Fujitsu Corporation

Kenichi Kawai

Daisuke Mizutani

Masateru Koide

Mitsumasa Okada

Takahito Takemoto

An electronic device includes: a board that includes an insulating film, a wiring layer and a via provided in the insulating film, and a plurality of power source pads and a plurality of ground pads which are provided in the insulating film so as to surround a capacitor region in which a capacitor is provided and to which a plurality of bumps is coupled; and an electronic component that is mounted at the board, and is electrically coupled to the plurality of power source pads and the plurality of ground pads through the wiring layer and the via. Further, a method for supporting design of the electronic device is provided.

Electronic device, electronic apparatus, and method for supporting design of electronic device

A wiring board includes a first wire, a second wire, a third wire and a fourth wire formed over a substrate and extending in a first direction respectively, the second wire being adjacent to the first wire in the first direction, and the third wire being adjacent to the first wire in a second direction orthogonal to the first direction, and the fourth wire being adjacent to the second wire in the second direction, a pair of fifth wires, a pair of sixth wires, a pair of seventh wires and a pair of eighth wires formed in the substrate and extending in the second direction respectively, a pair of ninth signal vias, a pair of tenth signal vias, a pair of eleventh signal vias and a pair of twelfth signal vias formed in the substrate and extending in a third direction orthogonal to a surface of the substrate respectively.

Wiring board and electronic device

A circuit board includes a substrate, a first ground electrode group, and a first pair of signal electrodes. The first ground electrode group includes a plurality of first ground electrodes, where each of the plurality of the first ground electrodes is disposed at a corresponding one of vertexes of a first rectangular area in a surface of the substrate. the first pair of signal electrodes is disposed in the first rectangular area and is arranged in a first direction parallel to a side of the first rectangular area.

Circuit board and electronic device

A printed board includes: a transmission line that includes a curved region in which a first signal line and a second signal line are arranged separately from each other and curved, wherein the second signal line is arranged on an inner side of the curved region with respect to the first signal line in the curved region and has a portion extending away from the first signal line on a path arranged to be circuitous and extending partially toward the first signal line in the curved region.

Printed board and wiring arrangement method

In the thin film magnetic head of the present invention, angle of an end face of a heaped layer with respect to a lower magnetic pole layer is made obtuse so as to prevent flux leakage at a rear part of the heaped layer and improve writing characteristics of the magnetic head. The thin film magnetic head comprises: a lower magnetic pole layer; a gap layer provided on the lower magnetic pole layer; a sub-magnetic pole layer provided on the gap layer; an upper magnetic pole layer connected to a rear part of the sub-magnetic pole layer; and a heaped layer made of an electrically insulating material and provided on the rear side of the gap layer and between the lower magnetic pole layer and the sub-magnetic pole layer, the heaped layer having a slope portion, which is extended toward the gap layer and whose height is gradually reduced toward the same.

Growing community of inventors

Yokohama, Japan

Kenichi Kawai