Hitachi, Ltd.

Renesas Technology Corp.

Other

Hitachi Media Electronics Co., Ltd.

Kenichi Mizuishi

Natsuki Yokoyama

Yoshio Kawamura

Eiichi Murakami

Yoshifumi Kawamoto

Fumihiko Uchida

Takeshi Kato

Katuaki Chiba

Keizo Suzuki

Yoshinori Nakayama

Naoyuki Kofuji

Kazunori Tsujimoto

Minoru Nagata

Tatsumi Mizutani

Eiichi Seya

Nobuo Hamamoto

Tatsundo Suzuki

Yuuji Fujita

Tadashi Onishi

Yosuke Tyojamori

Takeshi Maeda

Shigeru Nakamura

Masayuki Abe

Katsuya Tanaka

Hiroyuki Itoh

Masahiro Ojima

Takeshi Nakao

Masahide Tokuda

Kenji Nagamatsu

Tadayuki Abe

Hiromi Sugo

Atumi Kawata

Shin Arai

A biometric authentication device includes an accommodation unit and a detection unit in which the accommodation unit accommodates a card-type recording medium providing alternative information alternative to feature information such that the card-type recording medium is faced to the detection unit, with a biologic object absent, and the detection unit detects the alternative information from the card-type recording medium, thereby collating the feature information extracted from an image of the biologic object with the feature information recorded in a memory in the case of placing the finger into the accommodation unit, and collating the alternative information from the card-type recording medium with the alternative information recorded in the memory in the case of placing the card-type recording medium into the accommodation unit.

Biometric authentication device and biometric authentication method

A fabricating method for a system that includes a plurality of processing apparatuses connected to each other by an inter-apparatus transporter and a computer storing managing information of processing and transporting of semiconductor wafers. The processing apparatuses have an interface for loading and unloading a plurality of the semiconductor wafers that are contained in a carrier. The semiconductor waters are processed in processing chambers of the processing apparatuses and the result of processing is monitored. In the processing, a first carrier containing the plurality of the semiconductor wafers having been processed in the first processing apparatus is transported toward the second processing apparatus by the inter-apparatus transporter prior to unloading of a second carrier containing semiconductor wafers processed in the second processing apparatus, according to the managing information.

Fabrication system and fabrication method

A fabricating method for a system including a plurality of processing apparatuses connected to each other by an inter-apparatus transporter. The semiconductor waters are processed in the processing apparatuses and are transported to specified processing apparatuses in different time interval that are set to N times a unit time interval. Since the fabricating system includes processing apparatuses and an inter-apparatus transporter that are periodically controlled at time intervals related to a unit time, intervals related to a unit time, the scheduling of a plurality of works can be made efficiently to enhance the level of optimization, thus improving the productivity.

Disclosed is a fabricating system including a plurality of processing apparatuses connected to each other by means of an inter-apparatus transporter, wherein one group of semiconductor wafers are processed in processing apparatuses and other group of wafers are transported to specified processing apparatuses for a time interval from (To+T) to a time To; and another group of wafers are processed and the remaining group of wafers are transported for a time interval from (To+T) to (To+2T). Since processing apparatuses can receive at least one of works from the inter-apparatus transporter for a time interval T min, the distribution of works from the transporter to processing apparatuses is completed for the time interval T min. The transporter is emptied for each time interval T min, and works are unloaded to the emptied transporter, which makes easy the scheduling, control and management of the transporting of a plurality of works in the fabricating system. Moreover, since the fabricating system including processing apparatuses is periodically controlled at a cycle time T min, the scheduling of a plurality of works can be made easy, to enhance the level of optimization, thus improving the productivity.

Disclosed here is an information providing system for mobile objects. The system obtains information of a moving purpose of the user of each mobile object to provide the user with information matching with the moving purpose. The information providing system comprises route type determining apparatus for determining the type of the current route on which the user is moving, provided information selecting unit for selecting information to be provided to the user according to the route type determined by the route type determining apparatus, and provided information presenting means for presenting the information selected by the provided information selecting unit to the user. Therefore, the user can receive more proper information according to the user's moving purpose at that time, thereby the convenience of the user is improved while the information provider can improve the advertisement effect by transmitting information to more proper users.

Information providing system and information providing apparatus for mobile object

A pulse voltage of duty ratio 5% or below and repetition frequency 400 KHz or above is supplied in order to suppress the notch, charge build-up damage, subtrench and bowing due to the electron shading phenomenon. Thus, a cycle for accelerating electrons occurs in the substrate bias, so that the electron shading phenomenon does not occur.

Surface treatment method and system

Fabrication system and method having inter-apparatus transporter

A radio paging system with voice transfer function for transmitting a voice message input from an ordinary push-button telephone set to a small-sized receive-only unsophisticated radio pager. A paging station is provided to transmit by radio the message from a telephone network to the radio pager as follows: voice information constituting the message is first converted from analog to digital format, compressed, stored in memory, and scrambled by a privacy function part for transmission. The radio pager in turn demodulates the received information, stores it in memory, retrieves a necessary message therefrom as designated, descrambles the designated message from scrambled state, expands the message from compressed state, and outputs the message as an audible output. In this manner, the user carrying the radio pager is able to get the message from the caller without the risk of being tapped by a third party.

Radio paging system with voice transfer function and radio pager

A wafer transport method including the steps of preparing a semiconductor process equipment having a transport chamber, a process chamber, an interface means for connecting the transport chamber to the process chamber, and a transport means for transporting a semiconductor wafer from the transport chamber to the process chamber by way of the interface means; inserting the transport means mounting a substrate in a communicating corridor including a supply means and an exhaust means; and transporting the substrate while performing the supply and exhaust by sequentially controlling a supply shutoff means, an exhaust shutoff means, and a communicating shutoff means according to the position of a conductance part formed of a gap between the transport means and the communicating corridor. With this method, the substrate is transported at a high throughput without the contamination on the substrate while keeping the different atmospheric conditions of the transport chamber and the process chamber, thereby manufacturing a semiconductor device with a high performance.

Wafer transport method

A wafer transport method includes the steps of preparing a semiconductor process equipment having a transport chamber and a process chamber. An interface means connects the transport chamber to the process chamber. A transport means transports a semiconductor wafer from the transport chamber to the process chamber by way of the interface means. The transport means mounting a substrate is inserted into a communicating corridor including a supply means and an exhaust means. The substrate is transported while performing the supply and exhaust by sequentially controlling a supply shutoff means, an exhaust shutoff means, and a communicating shutoff means according to the position of a conductance part formed of a gap between the transport means and the communicating corridor. Thus, the substrate is transported at a high throughput without contamination of the substrate while keeping the different atmospheric conditions for the transport chamber and the process chamber, thereby manufacturing a semiconductor device with high performance capabilities.

A semiconductor device includes a semiconductor substrate having a pair of opposed main surfaces with a wiring conductor provided on one of the main surfaces; the substrate having at least one through hole extending therethrough so as to be perpendicular to the main surfaces; at least one electrically conductive pin provided on the other of the main surfaces at a position of the at least one through hole, and an adhesive filled into the at least one through hole for fixing the at least one conductive pin to the substrate, wherein the at least one conductive pin is connected electrically through the corresponding at least one through hole to the wiring conductor to transmit/receive an electrical signal to/from an external circuit.

Semiconductor substrate having wiring conductors at a first main surface

Growing community of inventors

Hachioji, Japan

Kenichi Mizuishi