Nippon Kayaku Kabushiki Kaisha

Shin-etsu Chemical Co., Ltd.

Gun Ei Chemical Industry Co., Ltd.

Kenichi Kuboki

Yoshio Shimamura

Masataka Nakanishi

Yasumasa Akatsuka

Ryoichi Hasegawa

Yoshitaka Kajiwara

Toshio Shiobara

Tsutomu Kashiwagi

Miyuki Wakao

Yoshihiro Kawada

Junichi Sawada

Yukio Abe

Katsuhiko Oshimi

Yoshiaki Kurimoto

Chie Sasaki

Akiyuki Kojima

Naofusa Miyagawa

Kazuki Matsuura

Eiko Watanabe

Provided is a maleimide resin with superior solution stability. Also provided is a cured product with a superior dielectric characteristic that is obtained by curing a curable resin composition in which said maleimide resin is used. The maleimide resin expressed in formula (1), wherein the N,N′-(phenylene-di-(2,2,-propylidene)-di-p-phenylene) bismaleimide content is 90 area % or less. (In formula (1), n is the number of repetitions, and 1<n<5.)

Maleimide resin, curable resin composition, and cured product thereof

An epoxy resin represented by the following formula (1)  wherein Rrepresents an alkylene group having 2 to 6 carbon atoms and optionally containing an ester or ether bond; Rrepresents a monovalent aliphatic hydrocarbon group having 1 to 6 carbon atoms or a monovalent aromatic hydrocarbon group having 6 to 12 carbon atoms; Rrepresents an oxygen atom or a phenylene group; k represents 1 to 10 as an average value; m represents an integer of 0 to 2; n represents 0 to 10 as an average value; and a plurality of groups R, R, R, k, or m present in the formula may be the same or different from each other.

Silicone-modified epoxy resin and composition and cured article thereof

Resin compositions having a low viscosity, a low hygroscopicity, high adhesive properties and a high heat resistance as well as being light in weight and excellent in mechanical properties are provided. The resin compositions include polyhydric phenol compounds represented by the formula ( ) and epoxy resins represented by the formula ( ).

Polyhydric phenol compounds, epoxy resins, epoxy resin compositions and cured products thereof

Epoxy resin, epoxy resin composition and hardened product thereof

Modified epoxy resin having an elevated softening point obtained from an epoxy resin having a low softening point without modifying the properties of the cured product and to improve the workability in the production of an epoxy resin composition. The modified epoxy resin is obtained by adding 4,4'-dihydroxybiphenyl to a specified phenol compound and epoxidizing the resultant mixture. Also disclosed is an epoxy resin composition containing the modified epoxy resin and the cured product thereof.

Modified epoxy resin, epoxy resin composition and cured product thereof

An object is to provide hardened products having excellent water resistance and mechanical strength, and an epoxy resin and an epoxy resin composition for use in the production thereof. An epoxy resin obtained by the glycidylation of a novolak type resin which is prepared by the condensation of biphenyls with phenols and naphthols, and a resin composition containing said epoxy resin and hardened products thereof.

Growing community of inventors

Chiba-ken, Japan

Kenichi Kuboki