Tokyo Electron Limited

Tokyo Electron Kabushiki Kaisha

Tokyo Electron Tohoku Kabushiki Kaisha

Tokyo Electron Sagami Limited

Tel Sagami Limited

Kabushiki Kaisha Toshiba

Nichias Corporation

Toshiba Ceramics Co., Ltd.

Tokyo Electron Tohoku Limited

Tokyo Electron Kabushiki

Kenichi Yamaga

Takanori Saito

Makoto Kobayashi

Ken Nakao

Takanobu Asano

Katsumi Ishii

Kazunari Sakata

Tsuyoshi Takizawa

Kazuhide Hasebe

Hiroyuki Yamamoto

Akihito Yamamoto

Tomohisa Shimazu

Wataru Ohkase

Takashi Tanahashi

Takashi Ichikawa

Yukimasa Saito

Hironobu Nishi

Hisaei Osanai

Toshiyuki Makiya

Masahiro Miyashita

Yuichi Mikata

Syuji Moriya

Akira Sasaki

Katsutoshi Ishii

Wenling Wang

Daisuke Ikeda

Kazuo Terada

Katsuhiko Mihara

Hiroyuki Honma

Yoshinori Kusakabe

Osamu Tanigawa

Yuji Ono

Masaharu Abe

Yoshinori Mochizuki

Katsuo Nishi

Shozo Ito

Jyunichi Kakizaki

Naotaka Ogino

Toshiki Kobayashi

Yasuhiro Inatomi

Takahiro Koike

Masashi Fumoto

Kazutoshi Sawado

Disclosed is a method of manufacturing a heat insulation wall body, by which the heat insulation wall body can be manufactured economically. The method is a manufacturing method of a heat insulation wall body having a groove portion formed by a first side wall, a second side wall and a groove bottom. The method includes dispersing and mixing a heat insulating material in an aqueous medium to prepare a slurried heat insulating material, bringing a molding die having a vent and a surface corresponding to a shape of the groove portion, into the obtained slurried heat insulating material, and dehydrating the slurried heat insulating material via the vent, and releasing the molding die from the heat insulating material to prepare the heat insulation wall body in which a depth of the groove portion is fixed, and a width of the groove bottom is varied in a longitudinal direction of the groove portion.

Manufacturing method of heat insulation wall body and heat insulation wall body

A substrate processing apparatus that performs a film formation process on a substrate placed on one side of a rotary table includes: a main heating mechanism configured to heat the substrate; an auxiliary heating mechanism configured to adjust an intensity of light irradiated from the auxiliary heating mechanism in an inward/outward direction of the rotary table; a temperature measurement part configured to detect a temperature distribution of the substrate in the inward/outward direction of the rotary table; a position detection part configured to detect a position of the rotary table in a rotational direction of the rotary table; and a control part configured to control the intensity of the light irradiated from the auxiliary heating mechanism based on a temperature measurement data obtained by the temperature measurement part, a data corresponding to a target temperature distribution of the substrate, and a position detection value detected by the position detection part.

Substrate processing apparatus, substrate processing method and storage medium

A heat treatment furnace includes: a processing vessel configured to accommodate therein at least one object to be processed; a cylindrical heat insulating member covering a periphery of the processing vessel; and a heater disposed along an inner circumferential surface of the heat insulating member. The heater includes strip-shaped corrugated heater elements disposed along the inner circumferential surface of the heat insulating member, each of the heater elements having valley portions protruding outward and mountain portions protruding inward.

Heat treatment furnace and heat treatment apparatus

A thermal processing apparatus including: a cylindrical processing vessel; a support unit to be loaded into and unloaded from the vessel; and a heating furnace surrounding an outer periphery of the vessel, with a cooling space therebetween. The furnace is connected to a cooling-gas introduction unit, including a gas introduction passage to which a blowing fan is connected, for introducing a cooling gas into the cooling space during a temperature lowering operation after a thermal process. The furnace is connected to a cooling-gas discharge unit, including a heat exchanger, a suction fan, and a gas discharge passage, for discharging the cooling gas of a raised temperature from the cooling space. Connected to the gas discharge passage at a position upstream of the heat exchanger is a temperature-lowering gas introduction unit for introducing a temperature-lowering gas to the cooling gas of a raised temperature so as to lower its temperature.

Thermal processing apparatus and cooling method

A thermal processing furnace comprises: a tubular heat insulation membersurrounding a processing vesselfor receiving and thermally processing an object to be processed w; a heating resistorhelically arranged on an inner circumferential surface of the heat insulation member; and a support memberdisposed on the inner circumferential surface of the heat insulation member, the support membersupporting the heating resistorsuch that the heating resistorcan be thermally expanded and thermally shrunk. The thermal processing furnace further comprises: a movement prevention memberdisposed on the heating resistorto be in contact with one side surface of the support memberso as to prevent a downward movement of the heating resistor

Thermal processing furnace

A heat treatment apparatus with a process chamber, a tubular heater, a heat exhaust system and a cooling section. The heater surrounds an outer circumference of the process chamber. The heat exhaust system exhausts an atmosphere in a space between the heater and the process chamber. The cooling section blows a cooling fluid into the space to cool the atmosphere. The heater includes a tubular heat insulator, a heat generating resistor on an inner circumference of the heat insulator, and an outer shell provided on an outer circumference of the heat insulator. The cooling section includes at least one annular flow path between the heat insulator and the outer shell, and an outlet in the heat insulator. The outlet blows cooling fluid toward a vertical central axis of the heat insulator, or in a direction oblique to the direction toward vertical central axis of the heat insulator.

Heat treatment apparatus, heater, and method for manufacturing the heater

The present invention provides a heating apparatus for heating objects to be processed, which can detect a temperature of the objects to be processed with higher precision and accuracy, thereby to achieve higher precision temperature control. A heating apparatusincludes a processing vesselconfigured to contain therein a plurality of objects W to be processed, the objects W including objectstoto be processed for temperature measurement, each objecttohaving each corresponding elastic wave elementto, a heating meansadapted for heating the objects W to be processed, and a holding meansadapted to hold the objects W to be processed. To the processing vessel, a transmitter antennaadapted to transmit an electric wave for measurement toward each elastic wave elementto, and a receiver antennaadapted to receive an electric wave having a frequency corresponding to the temperature and generated from each elastic wave elementtoare provided. A temperature analyzeradapted to obtain the temperature of the wafers W to be processed for temperature measurement is connected with the receiver antenna, and a temperature control unitadapted to control the heating meansis in turn connected with the temperature analyzer

Heating apparatus for heating objects to be heated, heating method for heating the objects to be heated, and storage medium in which computer-readable program is stored

A thermal processing apparatus comprising a processing vessel containing, in addition to a plurality of objects subject to heat treatment, an acoustic wave device for temperature measurement. A holding unit holds the plurality of objects to be processed and an object for temperature measurement utilizing an acoustic wave device. A heating unit heats the objects to be processed and the object for temperature measurement. A first conductive member functions as an antenna for transmitting an electromagnetic wave toward the acoustic wave device in the processing vessel; a second conductive member functions as a receiver antenna for receiving an electromagnetic wave dependent on a temperature of the acoustic wave device which is emitted from the acoustic wave device. A temperature analysis part obtains a temperature of the object based on the electromagnetic wave received by the receiver antenna, and a temperature control part controls the heating unit. The first and second conductive members are each part of the thermal processing parts in the processing vessel.

Thermal processing apparatus and thermal processing method for object to be processed

There is provided a heat processing furnace capable of quickly increasing and decreasing a temperature, while achieving improvement in durability. A heat processing furnacecomprises: a processing vesselfor accommodating an object to be processed w and performing thereto a heat process; and a cylindrical heaterdisposed to surround an outer circumference of the processing vessel, for heating the object to be processed w. The heaterincludes a cylindrical heat insulating member, and heating resistorsarranged along an inner circumferential surface of the heat insulating member. Each of the heating resistorsis formed of a strip-shaped member that is bent into a waveform having peak portions and trough portions. Pin membersare arranged in the heat insulating memberat suitable intervals therebetween, the pin membersholding the heating resistorsuch that the heating resistoris movable in a radial direction of the heater.

Heat processing furnace and vertical-type heat processing apparatus

The present invention is a heat processing furnace comprising: a processing vessel for accommodating an object to be processed and performing thereto a heat process; and a cylindrical heater disposed to surround a circumference of the processing vessel, for heating the object to be processed; wherein: the heater includes a cylindrical heat insulating member, ribbed shelf sections that are axially formed in a tier-like manner on an inner circumference of the heat insulating member, and heating resistance wires of a helical pattern that are placed along the respective shelf sections; and pin members are arranged in the heat insulating member at suitable intervals therebetween, the pin members holding the heating resistance wires such that the heating resistance wires are movable in a radial direction of the heater, while preventing dropout of the heating resistance wires from the shelf sections.

A heat-processing furnace comprises: a processing vessel for housing an object to be processed to thermally heat the object to be processed; a cylindrical heat insulating member surrounding the processing vessel; a helical heating resistor disposed along an inner circumferential surface of the heat insulating member; and support members axially disposed on the inner circumferential surface of the heat insulating member, for supporting the heating resistor at predetermined pitches. A plurality of terminal plates are disposed outside the heating resistor at suitable intervals therebetween and attached to the heating resistor, the terminal plates radially passing through the heat insulating member to be extended outside. A plurality of fixing plates are disposed outside the heating resistor at suitable intervals therebetween and attached to the heating resistor, the fixing plates being fixed in the heat insulating member. The fixing plates are attached to the heating resistor by the same attachment structure as the attachment structure of the terminal plates to the heating resistor.

Heat-processing furnace and manufacturing method thereof

Heater for semiconductor manufacturing

A heat treating device () has a cooling sleeve that covers a treating vessel () and a heater (). The cooling sleeve has a cylindrical base member () and a cooling pipe () spirally wound on the outer peripheral surface hereof. The cooling pipe () is brazed to the base member ().

Cooling device and heat treating device using the same

The present invention is a thermal processing unit including: a heating-furnace body whose upper end has an opening; a heating unit provided on an inside wall of the heating-furnace body; a reaction container consisting of a single tube contained in the heating-furnace body; a gas-discharging-pipe connecting portion formed at an upper portion of the reaction container; and a first temperature controlling unit provided around the gas-discharging-pipe connecting portion.

Thermal processing unit

The present invention is a thermal processing unit including: a heating-furnace body whose upper end has an opening; a reaction tube consisting of a single tube contained in the heating-furnace body; a gas-discharging-unit connecting portion formed at an upper portion of the reaction tube, the gas-discharging-unit connecting portion having a narrow diameter; a substrate-to-be-processed supporting member for supporting a substrate to be processed, contained in the heating-furnace body; and a heating unit for heating the substrate to be processed supported by the substrate-to-be-processed supporting member. The heating unit has: a first heating portion arranged around the reaction tube, a second heating portion arranged around the gas-discharging-unit connecting portion, a third heating portion arranged around an upper portion of the reaction tube, a fourth heating portion arranged around a lower portion of the reaction tube, and a fifth heating portion arranged under the substrate-to-be-processed supporting member.

Heat treatment apparatus

Growing community of inventors

Nirasaki, Japan

Kenichi Yamaga