Empire Technology Development LLC

The Furukawa Electric Co., Ltd.

Harima Chemicals, Incorporated

Fujitsu Corporation

Kenichi Fuse

Yuichi Obara

Toshiya Hikami

Koji Yoshida

Takao Fukunaga

Hisao Irie

Hirokazu Shiroishi

Yusei Shirasaka

Masanao Kohno

Toshiaki Amano

Yutaka Higashiguchi

Kazuo Chiba

Mitsuo Inagaki

Hidehiro Mishiro

Haruo Umezu

Yoshihiro Onuma

Hirotaka Kashiwabara

Izumi Kosuga

Takao Toya

A reinforcing cable for a prestressed concrete structure is disclosed. The cable has an optical fiber entwined between the twisted wire ropes that form the cable. The optical fiber facilitates in situ monitoring of cable integrity by comparing optical signal transmission over time.

Cable with optical fiber for prestressed concrete

Sorting and separation systems may use the inherent electrostatic properties of plastic as the basis for separating different types of plastics from one another. Plastics of different types may charge to different degrees when subjected to a charging event. By appropriately charging a collection unit, plastic components of one type of plastic may be separated from other plastic components by electrostatic attraction.

Electrostatic system and method of sorting plastics

Techniques described herein generally relate to ground planes. In some examples, an electrical cable is described that can include multiple signal lines. The multiple signal lines can be arranged to extend along a length of the electrical cable. A ground plane can be spaced apart from the multiple signal lines. The ground plane can include a mesh structure and an electrically conductive layer that is arranged to coat the mesh structure. The mesh structure can include multiple resin fibers.

High-speed card cable

Techniques described herein generally relate to laminated semiconductor structures. In some examples, method of forming a polyimide film are described. An example method may include forming a through hole in a laminated semiconductor structure that includes multiple stacked semiconductor layers. An inner wall of the laminated semiconductor structure can define the through hole. The inner wall can be exposed to a solution including a salt of polyamic acid and/or a polyamic acid that can be precipitated on the inner wall. The precipitated polyamic acid on the inner wall can be transformed into a polyimide film substantially coating the inner wall.

Semiconductor structure with insulated through silicon via

Techniques are generally described for a lock system. An example lock system includes a lock with a lock module that controls a lock mechanism. The lock is configured to transmit optical signals to a key. The key reflects the optical signals back to the lock. The key is configured to encode the optical signals with a combination. The lock module is configured to determine whether the combination is valid. The lock module actuates the locking mechanism when the key is determined to be valid.

Lock system

A battery system that can prevent a burst of a battery and a battery safety alarm system therefor are provided. A battery system includes a lithium ion battery formed in a cylindrical shape and including an organic electrolytic solution as an electrolyte. A laser beam source emits a laser beam. An optical fiber of a single mode is wound around an outer circumferential portion of the lithium ion battery in a plurality of lines and via which the laser beam emitted from the light source is transmitted. A detector receives the laser beam transmitted via the optical fiber and detects abnormality of the lithium ion battery on the basis of a loss of the laser beam due to the optical fiber or a change with time of the loss. An alarm warns a user of the abnormality when abnormality of the lithium ion battery is detected by the detector.

Battery system and battery safety alarm system

Techniques associated with energy storage devices are generally described. An example energy storage device includes a battery integrated with a sensor such as an optical waveguide. The sensor can be arranged in contact with an outer wall of the battery and can be configured to detect a safety condition associated with the battery.

Energy storage apparatus

A power generation system includes a support unit configured to support a power transmission line disposed on a transmission line tower, and a power generation unit. The support unit includes a support line having an end part connected to the power transmission line and a rotary body configured to rotate in a manner cooperating with the support line. The power generation unit is configured to generate electric power in response to rotation of the rotary body caused by movement of the support line resulting from tension of the power transmission line.

Power generation system and sensing system

A hot-melt molding apparatus includes an apparatus body, a cylinder, a molding head, a heating device, a conveyor screw, a heat transport section, a thermoelectric element, and a power storage section. The cylinder communicates with the apparatus body and is configured to receive thermoplastic material. The molding head is provided at one end of the cylinder. The heating device is configured to heat the cylinder and the molding head to melt thermoplastic material therein. The conveyor screw is provided inside the cylinder to convey thermoplastic material to the molding head. The heat transport section has a first end connected to at least one of the cylinder and the molding head. The thermoelectric conversion element is connected to a second end of the heat transport section. The power storage section is connected to the thermoelectric conversion element and is configured to store power generated by the thermoelectric conversion element.

Hot-melt molding apparatus

A battery system that can prevent a battery from bursting and a battery safety alarm system therefore are provided. A battery system includes an optical fiber wound around an outer circumferential portion of a battery. The battery system detects an abnormality of the battery on the basis of a loss of the laser beam caused by lateral pressure acting on the optical fiber. An alarm warns a user of the abnormality when the abnormality is detected.

A plurality of pads are formed on a circuit board body at a pitch of 0.5 mm or less. The pads are formed such that a projecting height H of a pad from the board body surface and a width W of the pad satisfy a relation 2H&lt;W, that a pad array is formed in which a width of each of the pads located at two ends of the pad array is larger than that of a pad located therebetween, and that the pad width W and a pad-to-pad distance D satisfy a relation W&gt;D. A solder layer, obtained by a substitution reaction between a powder of a metal having the highest ionization tendency among metals constituting the solder layer or a powder of an alloy thereof and a salt formed by bonding the other metal or metals in the solder layer to an organic acid, is formed on each pad.

Solder-coated printed circuit board and method of manufacturing the same

A ground conducting layer and an antenna element conducting layer are set at a predetermined position in a cavity of a molding die, and molten resin is injected into the cavity, thereby molding a resin-formed member in which said ground conducting layer and said antenna element conducting layer are integrated. As a result of this, there can provided an antenna module comprising a resin member formed by molding to be a predetermined shape, a sheet-like ground conducting layer adhered to one surface of the resin member, a sheet-like antenna element conducting layer adhered to another surface opposing to the one surface of said resin member, and a feeder for feeding electricity to the antenna element conducting layer.

P-type antenna module and method for manufacturing the same

A paste-like composition containing a lead salt of an organic acid and tin powder is applied on a pad array portion of a circuit board. Then, the paste-like compsition is heated so as to cause precipitation, thereby forming a solder layer formed of a Sn-Pb alloy substantially only on the pads. This precipitation is performed in a state that a liquid pool is formed on the pad array portion when the paste-like composition is liquefied by heating, and the tin powder is settled in the liquid pool. When an electronic part is mounted on the pads, first, preparatory solder layers are formed on the pads by the above-mentioned precipitation process. After a paste-like composition is applied on the preparatory solder layers, the electronic part is put on the paste-like composition. Then, the paste-like composition is heated, thereby soldering leads of the electronic part to the pads.

Method of forming a solder layer on pads of a circuit board and method

An electronic connector which has a plurality of contacts associated in one or more rows in a connector housing, a shape memory spring associated in the connector housing for driving the contacts, the shape memory spring transmitting a recovery force generated when the shape memory spring reaches its transformation temperature or higher to the contacts while recovering the shape stored when the shape memory spring reaches its transformation temperature or higher and returning to the shape before the shape memory recovery by the spring force of the contact when the shape memory spring reaches below its transformation temperature. Thus, the electronic connector can mount or dismount contacts at each other without inserting or removing force or substantially without inserting or removing force in a simple structure with less number of parts.

Zero insertion force connector actuated by a stored shape member

An electronic connector which has a plurality of contacts associated in one or more rows in a connector housing, a shape memory spring associated in the connector housing for driving the contacts, the shape memory spring having a beginning shape and transmitting a recovery force to the contacts generated when the shape memory spring reaches a transformation temperature or higher while recovering a stored shape when the shape memory spring reaches the transformation temperature or higher and returning to the beginning shape by the spring force of the contact when the shape memory spring reaches below its transformation temperature. Thus, the electronic connector can mount or dismount contacts to each other without an inserting or removing force or substantially without an inserting or removing force in a simple structure with a reduced number of parts.

Growing community of inventors

Hadano, Japan

Kenichi Fuse