Panasonic Holdings Corporation

Panasonic Intellectual Property Management Co., Ltd.

Kenichi Maki

Haruhisa Hashimoto

Naoto Imada

The finger electrode is formed by hard-soldered silver paste. The melting point of the first type solder layer provided on the surface of the terminal wiring member is higher than the melting point of the second type solder layer provided on the surface of the wire. The first width, in the first direction, of the second type solder layer in the first portion where the wire is connected to the terminal wiring member is larger than the second width, in the first direction, of the second type solder layer in the second portion where the wire is connected to the finger electrode.

Solar cell module including solar cells

First, first cell wiring members from the first solar cell and second cell wiring members from the second solar cell are sandwiched between a wiring member film and a second bridge wiring member. Subsequently, the first cell wiring members and the second cell wiring members are connected to the second bridge wiring member by applying heat to at least the first cell wiring members, the second cell wiring members, and the second bridge wiring member by induction heating.

Solar cell module manufacturing method and solar cell module

Provided is a solar module with improved reliability. A solar module () is provided with a solar cell (), a wiring member (), a resin adhesive layer (), and a buffer region (). The wiring member () is electrically connected to the solar cell (). The resin adhesive layer () bonds the solar cell () and the wiring member () to one another. The buffer region () is provided at least partially between the wiring member () and the solar cell (). The buffer region () contains a non-crosslinked resin.

Growing community of inventors

Osaka, Japan

Kenichi Maki