Agilent Technologies, Inc.

Avago Technologies Fiber IP (singapore) Pte. Ltd

Other

Avago Technologies Fiber IP Pte Ltd.

Kendra J Gallup

James A Matthews

Brenton Arthur Baugh

Robert E Wilson

James Howard Williams

Martha A Johnson

Richard C Ruby

Tak Kui Wang

Brian H Kim

Frank Sigming Geefay

Tanya Jergeris Snyder

Ronald Shane Fazzio

Jim R Williams

Brent Baugh

Carrie Ann Guthrie

Tanya Jegeris Snyder

Edwin Loy

Frank J Flens

Christopher L Coleman

Robert H Yi

Janet L Yun

Andy Engel

A method for forming a lid for a wafer-scale package includes (1) forming a cavity in a substrate, (2) forming an oxide layer over the cavity and over a bond area around the cavity on the substrate, (3) forming a reflective layer over the oxide layer, (4) forming a barrier layer over the reflective layer, (5) etching a portion of the barrier layer down to a portion of the reflective layer over the bond area, and (6) forming a solder layer on the portion of the reflective layer. The reflective layer can be a titanium-platinum-gold metal stack and the barrier layer can be a titanium dioxide layer.

Lids for wafer-scale optoelectronic packages

An optoelectronic package or sub-assembly includes an edge-emitting laser and a reflector that directs a beam from the laser through a sub-mount. The sub-mount contains passive or active circuit elements that are electrically connected to the laser. The laser can be protected from the environment using either a cap in which the reflector is integrated or using an encapsulant encasing the laser. An alignment post that is sized to fit into a sleeve is mounted where the optical signal emerges from the sub-mount. Plugging the post into one end of the sleeve and inserting an optical fiber into the other end of the sleeve so that the optical fiber abuts the post will then align the optical fiber to receive the optical signal.

Optical device package with turning mirror and alignment post

In an embodiment, the invention provides a method for forming a wafer-level package. A bonding pad is formed on a first wafer. After forming the bonding pad, an optoelectronic device is located on the first wafer. A gasket is formed on a second wafer. After a gasket is formed on a second wafer, the second wafer is attached to the first wafer with a bond between the gasket and the bonding pad.

Wafer-level packaging of optoelectronic devices

An optoelectronic device includes a submount and a lid. The submount includes a substrate and a lens and a laser above the substrate. The lid defines a cavity having a surface coated with a reflective material to form a 45 degree mirror. The mirror reflects a light from the laser to the lens and the light exits the optoelectronic device through the submount.

Integrated optics and electronics

A package for a surface-emitting laser encloses the die between a sub-mount and a cap. The sub-mount and the cap can be formed using wafer processing techniques that permit a wafer level packaging process which attaches multiple die to a sub-mount wafer, attaches caps either separated or as part of a cap wafer to the sub-mount wafer, and cuts the structure to separate individual packages. The cap includes a transparent plate that can be processed to incorporate an optical element such as a lens. An alignment post attached to the cap indicates the position of an optical signal from the laser and fits snugly into one end of a sleeve while an optical fiber connector fits into the other end.

Surface emitting laser package having integrated optical element and alignment post

An optoelectronic assembly includes an optical lens element (OLE) coupled to a substrate. The substrate includes a transducer, a standing structure on the transducer, a transducer lens supported by the standing structure over the transducer, and alignment features. The OLE includes an OLE lens and co-alignment features that couple with the alignment features on the optoelectronic assembly. When the substrate is coupled to the OLE, the transducer lens is aligned with the OLE lens.

Optoelectronic assembly with coupling features for alignment

A module for coupling to a fiber-optic cable includes an optoelectronic assembly that includes a bracket and a metal receptacle. The metal receptacle includes an attachment member operable to releasably connect the receptacle to the bracket, an alignment end operable to receive an alignment device, and a connector end operable to releasably connect to the fiber-optic cable and to orient the cable with the alignment device. The metal receptacle can suppress EMI and can typically withstand higher temperatures than most plastic materials. Thus, when subject to high temperatures, the receptacle typically will not expel gas that can fog a lens or deform. The attachment member allows one to releasably connect the receptacle to an optoelectronic assembly without fixing the receptacle to the assembly with adhesive. Thus, the receptacle can be mounted to an optoelectronic assembly quickly and without an alignment fixture.

Fiber-optic connector for releasably coupling an optical fiber to an optoelectronic device and related method

A lid for a wafer-scale package includes a body having a bond area around a cavity defined by the body, an oxide layer atop the bond area and the cavity, and a reflective layer atop the oxide layer. The cavity has an angled sidewall where a portion of the reflective layer over the angled sidewall forms a mirror for reflecting a light. The lid further includes a solder layer atop another portion of the reflective layer over the bond area, and a barrier layer atop the mirror. The barrier layer is solder non-wettable so it prevents the solder layer from wicking into the cavity and interfering with the mirror. The barrier layer is also transparent to the light and has a thickness that either does not affect the light reflection or improves the light reflection.

A package for an optoelectronic device includes a hermetically sealed cavity into which a mirror or other optical element is integrated. For a side-emitting laser, an integrated mirror turns the light emitted from the laser inside the cavity so that the light exits through a top surface of the package. The packaging can be implemented for individual lasers or at the wafer level. A wafer level process fabricates sub-mounts in a first wafer, fabricates depressions with reflective areas in a second wafer, electrically connects optoelectronic devices to respective sub-mounts on the first wafer, and bonds a second wafer to the first wafer with the lasers hermetically sealed in cavities corresponding to the depressions in the second wafer. The reflective areas in the depressions act as turning mirrors for side emitting lasers.

Optoelectronic device packaging with hermetically sealed cavity and integrated optical element

An optoelectronic device is provided having an active alignment. The lens and the optoelectronic device are mounted on their respective carrying members, and the carrying members are placed proximate to each other in a loose alignment controlled by alignment pins loosely engaging oversized alignment opening. An alignment range is created by a difference in the diameter of the alignment pins and the alignment opening, allowing the lens and optoelectronic device to be moved with respect to each other and actively aligned. The member carrying the lens may also include a connector stop cooperatively arranged with the alignment pins to provide an aligned coupling between an optical fiber connector and the optoelectronic component.

Actively aligned optoelectronic device

A sub-assembly or package for a die in the receiving section of an optical transceiver includes a semiconductor sub-mount that is electrically connected to the die and a cap that is bonded to the sub-mount to hermetically seal the die in a cavity. The die can be flip-chip bonded to the sub-mount and can include a diffractive optical element fabricated on a back side of the die. Active circuitry such as an amplifier for an output signal from a photosensor on the die can be integrated into the sub-mount. For an OSA, a post can be attached to the package along a path of an optical signal to the photosensor. The post facilitates alignment of an optical fiber. A flexible or rigid circuit can be soldered to external terminals of the sub-mount.

Wafer-level packaging of optical receivers

A wafer-level package includes a first wafer comprising a bonding pad, an optoelectronic device on the first wafer, and a second wafer comprising a gasket. The second wafer is attached to the first wafer by a bond between the gasket and the bonding pad.

A sub-assembly or package for a die in the receiving section of an optical transceiver includes a semiconductor sub-mount that is electrically connected to the die and a cap that is bonded to the sub-mount to hermetically seal the die in a cavity. The die can be flip-chip bonded to the sub-mount and can include a diffractive optical element fabricated on a back side of the die. Active circuitry such as an amplifier for an output signal from a photosensor one the die can be integrated into the sub-mount. For an OSA, a post can be attached to the package along a path of an optical signal to the photosensor. The post facilitates alignment of an optical fiber. A flexible or rigid circuit can be soldered to external terminals of the sub-mount.

Growing community of inventors

Sunnyvale, CA, United States of America

Kendra J Gallup