Japan Display Inc.

Kenichi Takemasa

Kazuyuki Yamada

Keisuke Asada

Daiki Isono

Yasushi Nakano

Hideaki Abe

Kota Uogishi

According to an aspect, a manufacturing method of a display device includes: obtaining a first reference position on a surface of a holding substrate based on positions of a plurality of first alignment marks of the holding substrate; and aligning the holding substrate with a transfer destination substrate such that the first reference position on the holding substrate and a second reference position on a surface of the transfer destination substrate coincide. The holding substrate is sectioned into a plurality of first sections and a plurality of second sections when viewed from one direction. Each of the first sections is provided in a part of a gap between the second sections when viewed from the one direction, has a light transmission rate higher than a light transmission rate of the second sections, and forms the first alignment mark through which light passes when viewed from the one direction.

Manufacturing method of display device and holding substrate

According to one embodiment, a method of mounting electronic components, includes placing a workpiece comprising an insulating substrate including a first surface, a circuit board including a terminal portion and a spacer, a sapphire substrate including a second surface and a wafer including the electronic components, bringing the pressure jig into contact with a part of the sapphire substrate to apply a load on a contact part between a part of an upper surface of the spacer and the second surface, pressing the sapphire substrate toward the circuit board with the pressure jig, to bring other part of the upper surface of the spacer into contact with the second surface and flatten the sapphire substrate.

Method of mounting electronic component

An LED module has a first layer including a first plane, an LED chip arranged on the first plane, a second layer surrounding the LED chip and including a convex part on the first plane, and a third layer arranged outside the LED chip and overlapping an upper surface of the first layer, a side surface of the second layer, and a part of the upper surface of the second layer. In the LED module, a height of the convex part of the second layer is lower than a height of the upper surface of the LED chip, and the first layer, the second layer and the third layer include conductive films.

LED module

A display device includes a drive circuit on an insulating substrate; a connecting electrode electrically connected to the drive circuit; an LED element electrically connected to the drive circuit via the connecting electrode, and a first light reflecting layer overlapping the LED element and having an inclined surface. The inclined surface reflects light incident on the inclined surface through the LED element toward the connecting electrode. The first light reflecting layer may have a reflectance of 90 percent or more for light at a wavelength of 1.0 μm or more to 1.5 μm or less.

Display device and method for manufacturing the same

A method for manufacturing a display device includes forming a drive circuit to drive an LED element on an insulating substrate; forming a light absorbing layer on the drive circuit; forming an insulating layer covering the light absorbing layer; forming a connecting electrode electrically connected to the drive circuit; arranging the LED element so that the connecting electrode is in contact with a terminal electrode of the LED element; and bonding the connecting electrode and the terminal electrode by irradiating laser light through a semiconductor layer of the LED element to the light absorbing layer.

According to one embodiment, a wafer for electronic components, includes a sapphire substrate including a first surface and a second surface on an opposite side to the first surface and a plurality of electronic components located on a side of the first surface, and the sapphire substrate includes trench portions located between respective adjacent electronic components, and the trench portions extend linearly in plan view.

Wafer for electronic components

Used is a display device having: a support; first and second image light source units mounted on the support; a first half mirror mounted on the support and having a first reflecting surface inclined with respect to an emitting direction of light of the first image light source unit; and a second half mirror mounted on the support and having a second reflecting surface inclined with respect to an emitting direction of light of the second image light source unit. The light emitted from the first image light source unit is reflected by the first reflecting surface and irradiated in a first direction, and the light emitted from the second image light source unit is reflected by the second reflecting surface and irradiated in a second direction different from the first direction. The same image or a different image can be simultaneously displayed at the first and second display regions.

Display device

A wiring substrate includes a substrate, an insulating film stacked on the substrate, an anode pad stacked on a first surface of the insulating film and electrically coupled to an anode of an inorganic light-emitting diode, a cathode pad stacked on the first surface of the insulating film and electrically coupled to a cathode of the inorganic light-emitting diode, and an auxiliary pad provided to the first surface of the insulating film and having electrical conductivity. The auxiliary pad is disposed in a floating state near an end of the anode pad and the cathode pad.

Wiring substrate and display device

According to one embodiment, a display device includes a substrate, a plurality of pixels, a resin layer and a common electrode. The pixels include a plurality of light emitting elements arranged on the substrate and having luminous colors different from each other, respectively. The resin layer is buried in a clearance part between the plurality of light emitting elements provided in each of the pixels. The common electrode is formed of a transparent conductive material covering the resin layer. The resin layer is provided in an island-like shape in each of the pixels.

According to one embodiment, a lighting-emitting element includes a light-emitting portion, a first terminal electrode and a second terminal electrode. The first terminal electrode includes a first cavity portion at a position overlapping a first connection electrode in planar view when the first terminal electrode is brought into contact with the first connection electrode. The second terminal electrode includes a second cavity portion at a position overlapping a second connection electrode in planar view when the second terminal electrode is brought into contact with the second connection electrode.

Light-emitting element and electronic device

According to one embodiment, a display device includes a first display panel including a first display surface, a second display panel opposed to the first display panel, configured to transmit image light emitted from the first display surface, and including a second display surface on a side opposite to a side opposed to the first display surface, and an imaging optical element located between the first display panel and the second display panel, and generating in space an imaging plane where the image light is imaged.

Display device including first and second display panels

A method for manufacturing a display device includes preparing a circuit board including a drive circuit for driving a LED chip, forming a connecting electrode on the circuit board, forming an adhesive layer on the connecting electrode, adhering a terminal electrode of the LED chip on the adhesive layer and joining the connecting electrode and the terminal electrode by irradiating a laser light. The adhesive layer may be formed only on a upper surface of the connecting electrode.

According to one embodiment, a method for controlling an electronic device includes illuminating an object while moving a light emitting area formed by turning on light emitting elements simultaneously, capturing a shadow generated by the object by image sensing elements on a same substrate as the light emitting elements, and creating three-dimensional data about an outer shape of the object based on a shadow image.

Growing community of inventors

Tokyo, Japan

Kenichi Takemasa