Oki Electric Industry Co., Ltd.

Intellectual Ventures Fund 83 LLC

Intellectual Ventures Holding 81 LLC

Kenichi Anasako

Tomokazu Komazaki

Yoshiaki Fujita

Hisanori Ehara

A surface acoustic wave device comprises a piezoelectric substrate (), at least one inter-digital transducers (IDT) () provided on the piezoelectric substrate, at least one elongated electrode pad () electrically connected to the IDT, and at least one stud bump () disposed on the electrode pad such that an LC component of the surface acoustic wave device has a predetermined value.

Surface acoustic wave device and method of adjusting LC component of surface acoustic wave device

A surface acoustic wave filter includes an antenna terminal, a transmitting filter and a variable branching line both of which are coupled to the antenna terminal and a receiving filter coupled to the variable branching line. The transmitting filter has a first end series-arm SAW resonator, a second end series-arm SAW resonator, a middle series-arm SAW resonator coupled between the first and second end series-arm SAW resonators and parallel-arm SAW resonators. Each of the first and second end series-arm SAW resonator has a first resonance frequency. The middle series-arm SAW resonator has a second resonance frequency that is higher than the first resonance frequency.

Transmitting filter including SAW resonators

Acoustic wave branching filter having transmitting filter with optimal power handling

A surface acoustic wave (SAW) device comprises a piezoelectric substrate, at least one alloy layer made of aluminum (Al) and copper (Cu), at least one oxide layer, and at least one metal layer made of a metal other than Al, wherein the alloy layer, oxide layer, and metal layers are laminated one upon another.

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Tokyo, Japan

Kenichi Anasako