Toshiba Mitsubishi-electric Industrial Systems Corporation

Toshiba Energy Systems & Solutions Corporation

Kenichiro Omote

Kenji Oda

Ryo Nakajima

Jun Zheng

Naotaka Iio

Yuta Ichikura

Makoto Mukunoki

Daisuke Yoshizawa

A power conversion apparatus is provided to prevent the arc flash generated in a board from flowing out to a operation surface for operating the board, and also to relieve the pressure inside the board to the outside from the flapper section provided on the ceiling. The power conversion apparatus that has taken measures against an arc flash composed of a power converter and a board accommodating the power converter is provided. A BUS which constitutes the power converter has the first processing that makes it hard to fly the flash in a place where arc flash is not desired to occur. A door is placed on the front board that can be opened and closed by the operator. The board has an explosion-proof shutter part to prevent the arc flash from being released to the outside by the pressure inside the board, and has a flapper section for releasing the pressure inside the board to the outside from the ceiling of the board unit, when the arc flash occurs.

Housing for power conversion apparatus

To provide a pressure contact type semiconductor device stack which can uniformly pressurize pressure contact type semiconductor devices irrespective of presence or absence of a notch portion of the pressure contact type semiconductor device, and can prevent thermal destruction of the relevant pressure contact type semiconductor device. A pressurizing device for pressurizing between pressure contact type semiconductor devices and heat sinks which have been stacked is provided with pressuring bodies arranged at the upper and lower surfaces, metal fittings for insulating plate each for distributing a pressure applied by the pressuring body to an outer circumferential surface, and insulating plates each for pressuring the relevant heat sinks by the pressure applied to a pressurizing surface of the relevant metal fitting for insulating plate, the pressure contact type semiconductor device has a notch portion at a part of a peripheral portion of a post surface of any one of a collector post surface or an emitter post surface, and a device for making a distance from a pressurizing surface of the metal fitting for insulating plate pressurized by the upper surface pressurizing body to a front surface of a chip equal to a distance from a pressurizing surface of the metal fitting for insulating plate pressurized by the lower surface pressurizing body to a back surface of a chip is provided.

Pressure contact type semiconductor device stack

Power converter enclosure

Flapper for the roof of a power conditioning subsytem

Power converter

Growing community of inventors

Tokyo, Japan

Kenichiro Omote