Tdk Corporation

Nec Corporation

Fuji Jukogyo Kabushiki Kaisha

Kabushiki Kaisha Toshiba

Yokogawa Electric Corporation

Arqule, Inc.

Stanley Electric Co., Ltd

Daiichi Sankyo Company, Limited

Ntt Facilities, Inc.

Hitachi, Ltd.

Kenichi Yoshida

Kazuhiro Yoshikawa

Yuhei Horikawa

Hisayuki Abe

Daiki Ishii

Makoto Orikasa

Koichi Tsunoda

Toshiyuki Suzuki

Yoshihiko Yano

Yuki Yamashita

Takashi Ohtsuka

Tetsuhiro Takahashi

Atsushi Sato

Mark Anthony Ashwell

Hitoshi Saita

Jean-Marc Lapierre

Takahiro Kitamura

Yanbin Liu

Rocio Palma

Akihisa Matsuda

Yuichiro Okuyama

Makoto Yoshida

Jason J Hill

Naoto Takano

Noriaki Senba

Hajime Kuwajima

Takashi Ota

Manish Tandon

Nivedita Namdev

Tatsuo Namikawa

Tohru Inoue

Hiroshi Yamamoto

Makoto Takemura

Akifumi Kamijima

Hisashi Takahashi

Tokihito Suwa

Tatsuya Harada

Hisaya Shimizu

Mitsuhiro Tomikawa

Hideyuki Seike

Junki Nakamoto

Michihiro Kumagae

Norihiko Matsuzaka

David Vensel

Shin Iimura

Hirosi Oodaira

Takeshi Oohashi

Anton Filikov

Masayuki Ohuchi

Steffi Koerner

Takanori Yamazaki

Yuuki Aburakawa

Robert B Nicewonger

Chris Brassard

Takaaki Domon

Katsunori Osanai

Takeshi Isoyama

Eiko Wakata

Rie Miyauchi

Kiyoshi Nakayama

Jun Hagiwara

Satoshi Komoriya

Masashige Mitsuhashi

Kenichi Ohno

Takaaki Morita

Hideki Tomiyama

Hiroaki Inagaki

Hiroshi Takasaki

Sudharshan Eathiraj

Masatoshi Nagamochi

Kazuto Oyama

Masahiro Hiraoka

Shinichiro Toda

Masanobu Yoshimura

Takashi Odagiri

Shin Fujita

Yosuke Umesaki

Tomoya Hanai

Yusuke Oba

Toshifumi Tsuda

Akiyasu Iioka

Wataru Gotou

Shigeya Takahashi

Hiroshi Akaishi

Kazuaki Nawa

Daiki Kusunoki

Akiko Shiina

Yu Fukae

Shigeto Nagashima

Toshiya Motohi

Kouzou Toyota

Yoshifumi Sugimura

Maki Mochiduki

Hiroyasu Nishii

Jason Hill

Robert Nicewonger

A thin film capacitor includes: a metal foil having a roughened upper surface; a dielectric film covering the upper surface of the metal foil and having an opening through which the metal foil is partly exposed; a first electrode layer contacting the metal foil through the opening; a second electrode layer contacting the dielectric film without contacting the metal foil; and an insulating member separating the first and second electrode layers. The insulating member has a tapered shape in cross section. With the above configuration, both the first and second electrode layers can be disposed on the upper surface of the metal foil. In addition, since the insulating member has a tapered shape in cross section, adhesion performance of the insulating member can be enhanced, thus making it possible to prevent short-circuit between the first and second electrode layers.

Thin film capacitor, its manufacturing method, and electronic circuit substrate having the thin film capacitor

To provide a thin film capacitor in which peeling-off of an electrode layer is less likely to occur. A thin film capacitor includes a metal foil having a roughened upper surface, a dielectric film covering the upper surface of the metal foil and having an opening for partly exposing the metal foil therethrough, a first electrode layer contacting the metal foil through the opening and further contacting the dielectric film, and a second electrode layer contacting the dielectric film without contacting the metal foil. With this configuration, both the first and second electrode layers can be disposed on the upper surface of the metal foil. In addition, the first electrode layer contacts not only the metal foil but also the dielectric film, making peeling of the first electrode layer less likely to occur.

Thin film capacitor and electronic circuit substrate having the same

An electronic component includes: a conductive pattern provided on the main surface of a substrate and constituting a lower electrode; a dielectric film that covers top and side surfaces of the conductive pattern; and a conductive pattern stacked on the top surface of the conductive pattern through the dielectric film and constituting an upper electrode. A part of the dielectric film that is parallel to the main surface of the substrate is removed at least partly. Partially removing a part of the dielectric film that is parallel to the main surface of the substrate allows stress relaxation. This prevents peeling at the interface between the lower electrode and the dielectric film.

Electronic component having the dielectric film not covers a corner part of the lower electrode

A thin film capacitor includes: a metal foil having a roughened upper surface; a dielectric film covering the upper surface of the metal foil and having an opening through which the metal foil is partly exposed; a first electrode layer contacting the metal foil through the opening; a second electrode layer contacting the dielectric film without contacting the metal foil; and an insulating member provided on the upper surface of the metal foil to surround the first and second electrode layers. The metal foil has an outer peripheral area which is positioned outside an area surrounded by the insulating member and which is not covered with the first and second electrode layers. A height of the electrode layer is equal to or higher than a height of the insulating member. This makes the outer peripheral portion of the thin film capacitor have a step-like shape.

To provide a thin film capacitor having high adhesion with respect to a circuit substrate. A thin film capacitor includes: a metal foil having a roughened upper surface; a dielectric film covering the upper surface of the metal foil and having an opening through which the metal foil is partly exposed; a first electrode layer contacting the metal foil through the opening; and a second electrode layer contacting the dielectric film without contacting the metal foil. An angle θa formed by the other main surface of the metal foil and a side surface thereof is more than 20° and less than 80°. The side surface is thus tapered at an angle of more than 20° and less than 80°, so that it is possible to suppress warpage and to enhance adhesion with respect to a multilayer substrate when the thin film capacitor is embedded in the multilayer substrate.

To provide a thin film capacitor in which warpage is less likely to occur. A thin film capacitor includes: a metal foil having roughened upper and lower surfaces; a dielectric film covering the upper surface of the metal foil and having an opening through which the metal foil is partly exposed; a dielectric film covering the lower surface of the metal foil and made of a dielectric material having a thermal expansion coefficient smaller than that of the metal foil; a first electrode layer contacting the metal foil through the opening; and a second electrode layer contacting the first dielectric film without contacting the metal foil. The lower surface of the metal foil is thus covered with the dielectric film having a small thermal expansion coefficient, thereby making it possible to prevent the occurrence of warpage.

To provide a thin film capacitor having high adhesion performance with respect to a multilayer substrate. A thin film capacitor includes: a metal foil having a roughened upper surface; a dielectric film covering the upper surface of the metal foil and having an opening through which the metal foil is partly exposed; a first electrode layer contacting the metal foil through the opening; and a second electrode layer contacting the dielectric film without contacting the metal foil. A height of the first electrode layer is lower than a height of the second electrode layer. This enhances adhesion performance when the thin film capacitor is embedded in a multilayer substrate and improves ESR characteristics.

Provided is a thin film capacitor comprising a capacitance portion in which at least one dielectric layer is sandwiched between a pair of electrode layers included in a plurality of electrode layers, wherein the capacitance portion has an opening which extends in a lamination direction in which the plurality of electrode layers and the dielectric layer are laminated and through which one electrode layer of the plurality of electrode layers is exposed, the one electrode layer has an exposed portion exposed at a bottom surface of the opening, the exposed portion is in contact with a wiring layer connecting the one electrode layer and an electrode terminal, and a thickness of the exposed portion of the one electrode layer is smaller than a thickness of other portions of the one electrode layer and is 50% or more of the thickness of the other portions of the one electrode layer.

Thin film capacitor

Disclosed herein is an electronic component that includes a substrate, a functional layer formed on the substrate and having a plurality of alternately stacked conductor layers and insulating layers, and a plurality of terminal electrodes provided on an uppermost one of the insulating layers. The uppermost one of the insulating layers has a substantially rectangular planar shape and has a protruding part protruding in a planar direction from at least one side in a plan view.

Electronic component and manufacturing method therefor

Disclosed herein is an electronic component that includes a substrate; and a plurality of conductive layers and a plurality of insulating layers which are alternately laminated on the substrate. The side surface of a predetermined one of the plurality of insulating layers has a recessed part set back from a side surface of the substrate and a projecting part projecting from the recessed part. The recessed part is covered with a first dielectric film made of an inorganic insulating material.

Electronic component and its manufacturing method

Disclosed herein is an electronic component that includes a substrate and a plurality of conductive layers and a plurality of insulating layers which are alternately laminated on the substrate. The side surface of at least one of the plurality of insulating layers has a recessed part set back from a side surface of the substrate and a projecting part projecting from the recessed part.

A first insulating layer, a conductor layer included on a first main surface, an electronic component included on the first main surface and a second insulating layer stacked on the first insulating layer are included, a stacking direction of the first insulating layer and the second insulating layer is the same as a stacking direction of a first electrode layer, a second electrode layer, and the dielectric layer in the electronic component, and a height position of a main surface of the electronic component on an opposite side from a side of the first main surface is different from a height position of a main surface of the conductor layer adjacent to the electronic component on an opposite side from a side of the first main surface in the stacking direction.

Electronic component-incorporating substrate

Disclosed herein is an electronic component that includes a first conductive layer including a lower electrode and a first inductor pattern, a dielectric film that covers the lower electrode, an upper electrode laminated on the lower electrode through the dielectric film, an insulating layer that covers the first conductive layer, dielectric film, and upper electrode, and a second conductive layer formed on the insulating layer and including a second inductor pattern. The first and second inductor patterns are connected in parallel through via conductors penetrating the insulating layer.

Electronic component

In an electric component embedded structure, a first electrode terminal provided on a first main surface includes an intra-area terminal, and the intra-area terminal is electrically connected to an overlap portion of an overlap wiring in a formation area of an electric component. Accordingly, a decrease in mounting area of the electric component embedded structure is achieved. The intra-area terminal can be electrically connected to a second electrode terminal provided on a second main surface via a first via-conductor, the overlap wiring, and a second via-conductor. The intra-area terminal is connected to a wiring (an overlap wiring) of a first insulating layer without additionally providing a rewiring layer causing an increase in thickness, and the increase in thickness is curbed, whereby a decrease in size of the electric component embedded structure is achieved.

Electric component embedded structure

A thin-film capacitor includes an insulating base member, and a capacitance portion that is laminated on the insulating base member has a plurality of internal electrode layers which are laminated on the insulating base member and are provided in a lamination direction and dielectric layers which are sandwiched between the internal electrode layers. A relative dielectric constant of the dielectric layers is 100 or higher.

Thin-film capacitor and method for manufacturing thin-film capacitor

Growing community of inventors

Tokyo, Japan

Kenichi Yoshida