Samsung Electronics Co., Ltd.

Kenichi Nagayama

Tomokazu Fukuzaki

Ryosuke Kamitani

Nagahisa Sato

Mitsuharu Kimura

Yukika Yamada

Kenji Takeuchi

Hideki Imamura

Hisanao Usami

Tadao Yagi

Ryuichi Satoh

Takafumi Noguchi

Changhwan Kim

Makoto Odawara

Ryo Iwamuro

Toshihiro Iizuka

A member includes a base material structure and a surface layer on the base material structure. The surface layer includes a particle that includes Y&#x2014;O&#x2014;F. The base material structure includes interface layers in contact with the surface layer. The interface layers of the base material structure include fluorine.

Member, method of manufacturing the same, apparatus for manufacturing the same, and semiconductor manufacturing apparatus

Described is an adsorbent, a vacuum heat insulating material having the same and a refrigerator, which are capable of adsorbing a target material in a reduced pressure environment. A refrigerator includes an outer casing forming an exterior, an inner casing provided inside the outer casing and forming a storage chamber and a vacuum heat insulating material positioned between the outer casing and the inner casing, and including an adsorbent that adsorbs a heat transfer medium. The adsorbent includes a first adsorption component provided to adsorb oxygen, and including a transition metal oxide having an oxygen deficiency structure, and a second adsorption component provided to adsorb moisture.

Adsorbent, vacuum heat insulating material having the same and refrigerator

Example embodiments relate to a gas-adsorbing material capable of reducing the generation amount of combustible gas without deteriorating gas-adsorbing performance, and a vacuum insulation material including the gas-adsorbing material. The gas-adsorbing material may include a metal selected from at least one of Li, V, Zr, or an alloy including the same, which adsorbs a nitrogen gas and is inactivated by moisture as a nitrogen adsorbing agent, and an additive added to the metal. The metal is attached on the particle surface of the additive. The metal may be an alloy including Li and an alkaline-earth metal, for example, Ba&#x2014;Li alloy. The additive absorbs moisture, and is selected from at least one of an inorganic oxide, a transition metal, an oxide of a transition metal, an alloy including a transition metal, and a mixture including a transition metal.

Gas-adsorbing material and vacuum insulation material including the same

A gas adsorbing material particle includes an additive material particle having a moisture adsorption property; and a layer of a gas adsorbing metal disposed on a surface of the additive material particle, wherein the gas adsorbing metal is inactivated by moisture and adsorbs a target gas, wherein an average thickness of the layer of the metal is less than or equal to about 37 micrometers.

Gas adsorbing material particle, gas adsorbing material body, making method of the same and vacuum insulation material including the same

A laminated structure includes a polymer layer comprising at least one layer, a gas barrier layer which has thermal resistance of greater than or equal to about 650 degrees Kelvin per watt and a Young's modulus of greater than or equal to about 100 gigapascals, and a position of a neutral axis represented by the following Equation 1 is in the gas barrier layer.  In Equation 1, y denotes a distance from the top surface of a side compressed in bending to the neutral axis, Ei denotes a Young's modulus of the i-th layer, Si denotes a geometrical moment of area of the i-th layer, Ai denotes a cross-sectional area of the i-th layer, and n denotes a number of layers for the laminated structure, which is an integer of greater than or equal to 5.

Laminated structure and vacuum insulating material including the same

A gas-adsorbing material may increase gas barrier properties for a target gas by reducing a gas-adsorption rate while maintaining gas-adsorption performance. A vacuum insulation material may use the gas-adsorbing material. The gas-adsorbing material may include a gas-adsorbing composition including a copper ion exchanged ZSM-5-type zeolite having a silica to alumina ratio ranging from about 10 to 50 in a framework of zeolite. A ratio of dealuminization of the ZSM-5-type zeolite is at least about 15%, and the gas-adsorbing material is capable of adsorbing at least nitrogen. Furthermore, the gas-adsorbing material may include a calcinated body of a compressed article comprising a gas-adsorbing composition including a copper ion exchanged ZSM-5-type zeolite having a silica to alumina ratio ranging from about 10 to 50 in a framework of zeolite (where a ratio of dealuminization of the ZSM-5-type zeolite is at least about 15%) and a moisture-absorbing material.

A vacuum insulation material including: a core material; and a gas adsorbing agent, wherein the core material and the gas absorbing agent are interposed between a pair of gas barrier materials, wherein at least one of the pair of gas barrier materials includes a quasicrystal metal layer including a quasicrystal metal. The vacuum insulation material may reduce the heat bridge while maintaining high gas barrier properties.

Vacuum insulation material

A vacuum insulation material includes a pair of gas barrier exterior materials, a core material including a cellulose structure having porosity of greater than or equal to about 80% under reduced pressure of about 1 Pa, where the cellulose structure has a unit length of greater than or equal to about 1 &#x3bc;m and less than or equal to about 5 mm in the heat-insulation direction, and the method of manufacturing the same, and a gas adsorption agent, where the core material and the gas adsorption agent are interposed between the pair of gas barrier exterior materials and sealed inside of the pair of gas barrier exterior materials under reduced pressure.

A vacuum insulation includes a core material and a gas adsorption agent interposed between a first gas barrier material and a second gas barrier material, wherein the first and the second gas barrier materials sealingly enclose the core material and the gas adsorption agent, and wherein at least one of the first and the second gas barrier materials includes a laminate including a copper alloy foil and a polymeric material.

A multi-layer thin film assembly including a first layer including a first material, wherein the first material includes at least two kinds of functional groups, and a second layer disposed on the first layer and including a second material that interacts with the at least two kinds of functional groups, and a barrier film including the same.

Multi-layer thin film assembly and barrier film for electronic device including the same

A substrate for a surface light emitting device in which a transparent electrode, an organic thin film layer, and a cathode electrode are sequentially stacked, the substrate including: a transparent support substrate; and a highly refractive layer that is disposed between the support substrate and the transparent electrode and comprises at least one layer having a refractive index that is equal to or greater than a refractive index of the support substrate, wherein the highly refractive layer comprises a light diffusion unit that diffuses light incident from the transparent electrode and a planarized surface that contacts the transparent electrode. Accordingly, a Haze value of the highly refractive layer is set to be 5% or less, and a diameter of bubbles existing in the highly refractive layer is set to be 1/10th or less of a thickness of the highly refractive layer.

Substrate for surface light emitting device and method of manufacturing the substrate, surface light emitting device, lighting apparatus, and backlight including the same

A barrier film for an electronic device includes: a resin film; an adsorption layer disposed on a side of the resin film and including an inorganic material, which is electrostatically chargeable with a positive charge or a negative charge and having higher hydrophilicity than a surface of the resin film; and a stacked layer disposed on a side of the adsorption layer and including a plate-shaped particle layer including an inorganic plate-shaped particle, which is electrostatically chargeable with a positive charge or a negative charge, and a binder layer including a binder particle, which is electrostatically chargeable with a positive charge or a negative charge, where the plate-shaped particle layer and binder layer are alternately stacked.

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Yokohama, Japan

Kenichi Nagayama