Freescale Semiconductor,inc.

Nxp Usa, Inc.

Kendall Dewayne Phillips

Burton Jesse Carpenter

James W Miller

Meng Kong Lye

Tu-Anh N Tran

Mariano Layson Ching, Jr

Nhat Dinh Vo

Lidong Zhang

Quan Chen

Dae Y Hong

Embodiments of packaged semiconductor devices and lead frames for such devices are provided, such as a lead frame including: a row of lead fingers, wherein an outer end of each lead finger is connected to a leaded side of the lead frame; a package body perimeter that indicates placement of a package body of the packaged semiconductor device, wherein an inner end of each lead finger falls within the package body perimeter; a retention tab that protrudes from an interior edge of a non-leaded side of the lead frame, wherein the retention tab falls outside of the package body perimeter; and a non-conductive tie bar structure attached to the retention tab, wherein the non-conductive tie bar structure falls within the package body perimeter.

Hybrid lead frame for semiconductor die package with improved creepage distance

A pad () is electrically connected to a first I/O cell () while also physically overlying active circuitry of a second I/O cell (). Note that although the pad () overlies the second I/O cell (), the pad () is not electrically connected to the I/O cell (). Such a pattern may be replicated in any desired manner so that the I/O cells (e.g.-) may have a finer pitch than the corresponding pads (-and-). In addition, the size of the pads may be increased (e.g. padmay be bigger than pad) while the width 'c' of the I/O cells (-) does not have to be increased. Such a pattern (e.g.) may be arranged so that the area required in one or more dimensions may be minimized.

Integrated circuit having pads and input/output (I/O) cells

Growing community of inventors

Driftwood, TX, United States of America

Kendall Dewayne Phillips