Shindengen Electric Manufacturing Company Limited

Kenichi Yoshida

Kenichi Suzuki

Shinji Kunori

Kazuyuki Sashida

Mizue Yamaji

A semiconductor componenthas a semiconductor layerincluding a winding wire partand a winding return wire partconnected at a terminal end part of the winding wire partand returning from the terminal end part toward a starting end part side, wherein the semiconductor component is disposed so as to surround an object to be measured.

Semiconductor component, assembly and method for manufacturing semiconductor component

A semiconductor device has a first electrodea second electrodeand a semiconductor layerhaving a winding wire partprovided so as to surround a current flowing between the first electrodeand the second electrodea winding return wire part, which is provided so as to surround the current, is connected to a terminal end part of the winding wire partand returns toward a starting end part side from the terminal end part, and an integration circuit configuration part connected to the winding wire partor the winding return wire part. The integration circuit configuration part has one or more of a resistance parta capacitor partand an operational amplifier part

Semiconductor device and semiconductor component

A detection substratehas a body filmhaving a through hole; a winding wire partprovided on a surface of one side of the body film, on a surface of another side of the body filmand in the through hole, and disposed so as to surround a current to be detected; and a winding return wire part, provided on the body film, connected at a terminal end part of the winding wire partand returning from the terminal end part toward a starting end part side.

Growing community of inventors

Saitama, Japan

Kenichi Yoshida