Ebara Corporation

Other

Kabushiki Kaisha Toshiba

Kenichi Sasabe

Koji Ono

Kenichi Shigeta

Shozo Oguri

Masato Kurita

Yasuhisa Kojima

Tadanori Egawa

Naoaki Ogure

Akihisa Hongo

Masayuki Kumekawa

Satoshi Sendai

Kenya Tomioka

Katsumi Tsuda

A polishing apparatus comprises a polishing tool, a substrate holding member, and a sensor for detecting a failure of a substrate to be polished.

Polishing apparatus

Disclosed is a polishing apparatus that comprises a polishing tool, a substrate holding member, a measuring device to measure a drive current of a drive unit while the drive unit drives at least one of the polishing tool and the substrate holding member, and a failure detection unit to detect either jumping of the substrate from the substrate member or breakage of the substrate. While a substrate is held by a substrate holding member and pressed against the polishing tool during a polishing operation, the failure detection unit will detect jumping of the substrate from the substrate holding member or breakage of the substrate based on a comparison of the value of the drive current with a threshold value, or a comparison of a waveform pattern of the drive current with a predetermined waveform pattern.

A substrate such as a semiconductor wafer is plated to fill a metal such as copper (Cu) or the like in interconnection grooves defined in the substrate. An apparatus for plating such a substrate has a plating chamber for holding a plating solution, the plating chamber housing an anode that is immersible in the plating solution held by the plating chamber. A plating solution ejector pipe produces an upward jet of plating solution from a plating solution supplied to the plating chamber from an external source, and a substrate holder removably holds a substrate and positions the substrate such that a surface to be plated of the substrate is held in contact with the jet of plating solution. The plating chamber has a plating solution outlet defined in a bottom thereof for discharging a portion of the supplied plating solution via through-holes defined in the anode and/or around the anode out of the plating chamber.

Method and apparatus for plating substrate and plating facility

Growing community of inventors

Tokyo, Japan

Kenichi Sasabe