Shin-etsu Chemical Co., Ltd.

Toyo Contact Lens Company, Limited

Mitsubishi Paper Mills Limited

Kose Corporation

Konishi Co., Ltd.

The Lion Dentrifice Co., Ltd.

Shin-etsu Chemical Ltd.

Shin-etsu Chem Co., Ltd.

Md Kasei Limited

Kenichi Isobe

Kunihiro Yamada

Takayuki Takahashi

Shoji Ichinohe

Mitsuhiro Takarada

Masahiko Ogawa

Meguru Kashida

Shinji Irifune

Ichiro Ono

Toshio Ohba

Yuji Yoshikawa

Toshio Oba

Kenji Ueji

Masakazu Komemushi

Takamasa Toyoda

Hironori Tsukada

Satoshi Okazaki

Koji Sakuta

Hajime Kitamura

Nobuaki Matsumoto

Toshiro Kondo

Eiji Kanada

Kei Miyoshi

Naoki Omura

Yasuaki Hara

Fumio Okada

Mitsuo Asai

Hisashi Aoki

Kaname Inoue

Hiroshi Tsumura

Morizo Nakazato

Ikuo Sakurai

Kiyomi Tachibana

Kiyohiro Kondow

Toshiharu Yoshikawa

Akira Yamamoto

Nobuhiko Kodana

Takanori Shibata

Tohru Yokota

Hideyuki Itoh

Toru Sema

Takahide Kobori

Tomohisa Suzuki

Tatsuhiko Tsutsui

Takeji Yanagisawa

Hidehiko Aonuma

Kozo Takahashi

Kazuhiro Toba

Isamu Moriizumi

Takao Ueki

Kouichi Nakazato

Yasuharu Tahaka

Shintaro Tachibana

Kazuo Shoji

A silicone grease composition comprising 3-30 wt % of an organopolysiloxane and 60-96.9 wt % of a heat conductive filler is diluted with a least volatile isoparaffin having a boiling point of 260-360&#xb0; C. Despite a heavy loading of heat conductive filler, the grease composition is easily applicable to heat sinks as a thin uniform coating. The composition is drastically increased in shelf stability at room temperature, easy to handle, and provides for good heat dissipation.

Heat dissipating silicone grease compositions

A heat conductive silicone composition comprising (A) an alkenyl group-bearing organopolysiloxane, (B) an organohydrogenpolysiloxane having Si&mdash;H groups on side chains, (C) an organohydrogenpolysiloxane having an Si&mdash;H group at either end, (D) a filler consisting of aluminum powder and zinc oxide powder in a weight ratio of from 1/1 to 10/1, (E) a platinum catalyst, and (F) a regulator has a high thermal conductivity and maintains flexibility even when exposed to heat for an extended period of time.

Heat conductive silicone composition and semiconductor device

A heat conductive silicone composition comprising (A) an alkenyl group-bearing organopolysiloxane, (B) an organohydrogenpolysiloxane having at least two Si&mdash;H groups, (C) a filler consisting of aluminum powder and zinc oxide powder in a weight ratio of from 1/1 to 10/1, (D) an organosilane having a long-chain alkyl groups, (E) platinum or a platinum compound, and (F) a regulator has a high thermal conductivity and maintains flexibility even when exposed to heat for an extended period of time.

Novel nitrogen atom-containing polysiloxanes having residual alkoxy groups are provided. Compositions comprising the same are effective for treating fibers or fibrous materials for imparting softness and durability of home laundering and preventing yellowing.

Nitrogen atom-containing polysiloxanes, their preparation, and fiber and fabric finishing agent compositions

A grease composition having high thermal conductivity and excellent dispensation suitability, comprising (A) 100 parts by weight of a base oil and (B) 500 to 1,200 parts by weight of metallic aluminum powder having the average particle size in the range of 0.5-50 &mgr;m; wherein the aluminum powder is a mixture of fine metallic aluminum powder having an average size of 0.5 to 5 &mgr;m and coarse metallic aluminum powder having an average particle size of 10 to 40 &mgr;m; and a semiconductor device utilizing the aforesaid grease composition.

Thermally conductive grease composition and semiconductor device using the same

An organopolysiloxane composition comprising (1) 100 parts by weight of an organopolysiloxane having at least two unsaturated groups per molecule, (2) 0.1-30 parts by weight of a liquid organohydrogenpolysiloxane having at least two hydrogen atoms attached directly to silicon atoms (&equiv;Si&mdash;H bonds) per molecule, (3) 0.1-6.0 parts by weight of an addition reaction control agent prepared by mixing (a) an acetylene alcohol and (b) a silylated acetylene alcohol in a (b)/(a) ratio ranging from greater than 5 to no greater than 100 on a weight basis, and (4) a catalytic amount of a platinum metal catalyst.

Organopolysiloxane composition

A silicone grease composition having high thermal conductivity, comprising (A) 50 to 95 weight % of a mixture of an aluminum nitride powder &agr; having an average particle size of 0.5 to 5 &mgr;m and an aluminum nitride powder &bgr; having an average particle size of 6 to 20 &mgr;m, wherein the aluminum nitride powders &agr; and &bgr; are mixed so that the &agr;/(&agr;&plus;&bgr;) ratio by weight is from 0.1 to 0.9 and the average particle size after mixing is from 1 to 10 &mgr;m, (B) 5 to 15 weight % of organopolysiloxanes having a viscosity of from 50 to 50,000 cs at 25&deg; C. and represented by formula R,SiO,, wherein R,represents at least one group selected from saturated or unsaturated univalent hydrocarbon groups containing 1 to 18 carbon atoms and 1.8&lE;a&lE;2.2, and (C) 0 to 35 weight % of at least one inorganic compound powder having an average particle size of 0.5 to 100 &mgr;m selected from the group consisting of zinc oxide, alumina, boron nitride and silicon carbide powders.

Silicone grease composition

A heat-reducing silicone grease composition comprising a mixture of (A) 50-95 weight % of aluminum nitride powder having an average particle size of 0.5-10 &mgr;m and containing no particles 100 &mgr;m or greater in size, (B) 5-50 weight % of liquid silicone having a viscosity of 50-500,000 cs at 25&deg; C. and (C) 0-30 weight % of at least one powder selected from the group consisting of zinc oxide, alumina, boron nitride and silicon carbide powders; and a semiconductor device to which the foregoing silicone grease composition is applied.

Heat-reducing silicone grease composition and semiconductor device using the same

An aluminum nitride powder having the surface treated with an organosilane represented by formula, R.sup.I.sub.a R.sup.II.sub.b SiY.sub.4-1-b, and/or a partial hydrolysis condensate thereof to acquire excellent moisture-proof, wherein R.sup.I represents a 6-20C alkyl group or a group formed by substituting halogen atom or atoms for part or all of the hydrogen atoms attached to carbon atoms of the 6-20C alkyl group, R.sup.II represents a 1-20C hydrocarbon group or a group formed by substituting halogen atom or atoms for part or all of the hydrogen atoms attached to carbon atoms of the 1-20C hydrocarbon group, Y represents a hydrolyzable group, a is an integer of 1 to 3 and b is an integer of 0 to 2, provided that a+b is an integer of 1 to 3; and a thermally conductive grease composition comprising (A) 50-95 weight % of the aforementioned surface-treated aluminum nitride powder and (B) 5 to 50 weight % of at least one base oil selected from the group consisting of liquid silicones, liquid hydrocarbons and fluorohydrocarbon oils, and further, if desired, (C) 0-30 weight % of a thicknener selected from the group consisting of zinc oxide, alumina, boron nitride and silicon carbide powders.

Aluminum nitride powder and thermally conductive grease composition

A thermally conductive silicone composition which comprises (A) 5 to 30 weight % of a liquid silicone, (B) 50 to 94.98 weight % of at least one thickener selected from the group consisting of a zinc oxide powder, an aluminum powder, an aluminum nitride powder, a boron nitride powder and a silicon carbide powder, (C) 0.01 to 10 weight % of an organopolysiloxane having at least one per molecule of hydroxyl group attached directly to a silicon atom, and (D) 0.01 to 10 weight % of an alkoxysilane, thereby retainining satisfactory thermal conductive properties and hardly causing oil bleeding over a long time.

Thermally conductive silicone composition

A specific amount of a low molecular weight vinyl siloxane is blended with a platinum-vinyl siloxane complex to provide a platinum complex catalyst, which is prevented from deterioration with time at elevated temperatures and from blackening and precipitation, and maintains its catalytic activity unaffected.

Platinum complex catalyst

A solventless curable silicone release composition contains (A) a branched organopolysiloxane having a vinyl group attached to a silicon atom at an end of its molecular chain, (B) an organohydrogenpolysiloxane having at least three SiH groups in a molecule, and (C) a platinum group metal catalyst. The composition is easily applicable to a thin gage and cures into a releasable silicone coating ensuring light release at high speeds. A release sheet having the cured coating formed thereon has improved release characteristics.

Curable silicone release composition and release sheet

A water soluble water absorption preventing agent mainly comprising an organic silicon compound and/or its partial hydrolytic condensate, represented by the following general formula: ##STR1## wherein R.sup.1 denotes an alkyl group with 1-20 carbon atoms and with a linear chain or branched chain for which a halogen can substitute for part or all of the hydrogen atoms, R.sup.2 denotes a hydrogen atom or an alkyl group with 1-10 carbon atoms and with a linear chain or branched chain, R.sup.3 denotes a hydrogen atom or an alkyl group with 1-8 carbon atoms and with a linear chain or branched chain, m denotes an integer 1-2 and n denotes an integer 1-3 where m+n=3 or 4, p denotes an integer 1-50, and q denotes an integer 0-25.

Water absorption preventing agent having water solubility and a method

There is provided a curable organopolysiloxane composition comprising (A) an organopolysiloxane containing, in its molecule, at least two groups represented by the general formula (1):

Curable organopolysiloxane composition

Disclosed is a water repellent for fibers, comprising an acryl-silicone graft copolymer which is prepared by a radical copolymerization reaction of an organopolysiloxane compound containing one radical polymerizable group with radical polymerizable monomers including an acrylate, a methacrylate or a mixture thereof as a main member.

Agent for water-repellent treatment of fibers

Growing community of inventors

Gunma-ken, Japan

Kenichi Isobe