Hitachi Chemical Company, Ltd.

Kenichi Tomioka

Nozomu Takano

Katsuyuki Masuda

Masaki Takeuchi

Michitoshi Arata

Tomio Fukuda

Yasuyuki Mizuno

Kazuhito Kobayashi

Daisuke Fujimoto

Shinji Tsuchikawa

Takako Ejiri

Kazuhito Obata

Yoshitsugu Matsuura

Masahiko Suzuki

Sumio Yoshida

Hirokazu Suzuki

A polyamide-imide resin obtained by a process comprising the step of reacting an aromatic diisocyanate with a diimide dicarboxylic acid containing 40 mol % or more of a compound represented by the following general formula (1) and 20 mol % or more of a compound represented by the following general formula (2). 

Polyamideimide resin, adhesive agent, material for flexible substrate, flexible laminate, and flexible print wiring board

A process for production of a flexible laminated sheet having one or more laminated bodies each provided with a metal foil formed on one side of a resin film, the process comprising a coating step in which a varnish containing a polyamic acid and a solvent is coated onto the metal foil to form a coated film, a holding step in which the coated film formed on the metal foil is held, a drying step in which at least a portion of the solvent in the varnish is removed to form a layer composed of a resin composition, and a resin film-forming step in which the layer composed of the resin composition is heated to form a resin film containing a polyimide resin. The conditions for each step from the coating step up to the resin film-forming step are adjusted based on a target for the content of metal elements in the resin film.

Flexible laminate board, process for manufacturing of the board, and flexible print wiring board

The present invention relates to a thermosetting resin composition comprising: (1) a metal salt of a disubstituted phosphinic acid, and (2) a resin having a dielectric constant of 2.9 or less at a frequency of 1 GHz or more, and a prepreg and a laminated board using the same.

Thermosetting resin composition, and prepreg and laminated board using the same

A resin composition comprising a cyanate compound (A) having 2 or more cyanato groups in the molecule; a phenol compound (B); a silicone polymer (D) having at least one siloxane unit selected from the group consisting of a tri-functional siloxane unit represented by the formula RSiOand tetra-functional siloxane unit represented by SiO, polymerization degree of 7,000 or less, and at least one terminal functional group reactive with hydroxyl group; and inorganic filler (E).

Resin composition with excellent dielectric characteristics, process for producing resin composition, varnish prepared from the same, process for producing the same, prepeg made with these, and metal-clad laminate

An epoxy resin composition for a printed circuit board includes an epoxy resin; a multi-functional phenol group; a hardening accelerator; and at least one of a compound having a triazine or isocyanurate ring, and a compound containing less than 60 weight percent nitrogen, but not containing a urea derivative. A printed circuit board comprising the epoxy resin composition has low water absorption, excellent heat endurance, and a good adhesion with copper foil.

Epoxy resin compositions for printed circuit board and printed circuit board using the same

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Chikusei, Japan

Kenichi Tomioka