Shin-etsu Chemical Co., Ltd.

Shin-etsu Chemical C O., Ltd.

Kenichi Tsuji

Kunihiro Yamada

Nobuaki Matsumoto

Shota Akiba

Hiroaki Kizaki

Munenao Hirokami

Nobu Kato

Mitsuhiro Iwata

Keita Kitazawa

A thermally conductive silicone composition that has high thermal conductivity and excellent workability and misalignment resistance, and contains, in specific ratios:

Thermally conductive silicone composition and production method therefor

Provided are a thermal conductive silicone composition having a favorable heat dissipation property; and a semiconductor device using such composition. The thermal conductive silicone composition contains:

Thermal conductive silicone composition and semiconductor device

Provided is a thermal conductive silicone composition containing:

Thermal conductive silicone composition, semiconductor device, and method for manufacturing semiconductor device

With respect to an addition-curable thermally conductive silicone composition in which a silver filler is blended, a catalyst having a specific structure and an organohydrogen polysiloxane having a specific structure are used for the purpose of extending the working life at room temperature, while maintaining the flexibility, so that a thermally conductive silicone composition which is able to have a good balance between flexibility after curing and storage stability in one pack, while having extremely low thermal resistance and excellent reliability is achieved.

Thermally conductive silicone composition

This thermally-conductive silicone composition comprises: (Rrepresents an alkyl group, and a is 5-100) and of which one end is trifunctional,  (Rrepresents H or a monovalent hydrocarbon group, and Rrepresents a monovalent organic group). The composition can inhibit the decrease of the curing speed. A cured product of the composition has a small hardness increase when being aged at a high temperature, and has a small heat resistance increase after undergoing a heat cycle test.

Thermally-conductive silicone composition

Provided is a thermal conductive silicone composition exhibiting no peeling of a heat dissipation grease and capable of maintaining a low thermal resistance, even under a severe condition. The thermal conductive silicone composition contains:

Thermal conductive silicone composition

Provided is a thermal conductive silicone composition having a superior thermal conductivity. The thermal conductive silicone composition contains:

Provided is a heat conductive silicone composition disposed between a heat generating electronic component and a member for dispersing heat, wherein the heat conductive silicone composition contains (A) an organopolysiloxane having at least two alkenyl groups in one molecule and having a dynamic viscosity at 25&#xb0; C. of 10 to 100,000 mm/s, (B) a hydrolyzable dimethylpolysiloxane having three functional groups at one end expressed by formula (1), (C) a heat conductive filler having a heat conductivity of 10 W/m&#xb0; C. or higher, (D) an organohydrogenpolysiloxane expressed by formula (2), (E) an organohydrogenpolysiloxane containing a hydrogen directly bonded to at least two silicon atoms in one molecule other than component (D), and (F) a catalyst selected from the group consisting of platinum and platinum compounds. The heat conductive silicone composition provides a cured object having a storage modulus, loss modulus, and coefficient of loss within appropriate ranges; peeling and pump out during heating/cooling cycle tending not to occur, and increases in thermal resistance being suppressed.

Heat conductive silicone composition based on combination of components, heat conductive layer, and semiconductor device

Provided is a thermally-curable heat-conductive silicone grease composition which has a high shape-retaining property in an early stage even when the viscosity of the composition is low (i.e., the composition is easy to apply) in the early stage, and which becomes soft (has low hardness) after being cured. A thermally-curable heat-conductive silicone grease composition comprising, as essential components: (wherein Rrepresents a monovalent hydrocarbon group; Rrepresents an alkyl group, an alkoxyalkyl group, an alkenyl group or an acyl group; n represents 2 to 100; and a represents 1 to 3);

Thermally-curable heat-conductive silicone grease composition

The present invention provides a thermally conductive grease composition which scarcely increases in hardness during high-temperature heating and has a minimized reduction in growth, containing: (Ris a Calkyl group, and a is an integer 5 to 100);

Thermally conductive silicone grease composition

A curable organopolysiloxane composition in grease or paste form, which including: wherein Rmay be the same or different and represents a monovalent hydrocarbon group, Rrepresents an alkyl group, an alkoxyl group, an alkenyl group or an acyl group, a is an integer of 5 to 100, and b is an integer of 1 to 3.

Curable organopolysiloxane composition and semiconductor device

A thermally conductive silicone grease composition comprising: wherein Rrepresents an alkyl group having 1 to 6 carbon atoms and b is an integer of 5 to 100;

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Annaka, Japan

Kenichi Tsuji