Asahi Glass Company, Limited

Agc Inc.

Kenichi Ebata

Reo Usui

Kenji Tanaka

Yuriko Kaida

Yukihiro Tao

Koji Nakagawa

Satoru Takaki

Kenta Sekikawa

Hitoshi Tsujimura

Ryohei Satoh

Hiroshi Sakamoto

Kenji Yamada

Kazutaka Ono

Shin Tatematsu

Masaharu Tanaka

Kazuhiko Yamada

Jun Akiyama

Hajime Katayama

Toshiya Matsubara

Yasunori Ito

Yumiko Aoki

Takatoshi Yaoita

Kentarou Tsunozaki

Eiji Morinaga

Shin Asahi Glass Co Ltd Tatematsu

Hajime Asahi Glass Co Ltd Katayama

Toshiya Asahi Glass Co Ltd Matsubara

Kentarou Asahi Glass Co Ltd Tsunozaki

Kenji Asahi Glass Co Ltd Yamada

Kazuhiko Asahi Glass Co Ltd Yamada

A carrier substrate to be used, when manufacturing a member for an electronic device on a surface of a substrate, by being bonded to the substrate, includes at least a first glass substrate. The first glass substrate has a compaction described below of 80 ppm or less. Compaction is a shrinkage in a case of subjecting the first glass substrate to a temperature raising from a room temperature at 100&#xb0; C./hour and to a heat treatment at 600&#xb0; C. for 80 minutes, and then to a cooling to the room temperature at 100&#xb0; C./hour.

Carrier substrate, laminate, and method for manufacturing electronic device

A video projecting structure includes a substrate having a visible light transmittance greater than or equal to 5% and less than or equal to 90%, a reflectivity greater than or equal to 5% and less than or equal to 90%, and a front haze less than or equal to 30.

Video projecting structure, method for manufacturing video projecting structure, video projecting method, and automobile window

A video projecting structure includes a substrate having a visible light transmittance greater than or equal to 5% and less than or equal to 90%, a front haze greater than or equal to 4 and less than or equal to 40, and a rear haze greater than or equal to 0 and less than or equal to 60. In a case where light is incident on a surface of the substrate at an angle of 45&#xb0;, an intensity of a backward scattering light is lower than an intensity of a frontward scattering light.

Video projecting structure, video projecting method, and video projecting window

A method for manufacturing a circuit pattern-provided substrate including forming a resist layer on a substrate, forming an opening corresponding to a circuit pattern and having an eaves cross-sectional shape in the resist layer, forming a thin film layer having a portion formed on the substrate in the opening and a portion formed on the resist layer, and removing the resist layer such that the resist layer and the portion of the thin film layer formed on the resist layer are removed from the substrate. The forming of the opening comprises exposing the resist layer with a mask device which changes an exposure amount of the resist layer such that the eaves cross-sectional shape has a space at a boundary between the resist layer and the substrate.

Method for manufacturing circuit pattern-provided substrate

The present invention relates to a peeling device which peels off a reinforcing sheet stuck on a substrate, including: a supporting unit which supports one main surface of a laminate having the substrate and the reinforcing sheet; a plate-shaped flexible member to be attached to the other main surface of the laminate; a plurality of pads fixed to a surface of the flexible member lying opposite to the laminate side; a plurality of rods each of which is coupled to any one of the plurality of pads; a plurality of driving devices by which the plurality of rods are made to move, respectively, in their individual axial directions; and a control device by which a position of each of the plurality of rods is controlled on an individual basis, in which each of the plurality of pads is coupled to any one of the plurality of the rods via any one of a plurality of joints so that each pad is allowed to be pivotable centering on a vicinity of an intersection point of a centerline of the rod coupled thereto with a surface of the reinforcing sheet facing the substrate side or a surface of the substrate facing the reinforcing sheet side, and in which the one main surface of the laminate is supported by the supporting unit, and at the same time, the position of each of the plurality of rods is controlled by the control device so that the other main surface of the laminate is subjected to bending deformation in sequence from one-end side thereof.

Peeling device

A process for producing a glass substrate having a circuit pattern is disclosed. The process includes forming a thin film layer on a glass substrate and then irradiating the thin film layer with laser light to form a circuit pattern on the glass substrate; depositing a low-melting point glass having a softening point of fromto&#xb0; C. on the glass substrate having the circuit pattern formed thereon; and sintering the low-melting point glass to form a low-melting point glass layer which includes the low-melting point glass sintered on the glass substrate having the circuit pattern formed thereon and which forms a compatible layer between the glass substrate and the low-melting point glass layer.

Glass substrate having circuit pattern and process for producing the same

A process for producing inorganic spheres, which comprises injecting an aqueous liquid containing an inorganic compound through an inlet hole into an organic liquid which flows at a flow rate of from 0.001 to 2 m/s in a laminar flow state in a flow path to form a W/O type emulsion, and solidifying the aqueous liquid containing an inorganic compound in the W/O type emulsion.

Process for producing inorganic spheres

Growing community of inventors

Tokyo, Japan

Kenichi Ebata