Fuji Corporation

Kenichi Hayashi

Keita Tanaka

Chikashi Teshima

Hiromitsu Oka

A tape guide includes a guide section configured to guide a carrier tape, a component exposing section configured to open a cover tape to expose an electronic component in a component storage section during conveyance of the carrier tape guided by the guide section, a tongue portion provided on the component exposing section and configured such that a distal end portion is movable between a first height position at which the distal end portion enters between a base tape and the cover tape and a second height position higher than the first height position, a pressing section placed above the tongue portion to apply a pressing force to the tongue portion to cause the tongue portion to move downward, and a stepped portion provided on a facing surface on which the tongue portion and the pressing section face each other.

Tape guide and component supplying equipment

An electronic component mounter including a suction nozzle to pick up an electronic component housed in a housing section; a switching device configured to switch air supplied to a nozzle hole of the suction nozzle to negative pressure air when picking up the electronic component, and to switch the air supplied to the nozzle hole of the suction nozzle to positive pressure air when mounting the electronic component that was picked up by the suction nozzle on the circuit board; and a blow supply device configured to supply a first blow to the suction nozzle for a specified time when the positive pressure air is being supplied to the nozzle hole by a switching device. After the specified time has elapsed, stop the first blow and supply a second blow with a lower pressure than the first blow to the suction nozzle.

Growing community of inventors

Ichinomiya, Japan

Kenichi Hayashi