Hitachi, Ltd.

Hitachi Chemical Company, Ltd.

Hitachi Information Technology Co., Ltd.

Kenichi Kasai

Takahiro Daikoku

Toshio Hatada

Noriyuki Ashiwake

Tadakatsu Nakajima

Toshiki Iino

Takayuki Ono

Atsuo Nishihara

Mitugu Shirai

Akio Idei

Tsutomu Imai

Kiyoshi Matsui

Shigeyuki Sasaki

Morio Suzuki

Shigeo Ohashi

Takayuki Uda

Hideyuki Fukasawa

Toshitaka Murakawa

Toshitada Netsu

Takeshi Kuroda

Takeji Siokawa

Fumiyuki Kobayashi

Heikichi Kuwahara

Takayuki Atarashi

Takeshi Yamaguchi

Tamotsu Tsukaguchi

Hideyuki Kimura

Keizou Kawamura

Hideki Watanabe

Tositada Netsu

Yasuo Ohsone

Koichi Koyano

Tetsuya Tanaka

Osamu Yamada

Toshihiro Yamada

Wataru Nakayama

Kazuhiro Komatsu

Hiroshi Inouye

Mitsunori Tamura

Kouichi Takahashi

Akihide Watanabe

Toshio Hatsuda

Nobuo Kawasaki

Satoru Ezaki

Heikichi Kuwabara

Yoshito Hayashi

Motohiro Satoh

Hiroyuki Hidaka

Keizo Kawamura

Kunio Kamata

Osamu Maruyama

Takahiko Matsushita

Satomi Kobayashi

Junri Ichikawa

Fumio Imahashi

Toshiaki Fujino

A sealing structure for multi-chip modules stable in cooling performance and excelling in sealing reliability is to be provided. The under face of a framecompatible with a wiring boardin thermal expansion rate is fixed with solderto the face of the wiring boardfor mounting semiconductor devices; a rubber O-ringis placed between the upper face of the frameand the under face of the circumference of an air-cooled: heat sink; the plastic membermaking possible relative sliding is placed between the upper face of the circumference of the heat sinkand the upper frame; the upper face of a plastic memberis restrained with the inside middle stage of an upper frame; and the lower part of the upper frameand the frameare fastened together with bolts

Sealing structure for multi-chip module

According to the invention, a sealing top plate in a multi-chip module is formed from a ceramic with high thermal conductivity having a thermal expansion coefficient consistent with that of a multi-layer circuit substrate. A cooling flow path cover covering the entirety of cooling flow path grooves is formed as a separate metallic member. The back surface of the sealing top plate, on which are formed the cooling flow path grooves, is bonded directly to the back surface of a semiconductor device using solder. A thermal-conductive jacket with low thermal resistance is provided. A multi-chip module sealing frame is soldered to the edge of the sealing top plate. Furthermore, a sealing material such as an O-ring is simply interposed between the edge of the sealing top plate and the cooling water path cover, and tightening means is used to tighten the metallic cooling flow path cover and the multi-chip module sealing frame to each other.

Device for sealing and cooling multi-chip modules

A multi-chip module cooling device is provided which equally and efficiently reduces the rises in temperature of LSI chips, and which is superior in the productivity of multi-chip modules, such as their capability to be assembled and disassembled. A multi-chip module includes semiconductor devices and a sealing top plate for removing the heat generated by them. The sealing top plate has a number of parallel cooling channels and a number of cross grooves extending partially across the cooling channels. The cooling channels arc covered with a cooling channel cover, which is provided with turbulent promoters on an inner wall thereof. When the cooling channel cover is placed over the sealing top plate, the turbulent promoters engage with the cross grooves. The turbulent promoters are positioned midway between adjacent semiconductor devices.

Device and method for cooling multi-chip modules

A multi-pin connector has contact pins fixedly soldered into bottomed connection holes which are in desired positions on a printed board, so that the contact pins are arrayed in a desired form without a housing. The multi-pin connector can be manufactured in a short period of time and can have any pitch, any number of pins and any shape.

Electronic device and multi-pin connector therefor

A multi-pin connector for mounting other boards or electronic parts on a main board, has contact pins fixedly soldered into bottomed connection holes which are in desired positions on the main board, so that the contact pins are secured separately and arrayed in a desired form without a housing. The contact pins have contact portions and pin portions, with the pin portions being secured in the connection holes.

Multi-pin connector

There is disclosed a liquid-cooled electronic device. Semiconductor devices are mounted on a substrate of a semiconductor module immersed in a cooling liquid. A wire-like member is provided in the vicinity of a cooling medium ejection port of each cooling medium supply member which cools a respective one of the semiconductor devices by a jet of the cooling liquid. With this arrangement, the flow of the cooling liquid downstream of the wire-like member is disturbed to promote the boiling over the entire surface of the semiconductor device, and when the semiconductor device is to be cooled, a transient temperature rise is reduced at the time of starting the energization of the semiconductor device, thereby stabilizing the temperature of the semiconductor device.

Liquid-cooled electronic device

A circuit board is provided with blind connection vias which are filled with solder. The end portions of the pins of an electronic component are inserted into the connection vias, and are connected to the connection vias by solder. The electronic component is surface mounted on the circuit board with the major portions of the pins exposed.

Surface mounting structure

A pin contact of a connector includes a parallel portion which touches a contact portion of a contact spring portion of a socket contact when the pin contact is fitted into the socket contact, and an inclined portion to be inserted into the contact spring portion while forcibly opening the contact spring portion at the time of insertion. The inclined portion has a shape which is a combination of a curve portion and a linear portion, the curve portion being moderate in inclination in the area of a boundary point between the curve portion and the parallel portion while sharp in inclination in the area of a contact start point at a pointed end of the contact pin contact. The linear portion has a constant inclination angle. The insertion force of the pin contact increases linearly proportionally to the fitting depth of the pin contact into the socket contact while the linear portion is touching the contact spring portion, whereas the insertion force of the pin contact is kept constant regardless of the fitting depth while the curve portion is touching the contact spring portion of the socket contact at a point over the boundary point between the linear portion and the curve portion.

Pin contact and electric parts having the same

There is disclosed a multichip module having a sealing-cooling structure which achieves a high packaging density, high sealing-connection reliability, a low manufacturing cost and a high cooling ability. A frame 15, conforming in thermal expansion coefficient to a substrate 11, is soldered at one surface thereof to that surface of the substrate 11 on which semiconductor devices 12 are mounted. The frame 15 is fastened or fixedly secured at the other surface thereof to a lid member 17 by bolts 10 or means without any heat treatment of the whole of the module.

Multichip module with heat sink and attachment means

Semiconductor devices are fixed on a substrate by solder and a semiconductor module having an enclosed structure is formed by the substrate, flanges and a housing. Two groups of heat conducting members, each having fins respectively in contract with the semiconductor devices and an inner wall of the housing are attached to the semiconductors. A fin thickness of each fin of the two groups of heat conducting members is comparatively thick, a fin height is low and the respective fins of the respective opposed heat conducting members have with very small clearances therebetween. A liquid as a heat conducting medium is enclosed in the semiconductor module. The liquid level of the semiconductor module is controlled such that it contacts a uppermost semiconductor device in the semiconductor module in a vertical arrangement. Further, valve mechanisms for introducing and removing a cooling fluid are provided at a top face and a bottom face of a space formed in the semiconductor module. The mass production capability of the heat conducting members is improved by providing such highly rigid fins, and improved cooling function is provided by firmly introducing the cooling medium to the respective fins while permitting the module to be reduced in size.

Low thermal resistant, fluid-cooled semiconductor module

A cooling device of a multi-chip module has micropackages that are independent of thermal deformation and easy to assembly and disassembly. The multi-chip module includes a multi-layer substrate on which the micropackages, each encasing an LSI chip, are mounted, and a housing formed integrally with a cooler. Each of the micropackages includes a first heat conduction member, having a cap portion for receiving the LSI chip and a first fin made of the same material as the cap portion to be integral therewith, and a substrate fixed to the cap portion of the first heat conduction member, the LSI chip being mounted on the substrate which is securely fixed to the cap portion of the heat conduction member while being fixedly joined at the back surface thereof to an inner surface of the cap portion of the first heat conduction member. Second heat conduction members, each including a base portion and a second fin, are disposed to engage with the first fins and be pressed against the cooler by a spring, respectively.

Cooling device of multi-chip module

Ends of contact pins are inserted into bottomed connection holes which are in desired positions on a printed board, so that the contact pins are arrayed in the desired form. By effecting solder reflow in this state, the contact pins are fixedly soldered to the connection holes. A multi-pin connector is thus provided, which can be manufactured with ease in a short period of time and which can have any pitch, any number of pins and any shape.

Method of making multi-pin connector

The disclosed invention aims at providing a semiconductor module structure which has a high ability of absorbing thermal deformation, is excellent in radiating ability and enables an easy maintenance operation. To this end, in the semiconductor module of the invention thermal conductor members are provided, each of which has an area of contact with a semiconductor device or an inner surface of a housing and has opposed heat transfer surfaces. A radiator is formed integrally on the housing. With this structure, large thermal deformation resulting from a high heat production density design can be absorbed, and at the same time heat from semiconductor devices can be efficiently radiated.

Semiconductor module

An electronic apparatus having a plurality of semiconductor devices which produce heat during operation, with a heat sink having a plurality of tabular or pin-type fins is provided on each semiconductor device. Nozzles are associated with the heat sinks so as to supply a cooling fluid into the heat sinks. The heat sinks are so arranged that all these heat sinks guide and discharge the cooling fluid in the same direction. A breadth of the respective nozzles, as measured in the direction (x-direction) of the flow and discharge of the cooling fluid determined by the heat sink is less than that of the associated heat sink. A width of the nozzle, as measured in the direction (y-direction) perpendicular to the x-direction is smaller than that of the associated heat sink. A space between adjacent nozzles provide a discharge passage of an ample cross-section which reduces resistance encountered by the heated cooling medium to be discharged therethrough.

Electronic apparatus

Growing community of inventors

Ushiku, Japan

Kenichi Kasai