Sharp Kabushiki Kaisha Corporation

Shenzhen Torey Microelectronic Technology Co. Ltd.

Kenichi Murakoshi

Yoshinao Morikawa

Atsushi Yamashita

Yasuaki Hirano

Tsuyoshi Ono

Makoto Hirota

Hiroyoshi Higashisaka

Yuta Ikawa

Hiroyuki Nabesawa

Hidekazu Fujii

Tatsuya Ishida

Kimitsugu Yoshikawa

Shigeyuki Akase

A voltage application region and a voltage applying pad form withstand voltage measuring wiring lines insulated from each other and different from each other by connecting a seal ring and a relay region through a via, and the withstand voltage measuring wiring lines different from each other are configured to apply a voltage between insulated seal rings provided on wiring layers adjacent to each other by applying a voltage between the voltage application region and the voltage applying pad.

Semiconductor integrated circuit and withstand voltage test method

A location displacement of an electrode of a device relative to an electrode pad of a semiconductor element is detected based on a conduction state between the electrode pad of the semiconductor element and the electrode of the device. The electrode pad of the semiconductor element is segmented into multiple portions and a first pad through a fourth pad uniformly arranged. A location displacement detector determines that no location displacement has occurred when the electrode pad of the semiconductor element is conductive to the electrode of the device, and determines that a location displacement has occurred when the electrode pad of the semiconductor element is non-conductive to the electrode of the device.

Location displacement detection method, location displacement detection device, and display device

Provided is a backlight unit capable of reducing luminance unevenness. The backlight unit includes a plurality of dot light sources and a light guide plate in which a predetermined side surface serves as a light incident surface for introducing light from the plurality of dot light sources. The plurality of dot light sources are classified into a first light source group and a second light source group. A mount point of the first light source group and a mount point of the second light source group are displaced from each other in a thickness direction of the light guide plate. A total luminance of the first light source group is higher than a total luminance of the second light source group.

Backlight unit and display device including the same

An LED substrate comprises holes having an elliptical shape through which fixing screws are inserted. The fixing screw has a head portion, an unthreaded neck portion whose diameter smaller than that of the head portion, and a threaded shaft portion whose diameter smaller than that of the neck portion. A major axis of the hole is larger than the diameter of the head portion, and a minor axis thereof is smaller than the diameter of the head portion and larger than the diameter of the neck portion. The LED substrate further comprises counterbored recesses to which anchoring claws provided in a cabinet are fitted. A width of the counterbored recess in a direction of the major axis of the hole is larger than that of the anchoring claw. The counterbored recesses are formed on both of two sides of the LED substrate facing each other in a first direction.

LED substrate and LED light source device

A nonvolatile semiconductor memory device including associating means for associating a faulty block with a redundant block, a block switching circuit for selecting the associated redundant block when a memory block is associated with the redundant block, an error detection circuit for detecting an error in an accessing operation to the memory block, a faulty block identification circuit for identifying the memory block having the detected error as a faulty block when the error is detected and associating the faulty block with the redundant block in the case where the redundant block which is not associated with the faulty block exists.

Nonvolatile semiconductor memory device having redundant relief technique

Growing community of inventors

Sakai, Japan

Kenichi Murakoshi