Fujitsu Corporation

Tohoku University

Nippon Zeon Company, Ltd.

Kenichi Ito

Akira Tanaka

Kei Sakamoto

Kishio Yokouchi

Yasuhiro Yoneda

Hideyuki Kikuchi

Hiroshi Nakao

Yasuo Naganuma

Takashi Kyotani

Tsugio Kumai

Tomonori Ogawa

A carbon nanotube composite material contains a carbon nanotube and a continuous layer of a metal covering the inner surface of the carbon nanotube. It is produced by forming a metallic matrix layer and treating the metallic matrix layer to form plural nanoholes in the metallic matrix layer to thereby form a nanohole structure, the nanoholes extending in a direction substantially perpendicular to the plane of the metallic matrix layer; forming carbon nanotubes inside the nanoholes; and covering inner surfaces of the carbon nanotubes with a continuous layer of a metal. It has a well controlled small size, has excellent and uniform physical properties, is resistant to oxidation of the metal with time, is highly chemically stable, has good durability enabling repetitive use, has good coatability, high wettability and dispersibility with other materials, is easily chemically modified, is easily handled and is useful in various fields.

Carbon nanotube composite material comprising a continuous metal coating in the inner surface, magnetic material and production thereof

The invention relates to a photosensitive polyimide resin composition comprising (A) a polyamic acid having, in its main chain, repeating units formed from a polycondensation product of at least one tetracarboxylic acid or tetracarboxylic anhydride thereof with at least one diamine compound, and having actinic ray-sensitive functional groups at both terminals thereof; (B) a photosensitive auxiliary having a photopolymerizable functional group; (C) a photopolymerization initiator; and (D) a solvent, wherein 1 the polyamic acid is such that when the repeating unit represented by the formula (1) is defined as a unit molecular weight, a unit molecular weight per carboxyl group (unit molecular weight/COOH) falls within a range of from 200 to 300, and 2 the photosensitive resin composition permits the formation of a polyimide film having a residual stress of 40 MPa or lower and a coefficient of thermal expansion of 30 ppm/.degree. C. or lower on a substrate, and to said polyamic acid, a polyimide film having excellent film properties, and a pattern forming process using the photosensitive polyimide resin composition.

Photosensitive polyimide resin composition

Growing community of inventors

Kawasaki, Japan

Kenichi Ito