Sony Corporation

Nippon Mitsubishi Oil Corporation

Sony Semiconductor Solutions Corporation

E.i. Dupont De Nemours and Company

Sony Group Corporation

Joled Inc.

Nippon Oil Company

Nippon Oil Corporation

Kenichi Aoyagi

Nobutoshi Fujii

Yoshiya Hagimoto

Yoshihisa Kagawa

Takashi Kobayashi

Masaki Sakakibara

Daisuke Uchida

Seiji Yamada

Hayato Iwamoto

Shinichi Takemura

Toshiaki Hasegawa

Hiroshi Onoda

Ikue Mitsuhashi

Masanaga Fukasawa

Tokihisa Kaneguchi

Chris L Miller

Kensaku Maeda

Toshihiko Hayashi

Takashi Sakairi

Kiyotaka Tabuchi

Tomoyoshi Ichikawa

Kazunori Nagahata

Yoichi Otsuka

Yoshiyuki Enomoto

Tadayuki Kimura

Iwao Sugiura

Tetsufumi Ikeda

Hidetoshi Takagi

Akio Ohshima

Nobutatsu Araki

Tsuyoshi Jyouno

Katsunori Ootsubo

Yasuhiro Mizuma

Akio Ooshima

Provided is a display device in which more than one pixel is arranged in a two-dimensional matrix on a circuit board, the pixel including a light emission unit including a first electrode, an organic layer, and a second electrode that are stacked, in which the first electrode is disposed for each light emission unit, and a partition is formed between the first electrode and an adjacent first electrode, the organic layer and the second electrode are stacked on an entire surface including the first electrode and the partition, the first electrode is formed on an interlayer insulation film, and a reflection film is formed below the first electrode, the reflection film including a light reflecting surface disposed to be flush with a boundary plane on which different insulation materials are in contact with each other in the interlayer insulation film.

Display device, method for manufacturing display device, and electronic apparatus with interlayer insulation film

The present disclosure relates to a comparator, an AD converter, a solid-state imaging device, an electronic apparatus, and a comparator control method that can reduce power consumption while increasing the determination speed of the comparator. The comparator includes a comparison unit, a positive feedback circuit, and a current limiting unit. The comparison unit compares the voltage of an input signal and the voltage of a reference signal, and outputs a comparison result signal. The positive feedback circuit increases the transition speed at the time when the comparison result signal is inverted. The current limiting unit limits the current flowing in the comparison unit after the inversion of the comparison result signal. The present disclosure can be applied to comparators, for example.

Comparator, AD converter, solid-state imaging device, electronic apparatus, and method of controlling comparator

Comparator, ad converter, solid-state imaging device, electronic apparatus, and method of controlling comparator

Disclosed herein is a semiconductor device, including: a first substrate including a first electrode, and a first insulating film configured from a diffusion preventing material for the first electrode and covering a periphery of the first electrode, the first electrode and the first insulating film cooperating with each other to configure a bonding face; and a second substrate bonded to and provided on the first substrate and including a second electrode joined to the first electrode, and a second insulating film configured from a diffusion preventing material for the second electrode and covering a periphery of the second electrode, the second electrode and the second insulating film cooperating with each other to configure a bonding face to the first substrate.

Semiconductor device, fabrication method for a semiconductor device and electronic apparatus

A semiconductor device includes a first substrate having an attaching surface on which first electrodes and a first insulating film are exposed, an insulating thin film that covers the attaching surface of the first substrate, and a second substrate which has an attaching surface on which second electrodes and a second insulating film are exposed and is attached to the first substrate in a state in which the attaching surface of the second substrate and the attaching surface of the first substrate are attached together sandwiching the insulating thin film therebetween, and the first electrodes and the second electrodes deform and break a part of the insulating thin film so as to be directly electrically connected to each other.

Method for bonding and connecting substrates

A display unit is provided, on a substrate, with a first wiring layer and a device section. The device section has a plurality of pixels. The device section includes, in each of the pixels, a light-emitting device section and a drive device. The light-emitting device section includes a light-emitting device and a light-emitting surface. The drive device drives the light-emitting device section and is electrically coupled to the light-emitting device section through the first wiring layer. An end of the light-emitting surface of the light-emitting device section is disposed at a position as high as an upper end of the drive device, or at a position higher than the upper end.

Display unit

The present technology relates to a semiconductor device and a solid-state imaging device of which crack resistance can be improved in a simpler way. The semiconductor device has an upper substrate that is constituted by a Si substrate and wiring layers laminated on the Si substrate and a second substrate that is constituted by a Si substrate and wiring layers laminated on the Si substrate and is joined to the upper substrate. In addition, a pad for wire bonding or probing is formed in the upper substrate, and pads for protecting corner or side parts of the pad for wire bonding or probing are radially laminated and provided in each of the wiring layers between the pad and the Si substrate of the lower substrate. The present technology can be applied to a solid-state imaging device.

Semiconductor device and solid-state imaging device

An electronic component mounting substrateA is configured of an electronic component, and a mounting substratemounting the electronic componentthereon, in which concave partsare formed on a mounting surfaceof the electronic componentopposite to the mounting substrate, a connection partis exposed at the bottom of the concave part, and electronic component attachment partsprovided on the mounting substrateare soldered to the connection partsprovided in the electronic component

Electronic component, electronic component mounting substrate, and electronic component mounting method to facilitate positional alignment between the electronic component and the mounting substrate

Semiconductor device with multiple substrates electrically connected through an insulating film

There is provided a semiconductor device, including a semiconductor substrate, an interlayer insulating layer formed on the semiconductor substrate, a bonding electrode formed on a surface of the interlayer insulating layer, and a metal film which covers an entire surface of a bonding surface including the interlayer insulating layer and the bonding electrode.

Semiconductor device and electronic apparatus with metal-containing film layer at bonding surface thereof

Growing community of inventors

Kanagawa, Japan

Kenichi Aoyagi