Fujikura Limited

Kenichi Ishibashi

Takeshi Ishizuka

Yoshinobu Numasawa

Daisuke Murakami

Hideaki Usuda

Hideo Shiratani

Shingo Ishii

Kenichi Nakatate

Takahiro Shimono

Takeshi Segi

Hitoe Iikura

Wei-Zhi Hu

Fumihiko Nishimura

Satoshi Hida

An imaging module includes: a planar light emitter that includes a light-emitting face and a light-emitter terminal; a power supply cable that is connected to the light-emitter terminal and that supplies electric power to the planar light emitter; a solid-state image sensing device that captures an image of an illumination object that is irradiated with light emitted from the light-emitting face; a coaxial cable that is electrically connected to the solid-state image sensing device; a light shield that is disposed between the solid-state image sensing device and the planar light emitter; and a light guide that guides light emitted from the light-emitting face to an outside of the imaging module. The planar light emitter, the solid-state image sensing device, part of the light shield, and the light guide constitute a rigid portion of the imaging module.

Imaging module, endoscope, and catheter

An imaging module includes: a support substrate that includes a first surface, a second surface on an opposite side of the first surface, and a first mounting terminal disposed on the first surface; a planar light emitter including a light-emitting face, and a light-emitter terminal disposed on the first surface of the support substrate and connected to the first mounting terminal; and a solid-state image sensing device disposed adjacent to the planar light emitter and that includes a light-incident surface that has a quadrangular shape in plan view and that captures an image of an imaging object that is irradiated with light emitted from the light-emitting face.

An imaging module of the invention includes: an imaging element; and a substrate positioned on a rear surface opposite to an imaging surface of the imaging element and provided to extend from the rear surface to a side opposite to the imaging surface. An electrode pad provided on the rear surface of the imaging element and a front end portion of an electrode pad provided on a main surface of the substrate at a position close to the imaging element are electrically connected via a conductive connecting material portion. A notch portion recessed from a distal end of the front end portion is formed at the front end portion of the electrode pad of the substrate.

Imaging module and method of manufacturing the same

An imaging module includes: an image-sensing device; a first substrate; a signal cable; a second substrate; and a flexible linear structure. Each of the first substrate and the second substrate includes a wiring and a cable terminal electrically connected to the signal cable on only one surface of the substrate. Each of the wiring of the first substrate and the wiring of the second substrate is electrically connected to the signal line via the cable terminal. The flexible linear structure extends in a direction along the signal cable from a front-end portion of the flexible linear structure supported by a structure-front-end support including the first substrate, and the flexible linear structure is disposed on a side of the signal cable where the first substrate and the second substrate are disposed.

Endoscope imaging module with signal cable and flexible linear structure

An imaging module includes an electrical cable; a solid-state imaging element having an imaging unit orthogonal to an axis direction of a tip of the electrical cable; and a flexible wiring substrate in which the solid-state imaging element and the electrical cables are electrically connected together. The flexible wiring substrate includes an element mounting portion mounting the solid-state imaging element, and two rear pieces that are bent at both end portions of the element mounting portion and extend in a direction away from the element mounting portion. An internal space of the flexible wiring substrate surrounded by the element mounting portion and the two rear pieces is filled with adhesive resin in which a glass-transition temperature is 135&#xb0; C. or less.

Imaging module and catheter with flexible wiring substrate

An imaging module includes: an image-sensing device; a first substrate including a first insulating substrate main body that includes a plurality of surfaces, an electrode terminal, a first cable terminal disposed on only one of the plurality of surfaces of the first insulating substrate main body; a second substrate including a second insulating substrate main body and a second cable terminal; and a signal cable disposed between the first substrate and the second substrate, that electrically connects the first cable terminal to the second cable terminal. The one of the plurality of surfaces of the first insulating substrate main body where the first cable terminal is connected to the signal cable and a surface of the second insulating substrate main body where the second cable terminal is connected to the signal cable are disposed on a same plane.

Imaging module and imaging-module-attached catheter

An endoscope includes: an imaging device chip having a chip connection portion; a tubular housing tube used to a scope tip portion of an endoscope; a substrate to which the imaging device chip is fixed, the substrate having a substrate connection portion, the substrate being capable of bending at near the substrate connection portion when the substrate is inserted into the housing tube; a lead wire connecting the substrate connection portion and the chip connection portion; flexible and non-conductive resin covering an entirety of the lead wire; and an imaging module including the substrate provided with the imaging device chip thereon, the imaging module inserted into the housing tube.

Endoscope imaging module

An imaging module includes: an image-sensing device; a first substrate including a first insulating substrate main body; a second substrate including a second insulating substrate main body; and a signal cable disposed between the first substrate and the second substrate, that electrically connects a first cable terminal to a second cable terminal. In the imaging module, D1 is a length of a first diagonal line on a light-receiving face of the image-sensing device, D2 is a length of a second diagonal line on an end face of the second insulating substrate main body, and D2 is less than or equal to D1.

An imaging module is capable of being used a two or more limited number of times. The imaging module includes: a CMOS imaging sensor; and a counter memory in which the number of use times is stored, the number of use times being the number of times the imaging sensor is used.

Imaging module and imaging system including same

An imaging module includes an electrical cable; a solid-state imaging element having an imaging unit orthogonal to an axis direction of a tip of the electrical cable; and a flexible wiring substrate in which the solid-state imaging element and the electrical cables are electrically connected together. The flexible wiring substrate includes an element mounting portion mounting the solid-state imaging element and two rear pieces that are bent at both end portions of the element mounting portion and extend in a direction moving away from the element mounting portion. An internal space of the flexible wiring substrate surrounded by the element mounting portion and the two rear pieces is filled with an adhesive resin in which the rate of volumetric shrinkage in curing is 3% or more.

Growing community of inventors

Sakura, Japan

Kenichi Ishibashi