Panasonic Intellectual Property Management Co., Ltd.

Kenichi Matsushima

Kenji Ueno

Ryohei Harada

Atsushi Shinkai

Yoshiharu Omori

Yoshiharu Oomori

Takeshi Ichihara

Noritaka Yoshida

Masakatsu Nawate

Nariaki Ishida

A common mode noise filter includes a laminated body including first to fourth insulating layers stacked on one another, first to fourth coil conductors spirally extending and disposed on upper surfaces of the first to fourth insulating layers, respectively, a first via-electrode connecting the first coil conductor to the second coil conductor, a second via-electrode connecting the third coil conductor to the fourth coil conductor, first and second connection parts connecting the first via-electrode to first and second inner ends of the first and second coil conductors, respectively, and third and fourth connection parts connecting the second via-electrode to third and fourth inner ends of the third and fourth coil conductors, respectively. The first connection part overlaps the second connection part when viewed from above. The third connection part overlaps the fourth connection part when viewed from above. The common mode noise filter is operable in high frequencies.

Common mode noise filter

A chip resistor includes an insulating substrate made of alumina, a pair of electrodes disposed on an upper surface of the insulating substrate, a glass glaze layer made of glass disposed on the upper surface of the insulating substrate, and a resistive element disposed on the upper surface of the glass glaze layer. The resistive element is disposed between the pair of electrodes. The softening point of the glass of the glass glaze layer ranges from 580&#xb0; C. to 760&#xb0; C. This chip resistor prevents the resistive element from being peeled off.

Chip resistor

A common mode noise filter includes plural non-magnetic layers stacked in a laminating direction, and first, second, and third coil conductors constituting first, second, and third coils which are formed on the non-magnetic layers and are independent from one another. The first and third coil conductors deviate from the second coil conductor in a direction perpendicular to the laminating direction.

A common mode noise filter includes first to fourth insulator layers stacked in a stacking direction and first to third coils provided on the first to fourth insulator layers independently of one another. The first coil includes a first coil conductor provided on the first insulator layer and a second coil conductor provided on the fourth insulator layer and connected to the first coil conductor. The second coil is provided on the second insulator layer. The third coil is provided on the third insulator layer. The first coil conductor overlaps the second coil viewing from above. At least a part of the second coil overlaps at least a part of the third coil viewing from above. The second coil conductor overlaps the third coil viewing from above.

In a common mode noise filter, first coil () includes first coil conductor () and second coil conductor () with spiral shapes. Second coil () includes third coil conductor () and fourth coil conductor () with spiral shapes. First coil conductor (), third coil conductor (), second coil conductor (), and fourth coil conductor () are placed in this order from above. First metal layer () configured to be connected to a ground is provided above first coil conductor ().

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Hyogo, Japan

Kenichi Matsushima