Toshiba Memory Corporation

Kenichi Sawanaka

Kazuhiro Yoshida

Yoshiharu Matsuda

Masaaki Niijima

Yasuyuki Ozawa

Fuminori Kimura

Masahiro Iijima

A semiconductor memory device includes a housing having a wall, a circuit board located in the housing and spaced from the wall and extending along the surface of the wall, a memory located on the circuit board, a heat conduction member interposed, and compressed, between the wall and the memory. The wall includes an uneven region comprising contact portions contacting the heat conduction member and recess portions located between the contact portions. The recess portions are recessed inwardly of the wall from the ends of the contact portions in a direction away from the location of the memory.

Semiconductor memory device

According to one embodiment, an electronic apparatus includes a first substrate, a second substrate, an electronic component, a housing, and a protruding portion. The first substrate has a first face and a second face and is provided with an opening. The second substrate has a third face configured to face the second face and a fourth face and is configured to be electrically connected to the first substrate. The electronic component is configured to be mounted on the third face and is configured to be disposed at a position overlapping the opening in a direction in which the third face faces. The housing is configured to accommodate the first and second substrates. The protruding portion is provided in the housing and is configured to pass through the opening and be thermally connected to the electronic component.

Electronic apparatus

A semiconductor memory device includes a semiconductor memory unit, a memory controller, a cover unit having a first portion covering the semiconductor memory unit and a second portion covering the memory controller, a first heat conduction member disposed between the semiconductor memory unit and the first portion of the cover unit, and a second heat conduction member disposed between the memory controller and the second portion of the cover. The cover unit has a gap formed between the first and second portions.

Growing community of inventors

Yokohama Kanagawa, Japan

Kenichi Sawanaka