Hamamatsu-photonics K.k.

Yamaha Hatsudoki Kabushiki Kaisha

Hamamatsu Photonics Kabushiki Kaisha

Kenichi Muramatsu

Takeshi Sakamoto

Kazuhiro Atsumi

Naoki Uchiyama

Kenshi Fukumitsu

Fumitsugu Fukuyo

Toshimitsu Wakuda

Takehiro Inoue

Atsushi Kamo

Yoko Takagi

Koji Kuno

Tetsuya Osajima

A vehicle having: a vehicle body; a plurality of light-emitting parts; a light source configured to output a laser beam to the light-emitting parts; a fiber optic cable that constitutes a part of a laser beam path, the fiber optic cable having a most upstream branch portion; a single shared laser driver board controlling laser beam source elements in the single light source; and at least one laser light-emission-manner converter, each disposed in, or downstream of, the most upstream branch portion, to thereby cause each light-emitting part downstream from said each light-emission-manner converter to change a light-emission manner thereof. The laser light-emission-manner converter and/or the single shared laser driver board are at least partially disposed in an in-body covered region, which is disposed further downward than, and in a plan view of the vehicle overlaps, any of a fuel tank, a dummy tank, a foot board, and a seat.

Vehicle

A vehicle that is the leaning vehicle or the straddled vehicle includes a fiber optic cable extending from a laser beam source unit to both a forward light-emitting part and a rearward light-emitting part via a forward-rearward branch portion, the fiber optic cable allowing a laser beam emitted from the laser beam source unit to be branched in the forward-rearward branch portion, and then supplied to both the forward light-emitting part and the rearward light-emitting part. A length of the fiber optic cable between the laser beam source unit and the forward-rearward branch portion is shorter than a total length of the fiber optic cable between the forward-rearward branch portion and the forward light-emitting part and between the forward-rearward branch portion and the rearward light-emitting part in a side view of the vehicle.

Vehicle with centralized laser beam source

A light emitting device for a leaning vehicle, including a pair of cornering lamps, including a first cornering lamp and a second cornering lamp, that emit light to form a single left-front light emission area and a single right-front light emission area, and a control device that controls light emission by the pair of cornering lamps based on a lean angle of the vehicle body. The control device is configured to cause a first quantity of light and a second quantity of light, which are respectively a quantity of light outputted from the at least one light source included in the first cornering lamp and in the second cornering lamp, respectively, to vary in accordance with the lean angle of the vehicle body, such that each of the single left-front light emission area and the single right-front light emission area becomes larger as the lean angle of the vehicle body increases.

Light emitting device

A light emitting device for a leaning vehicle, including a pair of cornering lamps, including a first cornering lamp and a second cornering lamp, that emit light to form a single left-front light emission area and a single right-front light emission area, and a control device that controls light emission by the pair of cornering lamps based on a lean angle of the vehicle body. The control device is configured to cause a first quantity of light and a second quantity of light, which are respectively a quality of light outputted from the at least one light source included in the first cornering lamp and in the second cornering lamp, respectively, to vary in accordance with the lean angle of the vehicle body, such that each of the single left-front light emission area and the single right-front light emission area becomes larger as the lean angle of the vehicle body increases.

A straddle vehicle includes a front fork unit provided to be inclined rearwardly, a front cover provided forwardly of the front fork unit, and having a rear cover member, and a front cover member separately provided from the front cover member and positioned forwardly of the rear cover member, a headlamp provided at the front cover, a holder attached to the rear cover member and holds the headlamp, and a driver that drives the headlamp. The driver stored in the front cover such that the driver is located at a position farther upward than the headlamp, farther rearward than a first virtual line extending in a up-and-down direction through a rear end of the headlamp in a front-to-rear direction of the vehicle, and farther rearward than a second virtual line extending in parallel with an axis of the front fork unit in the side view of the vehicle.

Straddled vehicle

A headlamp device for use in a leaning vehicle, including at least one headlamp that emits light in a front direction, and a pair of cornering lamps that emit light to form left-front and right-front light emission areas. Each of the at least one headlamp includes at least one headlamp light source, and a headlamp housing that stores the at least one headlamp light source and that is arranged inside the front cover. Each cornering lamp includes at least one cornering lamp light source, a light travel direction changing member having a light travel direction changing surface that changes a travel direction of light outputted from the at least one cornering lamp light source, and a cornering lamp housing that stores therein the at least one cornering lamp light source and the light travel direction changing member, and that is arranged inside the front cover. The cornering lamp housing and the headlamp housing are separate from each other.

Headlamp device including headlamp and pair of cornering lamps

A laser processing method which can prevent an object to be processed from being cut along a line to cut from a modified region acting as a cutting start point when separating a suction table and a holding member from each other is provided. An expandable tapeholding an object to be processedwhile being stuck to a frameis secured by suction onto a suction tableof a vacuum chuck with a porous sheetinterposed therebetween. Since the sheethas a Young's modulus lower than that of the table, the tapeis restrained from biting into fine pores of the sheet. As a consequence, even when the tableand tapeare separated from each other by releasing the suction securing after forming a modified region, no strong bending stress acts on the object. This can prevent the objectfrom being cut along a line to cut from the modified regionacting as a cutting start point when separating the tableand tapefrom each other.

Laser processing method

An object to be processedcomprising a substrateand a plurality of functional devicesformed on a front faceof the substrateis irradiated with laser light L while locating a converging point P within the substrate, so as to form at least one row of a divided modified region, at least one row of a quality modified regionpositioned between the divided modified regionand the front faceof the substrate, and at least one row of an HC modified regionpositioned between the divided modified regionand a rear faceof the substratefor one line to cut. Here, in a direction along the line to cut, a forming density of the divided modified regionis made lower than that of the quality modified regionand that of the HC modified region

Laser beam machining method and semiconductor chip

A laser processing method which can accurately cut an object to be processed along a line to cut is provided. A modified regionformed by multiphoton absorption forms a cutting start regionwithin an object to be processedalong a line to cut. Thereafter, the objectis irradiated with laser light Labsorbable by the objectalong the line to cut, so as to generate fracturesfrom the cutting start regionacting as a start point, whereby the objectcan accurately be cut along the line to cut. Expanding an expandable filmhaving the objectsecured thereto separates individual chipsfrom each other, which can further improve the reliability in cutting the objectalong the line to cut

Laser beam machining method

A laser processing method for preventing particles from occurring from cut sections of chips obtained by cutting a silicon wafer is provided. An irradiation condition of laser light L for forming modified regionstois made different from an irradiation condition of laser light L for forming the modified regionstosuch as to correct the spherical aberration of laser light L in areas where the depth from the front faceof a silicon waferis 335 &#x3bc;m to 525 &#x3bc;m. Therefore, even when the silicon waferand a functional device layerare cut into semiconductor chips from modified regionstoacting as a cutting start point, twist hackles do not appear remarkably in the areas where the depth is 335 &#x3bc;m to 525 &#x3bc;m, whereby particles are hard to occur.

A laser processing apparatus comprises a converging lensfor converging processing laser light and rangefinding laser light Ltoward a wafer, an actuator for actuating the lens, a shaping optical systemfor adding astigmatism to reflected light Lof the rangefinding laser light, a quadrant photodiodefor receiving the reflected light Land outputting voltage values corresponding to its light quantities, and a controller for regulating the actuator, and positions a converging point Pof the rangefinding laser light Lbetween a focal point Pof the lens and the lens, so as to make it possible to form a modified region at a position deeper from the front face, thereby suppressing adverse effects due to the reflected light L. The control is based on an arithmetic value subjected to a division by a sum of the voltage values, so as to prevent the arithmetic value from being changed by the quantity of reflected light.

Laser material processing system

A laser processing method which can accurately cut an object to be processed along a line to cut is provided. A modified regionformed by multiphoton absorption forms a cutting start regionwithin an object to be processedalong a linealong which the object is intended to be cut. Thereafter, the objectis irradiated with laser light Ltransmittable through an unmodified region of the object, so as to generate fracturesfrom the cutting start regionacting as a start point, whereby the objectcan accurately be cut along the linealong which the object is intended to be cut. Expanding an expandable filmhaving the objectsecured thereto separates individual chipsfrom each other, which can further improve the reliability in cutting the objectalong the linealong which the object is intended to be cut.

A method of cutting an object to be processed is provided, which can accurately cut an object to be processed comprising a substrate and a multilayer part provided on the front face of the substrate while having a plurality of functional devices into the functional devices along a line to cut in a short time even when the substrate is thick. A substrateis irradiated with laser light L from the multilayer partside while locating a converging point P within the substrate, so as to form a first modified regionshifted from the center position CL in the thickness direction of the substrateto the rear faceside of the substrateand a second modified regionshifted from the center position CL in the thickness direction of the substrateto the front faceside of the substratewithin the substratealong a line to cut, and generate a fracturefrom the second modified regionto the front faceof the substrate. Thereafter, while in a state where an expandable tapeattached to the rear faceof the substrateis expanded, a stress is generated in an object to be processedsuch as to open the fracture

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Hamamatsu, Japan

Kenichi Muramatsu