Nec Corporation

Nec Platforms, Ltd.

Kenichi Inaba

Minoru Yoshikawa

Masaki Chiba

Arihiro Matsunaga

Hitoshi Sakamoto

Akira Shoujiguchi

Masanori Sato

Takeya Hashiguchi

Tadao Hosaka

Shunsuke Fujii

In order to supply a refrigerant to multiple-stage heat receivers equally while saving space, a refrigerant distribution device to distribute a refrigerant supplied from the upper stream according to the present invention includes a main body including a side wall part, an upper face part and a bottom face part, an upstream pipe provided on the upper face part in a manner communicating with an inside of the main body, a downstream pipe provided in a state partially inserted inside the main body via an under face hole part provided in the bottom face part, a tributary pipe provided in the side wall part or the bottom face part in a manner communicating with the inside of the main body, and a refrigerant direction changing means provided between the upstream pipe and the downstream pipe.

Refrigerant distribution device and cooling apparatus

A vapor pipeconnects a heat dissipation portionand each of a plurality of heat receiving portions. A liquid pipeconnects the heat dissipation portionand each of a plurality of the heat receiving portions. A bypass pipeconnects the vapor pipeand the liquid pipe. A valveopens and closes a flow path of the bypass pipe. A first connection portionconnects the vapor pipeand the bypass pipe. A second connection portionconnects the liquid pipeand the bypass pipe. The first connection portionis disposed at a position higher than that of the second connection portion. As a result, refrigerant can be efficiently transported in a short time.

Electronic apparatus enclosure device and electronic apparatus cooling system

An electronic boardhas a heat generating componentmounted on it. An enclosurehouses the electronic board. A heat transport unitis coupled to the enclosureand transports heat generated by the heat generating componentto the outside. A heat receiving unitis provided in a heat transport unitA. The heat receiving unitreceives heat generated by the heat generating component. A heat dissipating unitis provided in the heat transport unitin such a manner that a portion of the heat dissipating unitis exposed to outside air, and is coupled to the heat receiving unit. The heat dissipating unitdissipates heat received by the heat receiving unitto the outside. A guide duct unitis formed into a tube interconnecting the heat generating componentand the heat receiving unitin order to release heat of the heat generating componentto the heat receiving unit. This enables the heat generating component on the electronic board to be efficiently cooled with a small and simple configuration.

Electronic device and cooling system

The cooling apparatus () for electronic-device exhaustion includes an evaporator unit (), a fluid piping () and a vapor piping (). A plurality of evaporator units () is disposed in a rack () in the height direction, and have a dimension in height of any of 2U, 3U, and 4U with 1U being 44.45 mm. The evaporator unit causes a coolant fluid thereinside to vaporize and produce a coolant vapor by heat of the exhaust air from an electronic device loaded in the rack (), and cools the exhaust air. The fluid piping () is a supply route of the coolant fluid to the evaporator units (), the vapor piping () is a discharging route of the coolant vapor from the evaporator units (), and both are commonly connected to the plurality of evaporator units ().

Cooling apparatus and cooling system for electronic-device exhaustion

In order to maintain a high cooling capability even in a case where a heating element has a lower calorific value, a boiling section of a heat receiving section in a phase change cooling apparatus includes a comb-shaped structure and a porous layer provided on a bottom portion of the comb-shaped structure between fins of the comb-shaped structure. With such a boiling section, a liquid film of a liquid phase refrigerant is forcedly made thinner. Thus, the liquid phase refrigerant is changed in phase into a gaseous phase refrigerant even in a case of a small difference between the temperature of the gaseous phase refrigerant and the temperature of the heat receiving surface.

Cooling apparatus, heat receiving section and boiling section used therein, and method of manufacturing the same

A cooling system of an electronic device storing apparatus of the present invention comprises: a rack including an electronic device and a plurality of placement shelves to place the electronic device; in the rack, a vaporizer having a refrigerant internally being mounted; outside the rack, a condensing part connected with the vaporizer by a laying pipe being installed; and a refrigerant adjustment means for adjusting a height of a refrigerant surface in the vaporizer.

Cooling system for electronic device storing apparatus and cooling system for electronic device storing building

A phase change cooler of the present invention includes: a plurality of heat receiving units that cause a refrigerant to change phase from liquid to gas by heat received from a heat generating body; one heat radiating unit that causes the refrigerant to change phase from gas to liquid by radiating heat to surrounding area; a plurality of vapor tubes that respectively transport the refrigerant in a vapor state from each of the heat receiving units to the heat radiating unit; a liquid tube that respectively circulates the refrigerant in a liquid state from the heat radiating unit to each of the heat receiving units; and a bypass tube that connects each of the heat receiving units to each other.

Phase change cooler and electronic equipment provided with same

A cooling apparatus includes N (N is an integer of 2 or larger) refrigerant storage units arranged in a vertical direction and configured to store refrigerants, a condensation unit disposed above the N refrigerant storage units, a steam pipe for circulating gas phase refrigerants flowing out of the N refrigerant storage units to the condensation unit, a liquid pipe for circulating a liquid phase refrigerant flowing out of the condensation unit to an uppermost refrigerant storage unit, and separation piping for circulating a liquid phase refrigerant flowing out of an upper refrigerant storage unit to a lower refrigerant storage unit. The liquid phase refrigerant flows into each refrigerant storage unit via an inlet, and flows out from the refrigerant storage unit via a first connection port formed below the inlet.

Cooling apparatus and cooling system

It is impossible in a cooling device using a phase-change system, seeking high heat transport performance, to obtain sufficient cooling performance due to the increase in thermal resistance with a heating element to be cooled, therefore, a connecting structure of a cooling device according to an exemplary aspect of the present invention includes a connecting board with an opening; a pressing plate of thin plate elastically deformable; first fixing means for fixing the pressing plate to the connecting board with the pressing plate disposed covering heat receiving means composing the cooling device; and second fixing means for fixing the connecting board to a substrate with the heat receiving means abutting against a heating element mounted on the substrate and disposed in the opening.

Connecting structure of cooling device, cooling device, and method for connecting cooling device

An electronic substrate has a tabular base material which can install a heater element and a cooling structure that cools the heater element. The electronic substrate can be plugged in/out in a case in the direction which is almost parallel to the face of the base material. The cooling structure has a first heat radiation part with a hollow shape and a heat transfer part. The first heat radiation part radiates the generated heat of a heater element installed in the base material. A heat transfer part transfers the generated heat to the first heat radiation part. The first heat radiation part has a first joint surface formed along a face which is almost vertical to the insert and removal direction of the base material. The first heat radiation part is connected to a second radiation part set up in the case thermally through the first joint surface.

Electronic substrate and an electronic apparatus

A cooling system comprising: an evaporator for evaporating a refrigerant by performing heat exchange with outside air; a condenser for condensing a gas refrigerant into a liquid refrigerant by making a refrigerant and a cooling medium perform heat exchange with each other; a gas refrigerant pipe and a liquid refrigerant pipe connecting the evaporator and the condenser; and the evaporator including: an upper part header provided in a highest position of the evaporator, and connected with the condenser by the gas refrigerant pipe, through the gas refrigerant pipe a gas refrigerant flowing; a lower part header provided in a lowest position of the evaporator, and connected with the condenser by the liquid refrigerant pipe, through the liquid refrigerant pipe a liquid refrigerant flowing; a middle header provided in an intermediate position between the upper part header and the lower part header, and connected with the condenser by the liquid refrigerant pipe, through the liquid refrigerant pipe the liquid refrigerant flowing; an upper part evaporator, arranged between the upper part header and the middle header, including an upper part steam generating tube having a first flow path for leading a refrigerant of the middle header to the upper part header while making the refrigerant of the middle header perform heat exchange with outside air and having a second flow path for leading a refrigerant of the lower part header to the upper part header while making the refrigerant of the lower part header perform heat exchange with outside air; and a lower part evaporator, arranged between the lower part header and the middle header, including a lower part steam generating tube having a third flow path inserted into the middle header while making a refrigerant of the lower part header perform heat exchange with outside air, the lower part steam generating tube communicated with the second flow path of the upper part steam generating tube.

Cooling system and device housing apparatus using the same

Provided is a semiconductor device which includes a wiring substrate; a semiconductor chip fixedly attached to a first surface of the wiring substrate; a power supply pad that is provided on a second surface opposite to the first surface of the wiring substrate, and supplies electric power to the wiring substrate; a ground pad that is provided on the second surface of the wiring substrate and grounds the wiring substrate; a power supply-side reinforcing member that is connected to the power supply pad and made of metal; a ground-side reinforcing member that is connected to the ground pad and made of metal; and an insulating part that insulates the power supply-side reinforcing member and the ground-side reinforcing member from each other.

Growing community of inventors

Tokyo, Japan

Kenichi Inaba