Matsushita Electric Industrial Co., Ltd.

Panasonic Corporation

Panasonic Intellectual Property Management Co., Ltd.

Kenichi Yamamoto

Daisuke Suetsugu

Yoshihiko Yagi

Hidehiro Yoshida

Takaaki Higashida

Hiroyuki Otani

Daido Komyoji

Takashi Imanaka

Nobuya Matsutani

Kazuki Fukada

Munekazu Nishihara

Michio Ohba

Takeshi Kita

Hirotaka Hisamura

Kenichi Sato

Tohru Nakagawa

Takafumi Okuma

Kazunobu Irie

Toshinari Nitta

Teiichi Kimura

Kazuhiro Uji

Koichi Tsurumi

Miyuki Nagaoka

Jun Katsube

Michiro Yoshino

Shinsuke Itoi

Hisayoshi Watanabe

Keizaburo Kuramasu

Seiji Nakashima

Osamu Sengoku

Toru Uchida

In a common chamber () for distributing, to respective pressure chambers (), an ink supplied from the ink inlet (), resistant walls () are provided in areas that are located ahead and behind of the flow of the ink, i.e., areas around inlets of flow channels () that lead to respective pressure chambers (), and any resistance against the flow of the ink is generated according to the heights of the resistant walls (), thereby capturing a solid ingredient () included in the ink. In this case, by adjusting the heights of the resistant walls () to control capabilities of introducing the solid ingredient (), it becomes possible to dispense desired amounts of the solid ingredient () to the respective pressure chamber ().

Inkjet head and coating apparatus using same

An inkjet head, includes: a pressure chamber communicating with an ink flow channel; a diaphragm linked to the pressure chamber; a piezoelectric element linked to the diaphragm; a nozzle communicating with the pressure chamber; and a vibrating mechanism placed in the ink flow channel and vibrates a supplied ink. Further provided is an inkjet device, including: the above inkjet head; a holding unit that holds a coating object; a moving mechanism that causes relative movement between the inkjet head and the holding unit; and a control unit that controls the inkjet head, the holding unit, and the moving mechanism.

Inkjet head and inkjet device

A plurality of ink-jet heads are displaced over time on a line scan head loaded with the ink-jet heads, leading to lower printing accuracy. A plurality of uneven portions are formed in parallel with a print-scan direction on the faying surfaces of the ink-jet heads and a head plate loaded with the ink-jet heads, allowing a displacement made over time after positioning to be guided in the print-scan direction. This can suppress a displacement in a direction orthogonal to the print-scan direction, achieving an ink-jet apparatus that can keep high printing accuracy using this solution.

Ink-jet apparatus

An inductance component is disclosed. This inductance component includes base made of insulating material, coil section buried in base, and external electrode terminals electrically coupled to the ends of coil section. Stress buffering section is provided on the exposed interface between base and external electrode terminals, and this stress buffering section can ease the stress produced by the difference in thermal coefficients due to temperature changes. The foregoing structure thus allows improving the reliability of the inductance component with respect to a thermal shock.

Inductive component and method for manufacturing the same

A configuration includes a first sheet substrate, on which a first thin film electronic component is formed on at least one main face, and an external connection terminal for connecting to an external circuit is formed one main face or the other face; a second sheet substrate, on which a second thin film electronic component is formed on at least one face; an insulator connection resin layer for fixing the first sheet substrate and the second sheet substrate opposing the first thin film electronic component against the second thin film electronic component; and an interlayer connection conductor for electrically connecting electrode terminals, which have been set in advance, of the first thin film electronic component and the second thin film electronic component.

Sheet-like composite electronic component and method for manufacturing same

A capacitor-equipped semiconductor device includes a semiconductor chip having a plurality of electrode terminals; a sheet-like substrate at least having a film capacitor; and a mounting substrate. The mounting substrate is provided on one side thereof with chip connection terminals and ground terminals. The chip connection terminals are disposed to correspond to the electrode terminals of the semiconductor chip. The ground terminals are disposed to correspond to the one electrode terminals of the film capacitor of the sheet-like substrate. The mounting substrate is provided on the other side thereof with external connection terminals connected to the chip connection terminals and the ground terminals and used to mount the mounting substrate on an external substrate.

Semiconductor device having a mounting substrate with a capacitor interposed therebetween

First sheet-like substrate is arranged at a region surrounded by first terminals of male connector and first circuit substrate, and second sheet-like substrate is arranged at a region surrounded by second terminals of female connector and second circuit substrate, and male connector and female connector are fitted together so that a first passive element of first sheet-like substrate and a second passive element of second sheet-like substrate configure a filter circuit.

Electronic circuit connection structure and its manufacturing method

The inductance component has a base material, a coil formed in the base material and an electrode electrically connected to the coil. In addition, an impact-absorption layer is disposed between the electrode and the base material. Forming impact-absorption layer between the base material and the electrode allows the base material to have flexibility even if an impact is given on the base material, providing the component with high impact-resistance.

Inductance component

A connecting structure includes a circuit board with a first connection land having a plurality of conductor patterns on the surface thereof, a second connection land disposed in a position opposite to the first connection land of the circuit board, and a flexible board including an insulating layer formed so as to surround at least a part of outer periphery of the second connection land. The first connection land and the second connection land are bonded to each other with a bonding member, and the insulating layer is thicker than the total thickness of the second connection land and the first connection land. It is possible to obtain an electronic circuit connecting structure which is free from short-circuit due to running of the bonding member such as solder even with the connecting land greatly reduced in size, and its connecting method.

Electronic circuit connecting structure, and its connecting method

A circuit substrate has a flexible thin film, electric wires supported on the film, and an electronic component supported on the film and positioned between the wires so that the wires and the component are electrically connected serially. Also, a thickness of the component is less than that of the electric wires.

Circuit substrate and its manufacturing method

To provide a card-type recording medium which is capable of increasing memory capacity and excellent in rigidity and shock resistance, and to provide a method for manufacturing the same. A card-type recording medium comprising a memory modulewhich is so constituted that a plurality of memory chipsare mounted on a memory boardis mounted on one surface of a base boardand an IC chipfor controlling operation of the plurality of memory chips is mounted on the other surface of the base board, with all housed in a package

Card type recording medium and production method therefor

A strengthening land is formed on a semiconductor chip-mounting board corresponding to a non-operating electrode on a semiconductor chip. The strengthening land and the non-operating electrode are bonded with each other, thereby improving a bonding strength between the semiconductor chip and the semiconductor chip-mounting board.

Semiconductor chip&mdash;mounting board

A capacitor ( ) using a flexible substrate ( ) includes a hole portion ( ) formed in a dielectric ( ) to connect an upper electrode ( ) to an external leader electrode ( ). At least part of the hole portion ( ) extends from its lower end to upper end at an inclination between 0.1 and 20&deg; with respect to a top surface of the external leader electrode ( ). Then, an upper end corner of an inclined wall surface of the upper electrode ( ), which inclines along the hole portion ( ) of the dielectric ( ), has a downward inclination between 0.1 and 20&deg;. A lower end corner of the inclined wall surface of the upper electrode ( ), which inclines along the hole portion of the dielectric ( ), has an upward inclination between 0.1 and 20&deg;. As a result, stress concentration on the corners of the upper electrode ( ) is drastically reduced to prevent the upper electrode ( ) from cracking.

Capacitor and manufacturing method thereof

Method for mounting a semiconductor chip to a semiconductor chip-mounting board

A strengthening land is formed on a semiconductor chip-mounting board corresponding to a non-operating electrode on a semiconductor chip. The strengthening land and the non-operating electrode are bonded with each other, thereby to improving a bonding strength between the semiconductor chip and the semiconductor chip-mounting board.

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Osaka, Japan

Kenichi Yamamoto