Nippei Toyama Corporation

Sony Semiconductor Solutions Corporation

Sony Group Corporation

Kenichiro Nishi

Shirou Murai

Mitsuru Nukui

Toyotaka Wada

Kazuo Nakajima

Yuji Matsui

Hiroshi Arai

Takeshi Masuura

Satoshi Takashima

Norimitsu Okiyama

Yuriko Ohtsuka

Tetsuo Okuyama

Tomio Nakagawa

A signal processing device according to the present technology includes a feature quantity extraction unit including a neural network and trained to extract a feature quantity for a specific event with respect to an input signal from a sensor, and a correction unit that performs correction of the input signal on the basis of the feature quantity extracted by the feature quantity extraction unit.

Signal processing device and signal processing method for correcting input signal from sensor

A signal processing device includes an approximate curved surface conversion unit that includes a first stacked autoencoder pretrained on the basis of learning input data constituted by coordinate data acquired for each of multiple elements of an object, and that obtains approximate curved surface data indicating an approximate curved surface of the object in an intermediate layer of the first stacked autoencoder, on the basis of input data constituted by the coordinate data acquired for each of the elements, and a geometric modulation processing unit that includes a second stacked autoencoder having learned by machine learning on the basis of learning input data constituted by the approximate curved surface data and on the basis of training data constituted by a result obtained by coordinate conversion for each of the elements in a geometric modulation process performed for the object, and performs the geometric modulation process.

Signal processing device and signal processing method

A signal processing device according to the present technology includes a stacked auto encoder that processes an input signal from a sensor, a control line associated learner including a neural network and subjected to control line associated learning for performing learning by associating different event aspects related to a specific event with values of different control lines with a feature quantity obtained in an intermediate layer of the stacked auto encoder after pretraining as an input, and a refactorer that obtains a difference between a first output that is an output of the control line associated learner when a first value is given to the control line, and a second output that is an output of the control line associated learner when a second value different from the first value is given to the control line.

Signal processing device, signal processing method, and parameter search method

In the wafer chamfering method, there is used a disk-shaped grindstone,which includes: a peripheral edge portion serving as a grinding surface,a flat portion formed in the central portion of the grinding surface,in the width direction thereof; and, two edge portions,respectively formed on the two sides of the flat portion,in the width direction thereof and made in the form of the shape of the valley portion of the notch portion,of a disk-shaped wafer,to be chamfered. In operation, in the wafer chamfering method, while rotating the above grindstone,the grindstone,is revolved in the thickness direction of the wafer,to thereby chamfer the wafer,Especially, the present wafer chamfering method comprises two steps: that is, a circumferential portion grinding step in which the grindstone is supported such that it stands upright or at right angles to the circumferential portion,of the wafer,at their respective mutual contact points and only the flat portion of the grindstone,is contacted with the mutual contact points to thereby chamfer the peripheral edge portion of the wafer,and, a notch portion grinding step in which the grindstone is supported such that it is inclined with respect to the diameter direction of the notch portion of the wafer,by an angle of about 45&deg; in the circumferential direction of the wafer,and the edge portions,or both of the edge portions,and flat portion,are used to chamfer the notch portion,of the wafer

Method for chamfering a wafer

A workpiece receiving hole,for fittingly receiving a workpiece,is formed in the center of a rotary disk,which is thinner than the workpiece,. A workpiece drive section,which engages a notch,formed for the purpose of orienting the workpiece,relative to crystal orientation is formed along the brim of the hole,. A gear,is rotated by a gear,of a motor,, thereby rotating the rotary disk,and imparting torque to the workpiece,. Accordingly, both surfaces of the workpiece are ground by means of a double disc surface grinder.

Grinding method, surface grinder, workpiece support, mechanism and work rest

A spindle,of a grinding wheel,is rotatively borne by a bench,for the grinding wheel through hydrostatic thrust bearings,and,. A pressure regulator,for regulating the pressure which must be supplied to at least either of supply ports,and,opposite to each other in the direction of the axial line of the spindle,in the hydrostatic thrust bearings,and,is provided. The pressure regulator,has a changing member for changing a passage for choking the fluid and the length of the choking passage.

Feeding a grinding wheel in grinding method

A method of slicing an ingot wherein a pre-cut work 3 in which a holding member 2 extending over the entire length of a side surface of a cylindrical ingot 1 is bonded to the side surface of the ingot 1 is set on a slicing apparatus 4, and the pre-cut work 3 is split into a multiplicity of pieces over its longitudinal direction so as to obtain disk-shaped works 5 to be ground, characterized in that a retaining member 2 is used in which a retaining layer 7 which is directly bonded to the side surface of the ingot 1 by a first adhesive agent having an adhesive strength sufficient to receive a rotating force due to a grinding apparatus 6 in a subsequent grinding process, an intermediate layer 8 which is bonded to said retaining layer 7 in a superposed manner by a second adhesive agent whose adhesive strength deteriorates more than that of the first adhesive agent under a fixed condition, and a supporting layer 11 which is connected to said intermediate layer 8 and is connected to a supporting portion 10 of said slicing apparatus 4 are integrally superposed one on top another.

Ingot slicing method, an ingot manufacturing method and a sliced ingot

A spindle 23 of a grinding wheel 28 is rotatively borne by a bench 22 for the grinding wheel through hydrostatic thrust bearings 26 and 27. A pressure regulator 38 for regulating the pressure which must be supplied to at least either of supply ports 26a and 27a opposite to each other in the direction of the axial line of the spindle 23 in the hydrostatic thrust bearings 26 and 27 is provided. The pressure regulator 38 has a changing member for changing a passage for choking the fluid and the length of the choking passage.

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Kanagawa, Japan

Kenichiro Nishi