Komatsu Corporation

Sumco Techxiv Corporation

Komatsu Ntc Ltd.

Kenichi Bandoh

Shigeo Morimoto

Junsuke Tomioka

Yutaka Shiraishi

Katsuo Saio

Akihiro Ohsawa

Mikio Minonishi

Takuji Okumura

Takeshi Kodama

Kazuhiko Kubota

Tetsu Nagata

Masaru Shimada

Mohammad Munzir

Akira Nakayama

A relative displacement specification unit specifies a relative displacement between a jig and a tool. A position determination unit determines whether the jig and the tool are respectively positioned at a jig calibration point and a tool calibration point. A displacement correction unit corrects the measurement values of the displacements of the jig and the tool. A contact determination unit determines whether the tool has come into contact with a workpiece based on a measurement value related to a deflection of the tool. A tool length correction unit corrects tool length data based on the relative displacement when the tool is determined to have come into contact with the workpiece. A control unit generates a control command for controlling the jig or tool based on the relative displacement, a shape of the workpiece, and tool length data indicating a length of the tool.

Control device, industrial machine, and control method

A machine tool includes a tool that machines a workpiece while being contact with the workpiece, a state-quantity-data acquisition unit that acquires state quantity data of the workpiece and of the tool, a state-quantity-estimation-data calculation unit that calculates state quantity estimation data from a simulation model including a device dynamic characteristic model indicating a dynamic characteristic of the tool and a workpiece model indicating a target shape of the workpiece, and a machining-state calculation unit that calculates machining state data indicating a machining state of the workpiece based on the state quantity data and the state quantity estimation data.

Machine tool, machined-object manufacturing method, and machining system

A stage for a substrate temperature control apparatus having high reliability at low cost by preventing thermal deformation of a plate while employing a material other than ceramics as a material of the plate. The stage is used for mounting a substrate in the substrate temperature control apparatus for controlling a temperature of the substrate, and the stage includes: a plate having a first surface facing the substrate and a second surface opposite to the first surface; and a planar heater bonded to the second surface of the plate, wherein surface treatment is performed in a first thickness on the first surface of the plate, and the surface treatment is performed in a second thickness thinner than the first thickness or no surface treatment is performed on a predetermined area of the second surface of the plate.

Stage for substrate temperature control apparatus

A temperature sensor () includes: a temperature-sensing portion for measuring a temperature of an object () by contacting the object; and a supporting portion for supporting the temperature-sensing portion from a side opposite to a contact surface, the supporting portion having a space at a portion partially corresponding to the temperature-sensing portion. A temperature controller includes: a temperature control device; the temperature sensor () for measuring the temperature by contacting the object (); and a controller for controlling the temperature control device. The controller includes: a mounting-state judging means for judging a mounting-state of the object (); a switching means for switching a control gain and a target temperature of the temperature control device based on the judging result; and a control-command generating means for generating a control command based on the control gain, the target temperature and a measurement value of the temperature sensor ().

Temperature sensor, temperature control device, temperature controller and temperature-control method

A device controls an object in a time variant system with a dead time such as a Czochralski method single crystal production device (CZ equipment). The dead time, time constant, and process gain value of an object (CZ equipment) are set. The process gain preset value has time variant characteristics. An output value and its first-order and second-order time differentiated values serve as the state variable. A nonlinear state predicting unit predicts a state variable value at a future time, based upon the current output value, dead time, time constant, and process gain preset value. A gain scheduled sliding mode control unit performs a gain scheduled sliding mode control operation based upon the state variable value at the future time, an output deviation at the future time, the time constant, and the set value of the process gain at the future time, to determine the manipulated variable of the object.

Control system and method for controlled object in time variant system with dead time, such as single crystal production device by czochralski method

Object of the present invention is to provide uniform heat distribution to a substrate undergoing heat treatment on top of a heat exchange plate. A heat exchange plate is a flat, circular receptacle, has a cooling liquid inflow opening on one end and outflow opening on the other end, and cooling liquid flows on the inside. The surface of the plate is divided, for example, into four zones having different heat capacities and heat transfer characteristics, and an independently controllable foil heater A, A, A, A is attached to each zone. Heater A covers a zone, which circumferentially surrounds a substrate placed on top of a plate, heater A covers a zone directly beneath a substrate, heater A covers a zone of the vicinity of the outflow opening , and heater A covers a zone of the vicinity of the inflow opening . Temperature sensors are disposed on the inside of a plate at four locations of a second zone, which are apt to receive the affects of the first to fourth zones. Based on each plate temperature detected by the temperature sensors to , a temperature of the substrate at a location corresponding thereto is estimated.

Growing community of inventors

Hiratsuka, Japan

Kenichi Bandoh