Growing community of inventors

Suita, Japan

Kenichi Ueda

Average Co-Inventor Count = 3.82

ph-index = 4

The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.

Forward Citations = 60

Kenichi UedaDaisuke Atobe (5 patents)Kenichi UedaToshio Awaji (4 patents)Kenichi UedaTomohisa Abe (3 patents)Kenichi UedaKatsumi Kohama (3 patents)Kenichi UedaMinoru Yamaguchi (3 patents)Kenichi UedaTomomasa Kaneko (2 patents)Kenichi UedaHidemitsu Takizawa (2 patents)Kenichi UedaTakao Omi (2 patents)Kenichi UedaRyoichi Yugami (2 patents)Kenichi UedaYuji Inagaki (2 patents)Kenichi UedaShinji Hayashi (1 patent)Kenichi UedaMikiya Okada (1 patent)Kenichi UedaMasatoshi Yoshida (1 patent)Kenichi UedaShunsuke Sega (1 patent)Kenichi UedaYoshikazu Kondoh (1 patent)Kenichi UedaTomonobu Sumino (1 patent)Kenichi UedaAkio Naka (1 patent)Kenichi UedaHiromi Tanaka (1 patent)Kenichi UedaYoshinori Hayashi (1 patent)Kenichi UedaTeruyuki Kanto (1 patent)Kenichi UedaKazuo Kishino (1 patent)Kenichi UedaHiroo Ebisawa (1 patent)Kenichi UedaKazumi Fujioka (1 patent)Kenichi UedaTomomi Makino (1 patent)Kenichi UedaMasahiro Tatsuzawa (1 patent)Kenichi UedaMitsushi Sogabe (1 patent)Kenichi UedaHideo Asano (1 patent)Kenichi UedaShigeo Otome (1 patent)Kenichi UedaYoshinori Nakahira (1 patent)Kenichi UedaKimiko Watanabe (1 patent)Kenichi UedaKiyoshi Ito (1 patent)Kenichi UedaShingo Kataoka (1 patent)Kenichi UedaKenichi Ueda (14 patents)Daisuke AtobeDaisuke Atobe (7 patents)Toshio AwajiToshio Awaji (11 patents)Tomohisa AbeTomohisa Abe (13 patents)Katsumi KohamaKatsumi Kohama (7 patents)Minoru YamaguchiMinoru Yamaguchi (5 patents)Tomomasa KanekoTomomasa Kaneko (5 patents)Hidemitsu TakizawaHidemitsu Takizawa (2 patents)Takao OmiTakao Omi (2 patents)Ryoichi YugamiRyoichi Yugami (2 patents)Yuji InagakiYuji Inagaki (2 patents)Shinji HayashiShinji Hayashi (43 patents)Mikiya OkadaMikiya Okada (18 patents)Masatoshi YoshidaMasatoshi Yoshida (18 patents)Shunsuke SegaShunsuke Sega (15 patents)Yoshikazu KondohYoshikazu Kondoh (12 patents)Tomonobu SuminoTomonobu Sumino (11 patents)Akio NakaAkio Naka (11 patents)Hiromi TanakaHiromi Tanaka (11 patents)Yoshinori HayashiYoshinori Hayashi (9 patents)Teruyuki KantoTeruyuki Kanto (8 patents)Kazuo KishinoKazuo Kishino (8 patents)Hiroo EbisawaHiroo Ebisawa (7 patents)Kazumi FujiokaKazumi Fujioka (7 patents)Tomomi MakinoTomomi Makino (7 patents)Masahiro TatsuzawaMasahiro Tatsuzawa (6 patents)Mitsushi SogabeMitsushi Sogabe (5 patents)Hideo AsanoHideo Asano (5 patents)Shigeo OtomeShigeo Otome (5 patents)Yoshinori NakahiraYoshinori Nakahira (5 patents)Kimiko WatanabeKimiko Watanabe (4 patents)Kiyoshi ItoKiyoshi Ito (4 patents)Shingo KataokaShingo Kataoka (2 patents)
..
Inventor’s number of patents
..
Strength of working relationships

Company Filing History:

1. Nippon Shokubai Co., Ltd. (6 from 1,335 patents)

2. Nippon Shokubai Kagaku Kogyo Co., Ltd. (6 from 236 patents)

3. Honda Giken Kogyo Kabushiki Kaisha (3 from 10,092 patents)

4. Sharp Kabushiki Kaisha Corporation (1 from 25,601 patents)

5. Dai Nippon Printing Co., Ltd. (1 from 3,207 patents)

6. Tanazawa Hakkosha Co., Ltd. (1 from 11 patents)


14 patents:

1. 9434094 - Molding die and method for manufacturing same

2. 7972680 - Resin composition and film

3. 7371783 - Alkali-soluble maleimide copolymer and liquid crystal display comprising the same

4. 6774192 - Photosensitive resin composition, its use, lactone-ring-containing polymer, and production process therefor

5. 6669320 - Serial recording apparatus

6. 6417306 - Transparent heat-resistant resin and production process therefor

7. 5998556 - Raw material used for producing heat-resistant resins, heat-resistant

8. 5407610 - Method for molding fiber-reinforced resin

9. 5234756 - Sheet for molding fiber-reinforced resin

10. 5211893 - Method for molding resin reinforced with fiber and moldings produced

11. 5153277 - Resin composition

12. 5082598 - Resin composition of high storage stability

13. 4980416 - Composition of unsaturated ester, polymerizable crosslinking agent and

14. 4837280 - Curable resin composition with a thiuram and a copper compound as

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