Kyocera Corporation

Sony Corporation

Kenichi Nagae

Masahiko Higashi

Noriaki Hamada

Yoshihiro Nakao

Hideto Yonekura

Kouichi Yamaguchi

Masanari Kokubu

Youji Furukubo

Kunihide Shikata

Tsuneo Muchi

Yasuhide Tami

Shinichi Suzuki

Toshihiko Uemura

Hitoshi Kumatabara

Masaki Hayashi

Michio Shinozaki

A ceramic wiring board provided with an insulating layer of a high dielectric constant formed of a ceramic sintered product having a high dielectric constants wherein the ceramic sintered product contains a crystal phase of lanthanum titanate and a glass phase present on the grain boundaries of the crystal phase, and has a coefficient of thermal expansion at 40 to 400&deg; C. of not smaller than 8&times;10 /&deg; C. and a specific inductive capacity at 1 MHz of not smaller than 10. The wiring board contains a capacitor and is very useful in realizing various electric circuit devices in small sizes, and can be further reliably mounted on a printed board that uses an organic resin as an insulating material.

Ceramic wiring board

A glass ceramic sintered product obtained by sintering a mixture powder containing a BaO-containing glass, metal oxide particles having a coefficient of linear thermal expansion at 40 to 400&deg; C. of not smaller than 6 ppm/&deg;C., and a Zr compound and, particularly, containing the Zr compound in an amount of from 0.1 to 30% by weight calculated as Zr0 , and exhibiting a coefficient of linear thermal expansion at 40 to 400&deg; C. of from 8.5 to 18 ppm/&deg;C. The glass ceramic sintered product exhibits excellent resistance against chemicals and does not discolor even when subjected to treatment with an acidic or alkaline solution in the step of plating. A wiring board using the glass ceramic sintered product as an insulating substrate exhibits a coefficient of linear thermal expansion substantially similar to that of an external circuit board, effectively suppressing the occurrence of thermal stress and cracking.

High-thermal-expansion glass ceramic sintered product

A structure for mounting a wiring board in which the wiring board including a ceramics insulating board, metallized wiring layers arranged on said insulating board, and a plurality of connection terminals mounted on said insulating board and electrically connected to said metallized wiring layer, is placed on a mother board having wiring conductors formed on the surface of an insulator which contains an organic resin, and the connection terminals of said wiring board are connected by brazing to the wiring conductors of said mother board, wherein a value F1 defined by the following formula (1):

Structure for mounting a wiring board

A low-temperature calcined ceramic of the present invention comprises a sintered body obtained by calcining a mixture of a glass and an SiO.sub.2 filler such as quartz or cristobalite, wherein the sintered body contains an SiO.sub.2 crystal having an X-ray diffraction image that the peak at the (101) plane of quartz or cristobalite is shifted at least 0.05.degree. (2.theta.) to the lower angle side. The ceramic containing the shifted crystal of quarts or cristobalite does not have a region of abruptly changing the thermal expansion and has a substantially linear thermal expansion curve. Accordingly, when the ceramic is used as an insulating substrate of a wiring boad, there is no possibility of abruptly causing the thermal expansion by heating, etc., at mounting on an external electric circuit boad and the occurrence of the inferior connection, etc., by thermal expansion can be effectively prevented.

Low-temperature calcined ceramics

An aluminous sintered product comprising 70 to 96% by weight of an alumina component and 4 to 30% by weight of additives, said additives including at least the one selected from oxides of elements of the Group 5a of periodic table and at least the one selected from oxides of metals of the iron family and oxides of manganese, titanium, calcium, magnesium, chromium and silica, and said aluminous sintered product exhibiting a volume resistivity of from 1.times.10.sup.7 to 1.times.10.sup.13 .OMEGA.-cm over a temperature range of from 25.degree. to 75.degree. C. and an absolute value of the temperature coefficient of volume resistivity of not larger than 1.8%/.degree.C. under the application of high voltages. The sintered product is used as antistatic part such as conveyer arm, handling jig, tweezers for holding wafers and the like that must not be electrostatically charged in an apparatus for producing semiconductors, and as resistance substrate, electrically conducting material, contact, heater, part in vacuum tubes, and part for electron guns in a CRT such as of TVs and the like.

Alumina sintered product

Growing community of inventors

Kokubu, Japan

Kenichi Nagae