Kyocera Corporation

Kenichi Kohama

Kanae Horiuchi

Fumiaki Takeshita

An electronic device is mountable on a substrate. The substrate includes a first layer and a second layer located on a lower surface of the first layer. The first layer includes a plurality of first through-cavities. The second layer includes at least one second through-cavity overlapping the plurality of first through-cavities in a plan view. The plurality of first through-cavities are continuous with the at least one second through-cavity.

Electronic device mounting board, electronic package, and electronic module

An image sensor mounting base includes a substrate, and a first, a second, a third and a fourth electrode pad. The substrate has an upper surface including a first mount area where a first image sensor is mountable, and a second mount area where a second image sensor is mountable. The second mount area is spaced from the first mount area. The first and second electrode pads are located on the upper surface of the substrate and across the first mount area each other. The third and fourth electrode pads on the upper surface of the substrate are spaced from the first electrode pad and the second electrode pad and face each other across the second mount area. The substrate has, on the upper surface, a recess between the third electrode pad and the fourth electrode pad. The second mount area is located on a bottom of the recess.

Image sensor mounting base, imaging device, and imaging module

An imaging element mounting substrate may include an insulating substrate and a metal substrate. The insulating substrate may include a first mounting region for mounting an imaging element on a top surface, and a second mounting region located a distance away from the first mounting region for mounting one or more electronic components. The insulating substrate may include a fixed region for securing a lens housing surrounding the first mounting region. A metal substrate may be bonded to a bottom surface of the insulating substrate. A third mounting region located between the first mounting region and the second mounting region in the fixed region of the insulating substrate may be positioned with respect to the center of the insulating substrate in a plan view. The metal substrate may be located to overlap with the third mounting region and bestride the first mounting region and the second mounting region.

Imaging element mounting substrate, imaging device and imaging module

An imaging device includes a circuit board having a wiring line formed as part of an upper surface thereof; an electronic component mounted on the circuit board; a frame body mounted on the circuit board so as to surround the electronic component, and having connection electrodes formed on or above an upper surface thereof and external terminals formed on or above at least one of a side surface and a lower surface thereof which are electrically connected to the connection electrodes; an imaging element having a light-receiving section located in a central portion of an upper surface thereof, the imaging element being mounted on the upper surface of the frame body so as to cover an opening of the frame body; and a lens barrel having a lens, which is bonded to an outer periphery of the upper surface of the frame body so as to cover the imaging element.

Growing community of inventors

Satsumasendai, Japan

Kenichi Kohama