Ushio Denki Kabushiki Kaisha

Sony Corporation

Achilles Corporation

Kabushiki Kaisha Toshiba

Nihon Kaiheiki Kogyo Kabushiki Kaisha

Nihon Kaiheiki Industrial Company, Ltd.

Kenichi Hirose

Masashi Okamoto

Fumitoshi Takemoto

Shinji Suzuki

Tatsushi Igarashi

Nobuyuki Hishinuma

Masayuki Nishijima

Shinichi Endo

Hiromitsu Matsuno

Motohiro Sakai

Takashi Asahina

Yoshinori Aiura

Kunio Kasagi

Jun Okamoto

Junichi Inoue

Hirokazu Odagiri

Kazushi Kirihara

Kazuhiro Mukai

Masaki Yoshioka

Osamu Maruyama

Yoshitaka Sakoguchi

Takafumi Mizojiri

Masakazu Itoya

Hiroki Horibe

Tomoyuki Habu

Makoto Wasamoto

Makoto Yamanaka

Kenji Hatakeyama

Yoshiaki Wani

Toshinori Utsugi

Tetsuya Murakami

Hidetake Suzuki

Masahiro Nagao

Tadao Ichikawa

James Christie

A container () for transporting a semiconductor wafer includes: a container body () having one end provided with an opening () and the other end provided with a mounter () that faces the opening () and on which stacked wafers are housed; and a cover () that closes the opening (). The container body () includes: body side walls () having an arc shape, disposed upright on the mounter (), sectioning a housing () that houses the wafers; and auxiliary walls () that are disposed upright and folded toward a back surface on both edges of the body side walls ().

Container for transporting semiconductor wafer

Disclosed herein is a method of bonding substrates, a microchip, and a method of manufacturing the microchip capable of joining two substrates in a higher adhered state even when at least one of the substrate has a warpage or a roll. A method of bonding a first substrate and a second substrate each of which is made of glass or a resin comprises: a surface activating step for activating each of joining surfaces of the first substrate and the second substrate; and a pressurizing step for pressurizing the first substrate and the second substrate in a state that the first substrate and the second substrate are stacked such that respective joining surfaces contact each other. The joining surface of the first substrate and/or the joining surface of the second substrate are constituted with a plurality of joining regions segmented to be separate from one another by a segmenting recessed portion.

Method of bonding substrates, microchip and method of manufacturing the same

Provided is a microchip that can achieve a favorable bonding state in the bonding portion between first and second substrates even if the microchip is large in size. A microchip includes a first substrate made of a resin and a second substrate made of a resin, the first substrate and the second substrates being bonded to each other, and a channel surrounded by a bonding portion between the first substrate and the second substrate is formed by a channel forming step formed at least in the first substrate. Further, a noncontact portion is formed to surround the bonding portion, and an angle &#x3b8;formed between a side wall surface of the channel forming step and a bonding surface continuous therewith satisfies &#x3b8;&#x3e;90&#xb0;.

Microchip

Described herein are wafer accommodation containers. A wafer accommodation container () includes: a container body having one end that is provided with an opening () and another end that is provided with a mount element () on which wafers are stacked, the mount element () facing the opening (); a cover () to cover the opening (); and a connection mechanism () to detachably connect the container body () and the cover ().

Wafer accommodation container

A semiconductor wafer container includes two outer shells in a substantially flat and identical form. Each outer shell vertically overlaps so as to accommodate a single semiconductor wafer therein. Each outer shell has a main body, a wafer retaining device and an external wall forming device. The wafer retaining device accommodates and fixedly holds the wafer in such a manner that upper and bottom surfaces of the wafer are not substantially in contact with the outer shells. The wafer retaining device includes: an inclined surface; a wafer contact surface; and a shallow gap portion. The external wall forming device has a hanging portion formed on an outer peripheral edge of the bottom surface of the outer shell so as to externally constitute a closed external wall relative to the wafer when each outer shell vertically overlaps to store the wafer.

Semiconductor wafer container

Provided are a desmearing method and a desmearing device which are able to reliably remove a smear derived from any of an inorganic substance and an organic substance, and eliminate the need to use a chemical that requires a waste liquid treatment. The desmearing method of the present invention is directed to a desmearing method for a wiring substrate material that is a laminated body of insulating layers made from resin containing a filler and a conductive layer, and includes an ultraviolet irradiation treatment step for irradiating the wiring substrate material with ultraviolet beams with a wavelength of 220 nm or less, and a physical vibration treatment step for applying physical vibrations to the wiring substrate material which has undergone the ultraviolet irradiation treatment step.

Desmearing method and desmearing device

Disclosed is a separator for semiconductor wafers vertically stacked in that the stacked wafers do not contact with each other, or the wafer does not contact to an inner top surface or an inner bottom surface of a conveyance container of the semiconductor wafer, the separator being interposed between two of the wafers neighboring vertically, between the wafer and an inner top surface, or between the wafer and an inner bottom surface of the container. The separator includes: a flat annular body; an annular convex portion having a wafer support surface coming into contact with a peripheral line of the wafer along a peripheral edge portion of the flat annular body, the annular convex portion forming cutout portions in a suitable number of places; and shock-absorbing function pieces neighboring to the cutout portions and extending diagonally upward or diagonally downward from a separator reference plane.

Separator

The present invention has as its object the provision of a method of bonding substrates, which can bond two substrates, at least one of which has warpage and undulation of a bonding surface, in a high adhesion state and a method of producing a microchip. In the method of bonding substrates according to the present invention, the first substrate is formed of a material having a deformable temperature at which the substrate deforms and which is higher than a deformable temperature of the second substrate, the method includes: a surface activation step of activating each of bonding surfaces of the first substrate and the second substrate; a stacking step of stacking the first substrate and the second substrate so that the respective bonding surfaces thereof are in contact with each other; and a deforming step of deforming the bonding surface of the second substrate to conform to a shape of the bonding surface of the first substrate, and the deforming step is performed by heating the stacked body of the first substrate and the second substrate obtained in the stacking step at a temperature not lower than the deformable temperature of the second substrate and lower than the deformable temperature of the first substrate.

Method of bonding substrates and method of producing microchip

A desmear treatment method for a wiring board material is provide that is capable of performing desmear treating on the interior of a through hole formed in an insulating layer without requiring complicated steps and obtaining an insulating layer having appropriate surface roughness. The desmear treatment method comprises forming a hole passing through an insulating layer, wherein the insulating layer is made of a resin containing a filler, and desmear treating the wiring board material with radicals. The wiring board material includes a depletable resist layer formed on the insulating layer, and the depletable resist layer is made of a resin to be depleted in the desmear treatment step. A method of manufacturing a wiring board material to be subjected to the desmear treatment method and a composite insulating layer forming material used in the manufacturing method are also disclosed.

Wiring board desmear treatment method

A paper sheets pre-processing apparatus of an embodiment includes a large band remover, a small bundle coupler, a small band remover and an accumulator. The large band remover conveys a bundle in which a plurality of paper sheets are bound by small bands and a predetermined number of small bundles are bound by a large band, and removes the large band from the bundle. The small bundle coupler conveys the predetermined number of small bundles included in the bundle from which the large band is removed by the large band remover, and couples the predetermined number of small bundles to each other. The small band remover separates a single small bundle from the small bundles coupled by the small bundle coupler and removes the small band from the small bundle. The accumulator accumulates the paper sheets from which the small band is removed by the small band remover.

Paper sheets pre-processing apparatus

According to one embodiment, a paper sheet processing apparatus includes a supply unit, a pick-up mechanism, an inspection device, a stacking device, and a wrapping device configured to wind a band around a stacked paper sheet bundle and wrap the stacked paper sheet bundle. The wrapping device includes a clamp mechanism configured to curve the stacked paper sheet bundle by pressing both side portions of the stacked paper sheet bundle, a band winding device configured to wind a wrapper band around the curved stacked paper sheet bundle, and a heater configured to heat-seal an end of the wrapper band. The clamp mechanism includes a press member configured to adjust a degree of curvature of the stacked paper sheet bundle.

Paper sheet processing apparatus

A light irradiating apparatus that may include: an ultraviolet light emission lamp configured to emit vacuum ultraviolet light toward a workpiece to be disposed in an atmosphere of a treatment gas including oxygen; a light passing window adapted to be disposed between the workpiece and the ultraviolet light emission lamp and configured to allow the vacuum ultraviolet light from the ultraviolet light emission lamp to pass therethrough, in which the light passing window has a light-exiting surface; and a spacer adapted to be disposed between the light passing window and the workpiece, to apply a pressing force onto the workpiece and to form a gap that allows a distance from the light-exiting surface of the light passing window to a surface of the workpiece to be of a uniform size over the entire surface of the workpiece.

Light irradiating appatarus

According to one embodiment, a stacking/wrapping apparatus includes a stacking device configured to stack paper sheets in a predetermined number on a stacking unit, a wrapping device configured to wrap a bundle of the stacked paper sheets by winding a band thereon, and a transport carrier configured to receive the paper sheet bundle and transport the paper sheet bundle to the wrapping device. The wrapping device includes a hand assembly, a hand drive mechanism configured to open and close the hand assembly and reciprocate the hand assembly at right angles to the stacking direction, and a band winding device configured to wind a wrapper band around the paper sheet bundle drawn into the binding position.

Stacking/wrapping apparatus

An ashing apparatus includes a treatment chamber having an object to be processed therein, and a lamp chamber having an ultraviolet lamp that radiates the object with an ultraviolet beam. The ashing apparatus is configured to accurately maintain an irradiation distance between a light source and the object. Thus, it is possible to efficiently remove a smear from a wiring board. The treatment chamber and the lamp chamber are moved relative to each other and in parallel to a surface of the object to be processed. The treatment chamber has a stage that supports the object, a gas inlet opening for supplying a treatment gas into the treatment chamber, and a gas outlet opening for discharging the treatment gas. An ultraviolet transmitting window member that partitions the treatment chamber and the lamp chamber from each other is fixed to the treatment chamber.

Ashing apparatus

A battery storage case including a main body and a lid portion. In one embodiment, the case includes first and second projection trains formed on the main body and a third projection train formed on the lid portion, wherein the third projection train is adapted to engage one of the first projection train and the second projection train. In one embodiment, a through-hole is formed through a head portion of the lid portion.

Growing community of inventors

Tokyo, Japan

Kenichi Hirose