Arizona State University

University of Illinois

Other

Keng Hao Hsu

Placid M Ferreira

Nicholas X Fang

Anagh Deshpande

Xiuling Li

Bruno Azeredo

Winston Chern

Ik Su Chun

Kyle E Jacobs

Anil Kumar

Pu Han

Peter Lee Schultz

Ultrasonic filament modeling systems and methods may be utilized to achieve room-temperature 3-D printing of solid (>95%) metal materials. A vibrating tool is applied to a metal filament to form a voxel, inducing mechanical deformation as well as inter- and intra-layer mass transport. Desired structures may be built on a voxel-by-voxel basis. Additionally, by varying the applied ultrasonic energy, the microstructure of the resulting structure may be controlled.

Systems and methods for additive manufacturing utilizing localized ultrasound-enhanced material flow and fusioning

Exemplary systems and methods utilize laser heating to improve the surface finish, dimensional tolerance, and material strength of objects constructed via fused filament fabrication.

Laser surface healing systems and methods

An imprinting platform including a noble metal catalyst, a semiconductor substrate, and a pre-patterned polymer stamp, where the catalyst is attached to the stamp, and related methods and articles.

Electrochemical imprinting of micro- and nano-structures in porous silicon, silicon, and other semiconductors

Ultrasonic filament modeling systems and methods may be utilized to achieve room-temperature 3-D printing of solid (&#x3e;95%) metal materials. A vibrating tool is applied to a metal filament to form a voxel, inducing mechanical deformation as well as inter-and intra-layer mass transport. Desired structures may be built on a voxel-by-voxel basis. Additionally, by varying the applied ultrasonic energy, the microstructure of the resulting structure may be controlled.

Fused deposition modeling (FDM) systems and methods may be improved via laser pre-heating of the target substrate ahead of the extrusion nozzle. Higher interface temperatures lead to improved wetting, diffusion, and randomization, thus improving the bond between filaments and between layers, and reducing anisotropy in the resulting finished part.

Systems and methods for laser preheating in connection with fused deposition modeling

A new method for forming an array of high aspect ratio semiconductor nanostructures entails positioning a surface of a stamp comprising a solid electrolyte in opposition to a conductive film disposed on a semiconductor substrate. The surface of the stamp includes a pattern of relief features in contact with the conductive film so as to define a film-stamp interface. A flux of metal ions is generated across the film-stamp interface, and a pattern of recessed features complementary to the pattern of relief features is created in the conductive film. The recessed features extend through an entire thickness of the conductive film to expose the underlying semiconductor substrate and define a conductive pattern on the substrate. The stamp is removed, and material immediately below the conductive pattern is selectively removed from the substrate. Features are formed in the semiconductor substrate having a length-to-width aspect ratio of at least about 5:1.

Method of forming an array of high aspect ratio semiconductor nanostructures

Disclosed herein are electrochemical fabrication platforms for making structures, arrays of structures and functional devices having selected nanosized and/or microsized physical dimensions, shapes and spatial orientations. Methods, systems and system components use an electrochemical stamping tool such as solid state polymeric electrolytes for generating patterns of relief and/or recessed features exhibiting excellent reproducibility, pattern fidelity and resolution on surfaces of solid state ionic conductors and in metal. Electrochemical stamping tools are capable high throughput patterning of large substrate areas, are compatible with commercially attractive manufacturing pathways to access a range of functional systems and devices including nano- and micro-electromechanical systems, sensors, energy storage devices, metal masks for printing, interconnects, and integrated electronic circuits.

Growing community of inventors

Savoy, IL, United States of America

Keng Hao Hsu