Fujitsu Corporation

Kenichi Uesugi

Atsushi Kaneko

Toshimitsu Kobayashi

Hideki Sonobe

Yoshihisa Nakagawa

Takashi Mori

A heat dissipation device includes: a first plate with a first surface on which a first heat dissipation fin is formed; a second plate with a first surface on which a second heat dissipation fin is formed, and a heat conduction unit that passes through a first through-hole of the first plate and a second through-hole of the second plate.

Heat dissipation device, electronic device, and base station device

A base station, includes: an electronic unit; a housing, including a resin, configured to accommodate the electronic unit; a valve, provided in the housing and including a communication channel communicating an inside of the housing with an outside, configured to open the communication channel if an internal pressure of the housing exceeds a value.

Growing community of inventors

Yokohama, Japan

Kenichi Uesugi