Namics Corporation

Hokuriko Toryo Kabushiki Kaisha

Kenichi Suzuki

Haruyuki Yoshii

Osamu Suzuki

Hisao Kondo

Kiminori Yokoyama

Michinori Komagata

Hiromi Hasegawa

Yoshinobu Tanaka

The present invention is to provide a flip chip mounting method which does not cause void formation between a semiconductor chip and a substrate, and in the flip chip mounting method, the method comprising the steps of: (A) drying the substrate; and (B) at least one step of: (1) dispensing uncured sealant at least at a bump pressing portion on the surface of the substrate and/or the entire portion of the substrate where minute irregularities are present; and (2) performing a pressing and the curing of the underfill while maintaining the temperature conditions so that a temperature difference between the semiconductor chip and the substrate does not cause convection substantially in the uncured or curing underfill.

Flip chip mounting method which avoids void formation between a semiconductor chip and a substrate

A cationically polymerizable resin composition which comprises (A) a compound containing at least one ring selected from the group consisting of an oxirane ring and an oxetane ring; (B) an onium salt; (C) an organic peroxide; and (D) an alkaline filler except for a hydroxide.

Cationically polymerizable resin composition

There is disclosed a conductive adhesive comprising (A) conductive particles having a surface of at least one of nickel and nickel-boron alloy, and the surface of which has been subjected to surface treatment with a mixture of a polyoxyalkylene phosphate compound and a polyoxyalkylenealkyl or polyoxyalkylenealkenyl amine or a derivative thereof; (B) an epoxy compound which contains a diglycidyl epoxy compound used as a reactive diluent in an amount of 20 to 70 weight % based on the total amount of the epoxy compound; and (C) a phenolic resin hardener which contains at least one of an alkyl resol phenolic resin and alkyl novolak phenolic resin in an amount of 50% by weight or more based on the total amount of the phenolic resin hardener.

Conductive adhesive and circuit using the same

There is disclosed a composition for forming a protective layer of a dielectric material which comprises:

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Niigata, Japan

Kenichi Suzuki