Hitachi Engineering Services Co., Ltd.

Kawamura Sangyo Co., Ltd.

Kenichi Watanabe

Miyoshi Yokura

Satoru Nakanishi

Masashi Kato

Hisashi Katsumata

Kenichirou Tada

Taku Yamaga

Shun Ito

A low-temperature plasma treatment is applied to a surface of an aramid paper so as to allow the surface to have a compositional atomic ratio X (O/C) of the number of oxygen atoms (O) to the number of carbon atoms (C) ranging from 110% to 220% of a theoretical atomic ratio. The treatment is performed at an intensity ranging from 120 to 1500 W&#xb7;min/mwith a low-temperature plasma treatment apparatus of internal electrode system. The aramid paper is superposed with a nonhydrolyzable resin film and the resulting article is pressurized to give an aramid-resin film laminate. The laminate is inexpensive, has both superior electrical properties and high mechanical strength, excels in elasticity, and is useful as an insulation material.

Method of manufacturing adhesive-free laminate of aramid paper and polyphenylene sulfide film, and insulation material and insulation structure for rotating electric machinery

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Ibaraki, Japan

Kenichi Watanabe