue

Naoyuki Hoshi

Ryuichi Kosuge

Hiroyuki Kobayashi

Shigeyuki Aoyama

Naoya Matsuda

Makoto Haitani

Kenichi Suzuki

Koichi Takeda

Junji Kunisawa

Tadakazu Sone

Hiroshi Sotozaki

Takashi Mitsuya

Fujihiko Toyomasu

Tomohiro Tanaka

Akihiro Yazawa

Masanori Sasaki

Hideya Koizumi

Masumi Nishijima

Mamoru Machiya

Chikao Kanaoka

Kimihide Nagata

Hitoshi Ogura

Yuuri Takeuchi

The present disclosure provides a chemical supply apparatus, a cleaning system, and a chemical supply method that can supply a cleaning chemical to two nozzles and also supply the cleaning chemical at a set flow rate to one of the nozzles. A chemical supply apparatus according to the present disclosure includes: a first cleaning chemical supply pipe; a first mixer that mixes a first chemical and water to generate a first cleaning chemical; and a first supply controller, wherein the first cleaning chemical supply pipe includes an upstream pipe forming a channel from the first mixer to a first junction, a first pipe forming a channel from the first junction to a first nozzle, and a second pipe forming a channel from the first junction to a second nozzle, and the first supply controller is configured to execute a feedback control on the basis of the flow rate of the first cleaning chemical inside the first pipe of the first cleaning chemical supply pipe so that the flow rate of the first cleaning chemical flowing through the first pipe of the first cleaning chemical supply pipe is a set flow rate.

Chemical supply apparatus, cleaning system, and chemical supply method

An object of the present invention is to provide a polishing table capable of preventing peeling or detachment of a coating of the polishing table, thereby to enable an operation for replacement of a polishing pad to be easily conducted. One embodiment of the present invention provides a polishing table having a support surface configured to support a polishing pad, the polishing pad being adapted to be used for polishing a substrate, the polishing table comprising: a stacked body comprising a stack of a porous layer and a non-porous layer, the porous layer including open pores formed in a surface thereof disposed to face a polishing pad; and a resin-based coating material disposed in the open pores so as to form at least a part of the support surface of the polishing table.

Polishing table and polishing apparatus having ihe same

A substrate transport apparatus includes a substrate holding unit configured to hold a substrate; a casing; and a drive mechanism at least partially provided within the casing and configured to drive the substrate holding unit using air. The drive mechanism is capable of supplying air into the casing.

Substrate transport apparatus, substrate processing apparatus, and dew condensation suppression method

Disclosed is a turntable cloth peeling jig including: a cylindrical winding cylinder including a slit formed on an outer periphery of the cylindrical winding cylinder and extending in an axial direction thereof; a cloth clamping member disposed inside the winding cylinder and configured to clamp an outer peripheral edge of a cloth inserted into the slit; an extension bar attached to one end portion of the winding cylinder so as to extend coaxially therewith; an engaging portion provided at a tip end portion of the extension bar and engaged with a rotation jig configured to rotate the winding cylinder; and a handle provided in the engaging portion and configured to support the winding cylinder when rotating the rotating jig.

Turntable cloth peeling jig

The system effectively manipulates the operation of a charged particle flow device by approximating the total force on each ion during a trajectory calculation. The system applies the method in massively parallel general-purpose computing with GPU (GPGPU) to test its performance in simulations with thousands to over a million ions. The method calculates the forces on an ion using ions within an active region near the ion of interest. To decrease computation time, the method approximates the forces by calculating the ion-ion interactions within a first zone and the ion-ion cloud interactions within a second zone. The system adjusts settings of the charged particle flow device to affect the flow and positioning of the charged particles. Such setting may include adjusting the positioning of the charged plates, adjusting the voltage of the plates, and adjusting the pressure within the charged particle flow device.

System for controlling and directing the flow of a charged particle through a device

A flexible tube includes a first outer layer covering an outer side of a closely-wound region; a second outer layer forming a second flexible portion which is more difficult to bend than the first flexible portion; a third outer layer covering an outer side of the sparsely-wound region, and forming a third flexible portion which is as difficult to bend as the second flexible portion, or more difficult to bend than the second flexible portion; and a fourth outer layer arranged consecutively between the second and third outer layers to cover the outer side of a boundary position of the closely-wound region and the sparsely-wound region, and reducing a difference in bending difficulty/bending easiness at the boundary position.

Flexible tube and insertion apparatus

A flexible tube includes an envelope, a spiral tube and a built-in component. The spiral tube includes a first area portion and a second area portion. The spiral tube is under an initial tension throughout the overall length, and the built-in component includes a supplement area portion which supplements the elasticity of the spiral tube.

Flexible tube and insertion device

A substrate processing apparatus includes transport mechanismstoa sensorfor detecting whether a wafer W is held by the transport mechanismstoa sensor controllerfor controlling the sensora position information acquiring partfor acquiring position information of the substrate W in the transport passage, a detection result acquiring partfor acquiring a detection result from the sensorand a determination processorfor determining whether the detection result of the sensor and the position information are consistent with each other. When it is determined that the detection result of the sensoris inconsistent with the position information, the sensor controllermakes the sensorretry to detect whether the substrate W is held.

Substrate processing apparatus and substrate presence or absence checking method and program

A flexible tube includes a helical tube including a closely-wound region and a sparsely-wound region, and an outer tube covering an outer side of the helical tube. The closely-wound region includes a closely-wound portion to which a tight contact force is applied, the tight contact force allowing adjacent parts of a wire member adjacent along the longitudinal axis to become a tight contact state, a sparsely-wound portion which is arranged at a proximal side of the closely-wound portion, and a change portion which is arranged at a proximal side of the sparsely-wound portion and, has the tight contact force between the adjacent parts on the proximal side rather than the distal side along the longitudinal axis reduced more than the tight contact force of the closely-wound portion.

A flexible tube for an endoscope includes a helical tube, a cover, and an inhibition mechanism. The inhibition mechanism enables movement of a densely wound portion to the cover in a direction of a central axis of the helical tube and inhibits movement of a loosely wound portion to the cover in the central axis direction of the helical tube.

Flexible tube for endoscope, and endoscope

A passive bending section for an endoscope is disposed between an active bending section of an inserting section and a flexible tube of the inserting section and is passively bent by receiving an external force. In the passive bending section, a curvature gradually increases from the distal end portion of the passive bending section toward the proximal end portion of the passive bending section.

Passive bending section for endoscope, and endoscope

A flexible tubular portion for an endoscope having a central axis includes a spiral tube, an outer layer covering the outside of the spiral tube, and an inhibiting portion. The spiral tube includes, along the longitudinal direction of the central axis, a closely wound portion to which an initial tension is applied, and sparsely wound portions provided on the distal side and the proximal side of the closely wound portion. The inhibiting portion inhibits the movement of at least a part of the sparsely wound portions relative to the outer layer in the longitudinal direction of the spiral tube.

Flexible tube for endoscope and endoscope

A substrate holding apparatus prevents a substrate from slipping out and allows the substrate to be polished stably. The substrate holding apparatus has a top ring body for holding and pressing a substrate against a polishing surface, and a retainer ring for pressing the polishing surface, the retainer ring being disposed on an outer circumferential portion of the top ring body. The retainer ring includes a first member made of a magnetic material and a second member having a magnet disposed on a surface thereof which is held in abutment against the first member.

Substrate holding apparatus, polishing apparatus, and polishing method

A polishing apparatus is used for polishing a substrate such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a polishing table having a polishing surface, a top ring configured to hold and press the substrate against the polishing surface, a top ring shaft configured to lift and lower the top ring, and an elongation detecting device configured to detect an elongation of the top ring shaft. The polishing apparatus further includes a controller configured to set a vertical position of the top ring at the time of polishing, and control a lifting and lowering mechanism to lower the top ring to a preset polishing position as the set vertical position. The controller corrects the preset polishing position based on the elongation of the top ring shaft which has been detected by the elongation detecting device.

Growing community of inventors

Tokyo, Japan

Kenichiro Saito